Cypress Semiconductor Package Qualification Report QTP# 084703 VERSION 1.0 April 2009 48-Lead SSOP (300Mils) NiPdAu,MSL3, 260C Reflow CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Cypress Semiconductor Package: 48-Lead SSOP (300Mils) NiPdAu, MSL3, 260C Reflow Assembly: CML-R 084703 V.1.0 Page 2 of 8 April 2009 PRODUCT QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Date Comp. 060911 48/56-Lead SSOP (300 mils), (limited to devices without down bonds), NiPdAu, MSL3, 260C Reflow assembled at CML-R 063103 Qualify CML-R (Conventional) for 48/56-Lead SSOP, MSL3, 260C Solder Reflow Temperature (limited to devices without downbonds/ground bonds), using Kyocera G3000DA with PMC Dec 06 084703 Qualify SSOP48 300mils, NiPdAu, MSL3, 3260C Reflow using Krypton S8 Technology, QMI-509 Snap Cure D/A, KEG3000DA Mold Compound at CML-R Mar 09 Jun 06 Cypress Semiconductor Package: 48-Lead SSOP (300Mils) NiPdAu, MSL3, 260C Reflow Assembly: CML-R 084703 V.1.0 Page 3 of 8 April 2009 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: SP48 48-Lead Shrunk Small Outline Package (SSOP) Kyocera G3000DA V-O per UL 94 N/A Oxygen Rating Index: 50% Lead Frame Material: Copper Lead Finish: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: QMI Die Attach Material: QMI 509 Die Attach Method: Epoxy Bond Diagram Designation 001-15815 Wire Bond Method: Thermosonic Wire Material/Size: Au/ 0.8 mil Thermal Resistance Theta JA °C/W: 46°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 11-20048 Name/Location of Assembly (prime) facility: CML-R MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other packages availability. Cypress Semiconductor Package: 48-Lead SSOP (300Mils) NiPdAu, MSL3, 260C Reflow Assembly: CML-R 084703 V.1.0 Page 4 of 8 April 2009 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Pressure Cooker Test Condition (Temp/Bias) 121C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL3 Result P/F P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C High Accelerated Saturation Test (HAST) 130C, 3.3V, 5.25V 85%RH P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Acoustic Microscopy Cypress Spec. 25-00104 P Ball Shear Cypress Spec. 12-00292 P Bond Pull Cypress Spec. 12-00292 P Constructional Analysis Cypress Spec. 25-00035 P Dye Penetration Cypress Spec. 25-00046 P Internal Visual Cypress Spec. 12-00292 P Glue Adhesion Cypress Spec. 001-04301 P High Temperature Storage 150C, no bias P Thermal Shock Cypress Spec 25-00014 P X-ray MIL-STD-883-2012 P Cypress Semiconductor Package: 48-Lead SSOP (300Mils) NiPdAu, MSL3, 260C Reflow Assembly: CML-R 084703 V.1.0 Page 5 of 8 April 2009 Reliability Test Data QTP #: Device Fab Lot # 060911 Assy Lot # Assy Loc Duration Samp Rej STRESS: ACOUSTIC, MSL3 CY7C68300A (7C68003A) 4536902 610552119 CML-R COMP 15 0 CY7C64113A (7C64113A) 2510472 610537053 CML-R COMP 15 0 CY7C68001 (7C68001E) 4542977 610557579 CML-R COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.3V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY2220PVC (7C822000A) 2129123 610223392 CML-R 128 45 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY7C68300A (7C68003A) 4536902 610552119 CML-R 168 50 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C68300A (7C68003A) 4536902 610552119 CML-R 168 50 0 CY7C68300A (7C68003A) 4536902 610552119 CML-R 500 50 0 CY7C68300A (7C68003A) 4536902 610552119 CML-R 1000 50 0 CY7C64113A (7C64113A) 2510472 610537053 CML-R 300 50 0 CY7C64113A (7C64113A) 2510472 610537053 CML-R 500 50 0 CY7C64113A (7C64113A) 2510472 610537053 CML-R 1000 50 0 CY7C68001 (7C68001E) 4542977 610557579 CML-R 300 48 0 CY7C68001 (7C68001E) 4542977 610557579 CML-R 500 48 0 Failure Mechanism Cypress Semiconductor Package: 48-Lead SSOP (300Mils) NiPdAu, MSL3, 