388 HSBGA (35 X 35MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

388 - HSBGA (35 X 35 mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BT
6326.1339 mg
Body Size (mil/mm)
Package Weight – Site 2
35 X 35 mm
N/A
SUMMARY
The 388 – HSBGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 050703 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BT388ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-06939 Rev. *F
Page 1 of 4
388 - HSBGA (35 X 35 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
CAS
Number
Weight by
mg
% Weight of
substance per
Homogeneous
Material
SiO2
60676-86-0
170.1480
10.4900%
26,896
2.6896%
Acrylic
Trade Secret
149.2242
9.2000%
23,589
2.3589%
29690-82-2,
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
Trade Secret
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
99.5909
242.9759
290.6627
637.9333
22.5458
7.9478
0.9732
603.7797
25.2892
3.1612
11.3296
0.7693
0.7693
6.1400%
14.9800%
17.9200%
39.3300%
1.3900%
0.4900%
0.0600%
95.5000%
4.0000%
0.5000%
77.0200%
5.2300%
15,743
38,408
45,946
100,841
3,564
1,256
154
95,442
3,998
500
1,791
122
1.5743%
3.8408%
4.5946%
10.0841%
0.3564%
0.1256%
0.0154%
9.5442%
0.3998%
0.0500%
0.1791%
0.0122%
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
7440-50-8
7440-02-0
7440-47-3
1.8417
124.7700
9.3491
0.0009
1780.8000
95.4000
95.4000
95.4000
42.4000
10.6000
1792.2537
10.0972
0.7212
5.2300%
12.5200%
100.0000%
99.9900%
0.0100%
84.0000%
4.5000%
4.5000%
4.5000%
2.0000%
0.5000%
99.4000%
0.5600%
0.0400%
122
291
19,723
1,478
0
281,499
15,080
15,080
15,080
6,702
1,676
283,309
1,596
114
0.0122%
0.0291%
1.9723%
0.1478%
0.0000%
28.1499%
1.5080%
1.5080%
1.5080%
0.6702%
0.1676%
28.3309%
0.1596%
0.0114%
Purpose of
Use
Substance
Composition
Epoxy
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Heatslug
Heat
dissipation
Bisphenol
Triazol
Cu
Ni
Au
Br
Sn
Ag
Cu
Silver
Epoxy Resin
Functionalized
Ester
Diester
Si
Au
Ion Impurities
Silica (fused)
Epoxy resinA
Epoxy resinB
Phenolic resin
Metal Hydroxide
Carbon Black
Copper
Nickel
Chromium
Package Weight (mg): 6326.1339
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-06939 Rev. *F
Page 2 of 4
%Weight of
Substance
per
package
100.0000
388 - HSBGA (35 X 35 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier
bag
Protective Band
Shipping and
Inner Box
Dessicant
Bubble Pack
Lead
PPM
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 10.0
< 2.0
< 4.0
< 10.0
< 2.0
< 2.0
< 2.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
PBB
PPM
PBDE
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
<5.0
--------<5.0
<5.0
<5.0
<5.0
<5.0
--------<5.0
<5.0
< 2.0
< 4.0
< 2.0
< 5.0
<5.0
---------
<5.0
-----------
CoA-PROB-R
CoA-ABOX-R
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-06939 Rev. *F
Page 3 of 4
388 - HSBGA (35 X 35 mm)
Pb-Free Package
Document History Page
Document Title:
DATASHEET
Document Number:
Rev.
**
*A
388 - HSBGA (35 X 35MM) PB-FREE PACKAGE MATERIAL DECLARATION
001-06939
ECN No. Orig. of
Change
428920
EBZ
2900801 MAHA
*B
*C
DCON
3196143 MAHA
3609953 HLR
*D
4075211 YUM
*E
*F
4791987 HLR
5310673 HLR
AVE
Description of Change
Initial Release.
Updated Cypress logo. Changed the font color of the
header to black.
Revised the following for assembly site 1:
1. Rounded off the package weight on page 1 to a
whole number.
2. Corrected the CAS number of gold for the bonding
wire. Rounded off the package weight on Table B to
a whole number.
3. Rounded off the weight of substances in Table B to
2 decimal places.
4. Added % Weight of substance per Homogeneous
Material.
5. Recalculated PPM and %Weight of Substance per
package.
Revised Table II. DECLARATION OF PACKAGING
INDIRECT MATERIALS.
Changed CML to WEB in distribution list.
Added the CAS number of Silicon.
Updated Assembly Site 1 to reflect 4 decimal places on
values of material composition table.
Removed Tube material on Indirect Material Table.
Added assembly site name in the assembly heading.
Changed assembly code to assembly site name.
Sunset Due – No Change.
Changed Cypress Logo.
Changed Proprietary CAS Number to Trade Secret.
Removed distribution and posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-06939 Rev. *F
Page 4 of 4
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