48L- TSOP I Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 ZT / TS B1: 555.9101 mg B2: 549.3801 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 3 B1: 541.9103 mg B2: 578.3256 mg B3: 597.4989 mg B1: 529.0000 mg Package Weight – Site 4 Package Weight – Site 5 12 x 18.4 mm B1: 568.0003 mg B2: 569.3907 mg B3: 502.9450 mg B1: 524.1204mg SUMMARY The 48L-TSOP I package is qualified at two assembly sites. Packages from different assembly sites are likely to have different materials composition. Cypress ordering part numbers containing an “X” (e.g. CY7C1328G133AXI, CY2308SXC-1HT) meet the Directive of 2002/95/ EC (Rohs) requirement. ASSEMBLY Site 1: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report #s 043102, 122502 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) Material analysis report As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 1 of 22 48L- TSOP I Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: USING GOLD WIRE Material Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Ni Si Mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 119.2229 3.9782 0.8951 0.2238 % weight of substance per Homogenous material 95.9000% 3.2000% 0.7200% 0.1800% Sn 7440-31-5 5.3000 100.0000% 9,534 0.9534% Ag Epoxy Resin Metal Si Au Epoxy Resin Phenol Resin Aromatic Phosphate SiO2 Carbon Black 7440-22-4 --------------------------------------7440-21-3 7440-57-5 85954-11-6 26834-02-6 139189-30-3 0.6560 0.1230 0.0410 13.4300 5.3500 18.3011 16.2676 5.2870 80.0000% 15.0000% 5.0000% 100.0000% 100.0000% 4.5000% 4.0000% 1.3000% 1,180 221 74 24,159 9,624 32,921 29,263 9,510 0.1180% 0.0221% 0.0074% 2.4159% 0.9624% 3.2921% 2.9263% 0.9510% 366.0210 0.8134 90.0000% 0.2000% 658,418 1,463 65.8418% 0.1463% Substance Composition CAS Number 60676-86-0 1333-86-4 Package Weight (mg): Weight by mg 555.9101 PPM % weight of substance per package 214,464 7,156 1,610 403 21.4464% 0.7156% 0.1610% 0.0403% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 2 of 22 48L- TSOP I Pb-Free Package B2: USING PALLADIUM-COATED COPPER WIRE Material Leadframe Leadfinish Die Attach Purpose of Use Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu Ni Si Mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 154.4917 5.2426 1.1878 0.2867 % weight of substance per Homogenous material 94.3000% 3.2000% 0.7250% 0.1750% Ag 7440-22-4 2.6213 1.6000% 281,211 9,543 2,162 522 4,771 Sn 7440-31-5 3.2500 100.0000% 5,916 0.5916% Trade Secret 0.2413 12.5000% 439 0.0439% Trade Secret 0.2413 12.5000% 439 0.0439% 7631-86-9 0.6755 35.0000% 1,230 0.1230% Trade Secret 0.7720 40.0000% 1,405 0.1405% 7440-21-3 7440-50-8 7440-05-3 Trade Secret 76.4600 0.4166 0.0133 12.1392 100.0000% 96.8900% 3.1100% 4.0000% 139,175 758 24 22,096 13.9175% 0.0758% 0.0024% 2.2096% 3.5000% 19,334 1.9334% 22,096 1,105 482,249 5,524 2.2096% 0.1105% 48.2249% 0.5524% Solid Epoxy resin Phenol Resin Amorphous Silica Synthetic Rubber Si Cu Pd Epoxy Resin Phenol Resin(1) Phenol Resin(2) Carbon black Silica Others Trade Secret Weight by mg 10.6218 Trade Secret 12.1392 4.0000% 1333-86-4 60676-86-0 Trade Secret 0.6070 264.9380 3.0348 0.2000% 87.3000% 1.0000% Package Weight (mg): 549.3801 PPM % Total: % weight of substance per package 28.1211% 0.9543% 0.2162% 0.0522% 0.4771% 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 3 of 22 48L- TSOP I Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-T CoA-SBAG –R CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 4 of 22 48L- TSOP I Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 042902, 120202, 131008, 141401 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZT48ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 5 of 22 48L- TSOP I Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: USING GOLD WIRE Material Leadframe Base Material Leadfinish External Plating Die Attach Cu Ni Si Mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 102.4668 3.1780 0.6826 0.1679 % weight of substance per Homogenous material 91.5700% 2.8400% 0.6100% 0.1500% Ag Pure Sn 7440-22-4 7440-31-5 5.4048 4.0900 4.8300% 100.0000% 9,515 7,201 0.9515% 0.7201% Ag Epoxy Resin Copper GammaButyrolactone Aromatichydrocarbons Si Au Epoxy Resin Phenol Resin Aromatic Phosphate SiO2 Others 7440-22-4 ------------------7440-50-8 96-48-0 2.5002 0.6802 0.1099 0.1099 71.2300% 19.3800% 3.1300% 3.1300% 4,402 1,198 193.420775 193.420775 0.4402% 0.1198% 0.0193% 0.0193% ------------------- 0.1099 3.1300% 193.420775 0.0193% 7440-21-3 7440-57-5 85954-11-6 26834-02-6 139189-30-3 15.1700 2.1000 21.5615 17.2492 6.4685 100.0000% 100.0000% 5.0000% 4.0000% 1.5000% 26,708 3,697 37,960 30,368 11,388 2.6708% 0.3697% 3.7960% 3.0368% 1.1388% 60676-86-0 ----------------- 381.6386 4.3123 