260C Reflow Assembly: CML-R 084703 V.1.0 Page 6 of 8 April 2009 Reliability Test Data QTP #: Device Fab Lot # 063103 Assy Lot # Assy Loc Duration Samp Rej STRESS: ACOUSTIC, MSL3 CY7C68001 (7C68001E) 4616985 610643460M1 CML-R COMP 15 0 CY7C68001 (7C68001E) 4616985 610643460M2 CML-R COMP 15 0 CY7C68001 (7C68001E) 4616985 610643460M3 CML-R COMP 15 0 4616985 610643460M1 CML-R COMP 5 0 CY7C68001 (7C68001E) 4616985 610643460M1 CML-R COMP 15 0 CY7C68001 (7C68001E) 4616985 610643460M2 CML-R COMP 15 0 CY7C68001 (7C68001E) 4616985 610643460M3 CML-R COMP 15 0 CY7C68001 (7C68001E) 4616985 610643460M1 CML-R COMP 15 0 CY7C68001 (7C68001E) 4616985 610643460M2 CML-R COMP 15 0 CY7C68001 (7C68001E) 4616985 610643460M3 CML-R COMP 15 0 CML-R 1000 50 0 STRESS: CONSTRUCTIONAL ANALYSIS CY7C68001 (7C68001E) STRESS: DYE PENETRATION STRESS: GLUE ADHESION STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias CY62256LL (7A62256E) 4512383 610545998 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY7C68001 (7C68001E) 4616985 610643460M1 CML-R 168 44 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C68001 (7C68001E) 4616985 610643460M1 CML-R 300 54 0 CY7C68001 (7C68001E) 4616985 610643460M1 CML-R 500 54 0 CY7C68001 (7C68001E) 4616985 610643460M1 CML-R 1000 54 0 CY7C68001 (7C68001E) 4616985 610643460M2 CML-R 300 45 0 CY7C68001 (7C68001E) 4616985 610643460M2 CML-R 500 45 0 CY7C68001 (7C68001E) 4616985 610643460M2 CML-R 1000 45 0 CY7C68001 (7C68001E) 4616985 610643460M3 CML-R 300 44 0 CY7C68001 (7C68001E) 4616985 610643460M3 CML-R 500 44 0 CY7C68001 (7C68001E) 4616985 610643460M3 CML-R 1000 44 0 4616985 610643460M1 CML-R COMP 15 0 STRESS: X-RAY CY7C68001 (7C68001E) Failure Mechanism Cypress Semiconductor Package: 48-Lead SSOP (300Mils) NiPdAu, MSL3, 260C Reflow Assembly: CML-R 084703 V.1.0 Page 7 of 8 April 2009 Reliability Test Data QTP #: Device 084703 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C20566 (8C20566AC) 4815537 610835437 CML-R COMP 15 0 CY8CTMG200 (8C20566AC) 4835945 610851639 CML-R COMP 15 0 CY8C20546 (8C20546AC) 4835945 610851640 CML-R COMP 15 0 4815537 610835437 CML-R COMP 10 0 4815537 610835437 CML-R COMP 10 0 610835437 CML-R COMP 5 0 STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY8C20566 (8C20566AC) STRESS: BOND PULL CY8C20566 (8C20566AC) STRESS: CONSTRUCTIONAL ANALYSIS CY8C20566 (8C20566AC) 4815537 STRESS: DYE PENETRANT TEST CY8C20566 (8C20566AC) 4815537 610835437 CML-R COMP 15 0 CY8CTMG200 (8C20566AC) 4835945 610851639 CML-R COMP 15 0 CY8C20546 (8C20546AC) 4835945 610851640 CML-R COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 128 77 0 STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 76 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 1000 75 0 CY8C20546 (8C20546AC) 4835945 610851640 CML-R COMP 5 0 CY8C20546 (8C20546AC) 4835945 610902076 CML-R COMP 5 0 CY8C20546 (8C20546AC) 4835945 610902078 CML-R COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8CTMG200 (8C20566AC) 4835945 610851639 CML-R 168 77 0 CY8C20546 (8C20546AC) 4835945 610851640 CML-R 168 77 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 1000 77 0 CY8CTMG200 (8C20566AC) 4835945 610851639 CML-R 500 77 0 CY8CTMG200 (8C20566AC) 4835945 610851639 CML-R 1000 77 0 CY8C20546 (8C20546AC) 4835945 610851640 CML-R 500 77 0 CY8C20546 (8C20546AC) 4835945 610851640 CML-R 1000 77 0 Failure Mechanism Cypress Semiconductor Package: 48-Lead SSOP (300Mils) NiPdAu, MSL3, 260C Reflow Assembly: CML-R 084703 V.1.0 Page 8 of 8 April 2009 Reliability Test Data QTP #: Device 084703 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej 4815537 610835437 CML-R 200 77 0 4815537 610835437 CML-R COMP 15 0 STRESS: THERMAL SHOCK CY8C20566 (8C20566AC) STRESS: X-RAY CY8C20566 (8C20566AC) Failure Mechanism