Document No.001-75444 Rev. *C ECN # 4325213 Cypress Semiconductor Package Qualification Report QTP# 114403 VERSION *C March 2014 48 QFN(6x6x0.6mm) NiPdAu, Cu-Pd Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Lorena R. Zapanta (ILZ) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro(RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.001-75444 Rev. *C ECN # 4325213 PACKAGE QUALIFICATION HISTORY QTP Number 114403 Description of Qualification Purpose Qualification of Copper (Cu-Pd) wire bond on 48 QFN(6x6x0.6mm) package dimensions at ASE , Kaohsiung Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Date Jan 2012 Document No.001-75444 Rev. *C ECN # 4325213 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ48A Package Outline, Type, or Name: 48 Quad Flat No-Lead (6X6X0.6mm) Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-69159 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Cu- Pd Thermal Resistance Theta JA C/W: 18.69°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-70516 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 9 Document No.001-75444 Rev. *C ECN # 4325213 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F JEDEC STD 22-A110, 130 C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias P P Ball Shear J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-B116A, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Pressure Cooker Test Temperature Cycle High Temp Storage Acoustic Microscopy P P P P Internal Visual Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101B P Physical Dimension MIL-STD-1835, JESD22-B100 P Constructional Analysis Dye Penetrant Test MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and P P P P Thermal Shock JESD22-A106B, Condition C, -55 C to 125C X-Ray MIL-STD-883 - 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 - 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 9 Document No.001-75444 Rev. *C ECN # 4325213 Reliability Test Data QTP #: 114403 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 15 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 15 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 15 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 15 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 15 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 15 0 STRESS: ELECTRICAL CHARACTERIZATION CY8C20466A(8C2046625AK) 5104069 611128980 G-TAIWAN COMP 30 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN COMP 30 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 128 80 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 192 40 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 128 80 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 192 40 0 CY8CTMA301E(8C20313DC) 4102579 611121438 G-TAIWAN 128 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 9 Document No.001-75444 Rev. *C ECN # 4325213 Reliability Test Data QTP #: 114403 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE, 150C CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 1000 210 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 1500 200 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 2000 200 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 2500 200 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 3000 200 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 1000 210 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 1500 210 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 2000 210 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 2500 210 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 3000 200 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 1000 220 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 1500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 2000 220 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 2500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 3000 220 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 168 100 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 168 100 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 168 100 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.001-75444 Rev. *C ECN # 4325213 Reliability Test Data QTP #: 114403 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 5 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 5 0 611144946 G-TAIWAN COMP 1 0 611144946 G-TAIWAN COMP 1 0 STRESS: POST MSL3 BALL SHEAR CY8CTMA300E(8C20323EK) 5050023 STRESS: POST MSL3 BOND SHEAR CY8CTMA300E(8C20323EK) 5050023 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 1 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 1 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 1 0 G-TAIWAN COMP 5 0 G-TAIWAN COMP 5 0 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY8CTMA300E(8C20323EK) 5050023 611144946 STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8CTMA300E(8C20323EK) 5050023 611144946 STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 5 0 611144946 G-TAIWAN COMP 5 0 G-TAIWAN COMP 5 0 G-TAIWAN COMP 5 0 STRESS: POST TC BALL SHEAR CY8CTMA300E(8C20323EK) 5050023 STRESS: POST HI-ACCEL SATURATION TEST BOND SHEAR CY8CTMA300E(8C20323EK) 5050023 611144946 STRESS: POST HIGH TEMP STORAGE BOND SHEAR CY8CTMA300E(8C20323EK) 5050023 611144946 STRESS: POST PRESSURE COOKER TEST BOND SHEAR TEST CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 5 0 611144946 G-TAIWAN COMP 5 0 STRESS: POST TC BOND SHEAR CY8CTMA300E(8C20323EK) 5050023 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.001-75444 Rev. *C ECN # 4325213 Reliability Test Data QTP #: 114403 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 1000 208 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 1500 198 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN 2000 198 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN 1000 209 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 500 220 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 1000 210 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 1500 200 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN 2000 200 0 5050023 611144946 G-TAIWAN 200 100 0 CY8CTMA300E(8C20323EK) 5050023 611144946 G-TAIWAN COMP 15 0 CY8CTMA300E(8C20323EK) 5050023 611144728 G-TAIWAN COMP 15 0 CY8CTMA300E(8C20323EK) 5050023 611144726 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK CY8CTMA300E(8C20323EK) STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.001-75444 Rev. *C ECN # 4325213 Document History Page Document Title: TAIWAN Document Number: Rev. ECN No. ** 3480968 *A 3580472 QTP 114403: 48QFN (6X6X0.6MM) NIPDAU, CU-PD Wire, MSL3 260C REFLOW ASEK001-75444 Orig. of Change ILZ NSR *B 4262767 HSTO *C 4325213 ILZ Description of Change Initial spec release Added extended readpoints 1000 Cycle TCT, 192H HAST and 1500H HTS. Removed QTP Version 1.0 in the title page Added the reference Industry Standards (JEDEC and MIL) in the stress test conditions table. Sunset Review Removed the reference Cypress specs in the reliability test performed table and retain it with the reference industry standards. Updated front page to reflect new qual report template per Spec 001-57716 Page 3 - Major package information table – Changed assembly process flow from 001-70516M to 001-70516 Added extended readpoints for the following stress: >1500/2000 cycles TCT >2000/2500/3000Hrs HTS Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9