88.5000% 1.0000% 671,899 7,592 67.1899% 0.7592% Purpose of Use Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Package Weight (mg): Weight by mg 568.0003 180,399 5,595 1,202 295.510563 % weight of substance per package 18.0399% 0.5595% 0.1202% 0.0296% PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 6 of 22 48L- TSOP I Pb-Free Package B2: USING COPPER WIRE Material Leadframe Base Material Leadfinish External Plating Die Attach Cu Ni Si Mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 102.4700 3.1800 0.6800 0.1700 % weight of substance per Homogenous material 91.5729% 2.8418% 0.6077% 0.1519% Ag Pure Sn 7440-22-4 7440-31-5 5.4000 4.0900 4.8257% 100.0000% 9,484 7,183 0.9484% 0.7183% Ag Epoxy Resin A Epoxy Resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Epoxy Resin A Epoxy,Cresol Novolac Phenol Resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 1.4672 0.0793 0.1190 0.0793 0.1190 0.0991 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 5.0000% 2,577 139 209 139 209 174 0.2577% 0.0139% 0.0209% 0.0139% 0.0209% 0.0174% 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 29690-82-2 0.0099 0.0099 15.1700 0.9800 21.7634 21.7634 0.5000% 0.5000% 100.0000% 100.0000% 5.0000% 5.0000% 17 17 26,643 1,721 38,222 38,222 0.0017% 0.0017% 2.6643% 0.1721% 3.8222% 3.8222% Trade Secret Trade Secret 1333-86-4 60676-86-0 76361-86-9 14808-60-7 21.7634 21.7634 1.3058 302.0760 43.5268 1.3058 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 38,222 38,222 2,293 530,527 76,445 2,293 3.8222% 3.8222% 0.2293% 53.0527% 7.6445% 0.2293% % Total: 100.0000 Purpose of Use Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Package Weight (mg): Weight by mg 569.3907 PPM % weight of substance per package 179,964 5,585 1,194 299 17.9964% 0.5585% 0.1194% 0.0299% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 7 of 22 48L- TSOP I Pb-Free Package B3. USING PALLADIUM-COATED COPPER WIRE Material Leadframe Lead Finish Die Attach Die Wire Mold Compound Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Encapsulation Substance Composition CAS Number Weight by mg % Weight of substance per Homogenous Material % Weight of substance per package PPM Copper 7440-50-8 151.4110 91.5700% 301,049 30.1049% Nickel 7440-02-0 4.6959 2.8400% 9,337 0.9337% Silicon 7440-21-3 1.0086 0.6100% 2,005 0.2005% Magnesium 7439-95-4 0.2480 0.1500% 493 0.0493% Silver 7440-22-4 7.9864 4.8300% 15,879 1.5879% Tin 7440-31-5 3.4850 100.0000% 6,929 0.6929% Silver 7440-22-4 4.7286 74.0000% 9,402 0.9402% Epoxy Resin A 9003-36-5 0.2556 4.0000% 508 0.0508% Epoxy Resin B Trade Secret 0.3834 6.0000% 762 0.0762% Diluent A Trade Secret 0.2556 4.0000% 508 0.0508% Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Silicon Trade Secret 0.3834 6.0000% 762 0.0762% Trade Secret 0.3195 5.0000% 635 0.0635% 461-58-5 0.0320 0.5000% 64 0.0064% Trade Secret 0.0320 0.5000% 64 0.0064% 7440-21-3 18.3000 100.0000% 36,386 3.6386% Copper 7440-50-8 3.0194 99.9800% 6,003 0.6003% Palladium 5/3/7440 0.0006 0.0200% 1 0.0001% Epoxy Resin A Trade secret 12.2560 4.0000% 24,369 2.4369% Epoxy Resin B Trade secret 3.6768 1.2000% 7,311 0.7311% Phenol Resin Trade secret 12.2560 4.0000% 24,369 2.4369% Carbon Black 1333-86-4 1.5320 0.5000% 3,046 0.3046% Silica fused 60676-86-0 245.1200 80.0000% 487,369 48.7369% Silica fused Silica, crystalline 7631-86-9 30.6400 10.0000% 60,921 6.0921% 14808-60-7 0.9192 0.3000% 1,828 0.1828% Package Weight (mg): 502.9450 % Total: 100.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 8 of 22 48L- TSOP I Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-T CoA-SBAG –R CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 9 of 22 48L- TSOP I Pb-Free Package ASSEMBLY Site 3: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report #s 071906, 092605, 120406 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZT48OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 10 of 22 48L- TSOP I Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. Using Au wire and NiPdAu Lead Finish Material Purpose of Use Substance Composition Copper Silicon Magnesium Leadframe Base Material Leadfinish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Polyimide NBR Bismaleimide Phenol resin Nickel Palladium Gold Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy Resin Acrylate Peroxide Additive Silver Si Au Epoxy resin Phenol resin Aromatic Phosphate Carbon black Silica 117.6436 0.8921 0.2141 % weight of substance per Homogenous material 98.9100% 0.7500% 0.1800% 217,091 1,646 395 % weight of substance per package 21.7091% 0.1646% 0.0395% Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-02-0 7440-05-3 7440-57-5 Trade secret Trade secret 0.1189 0.0238 0.0238 0.0238 5.0696 0.1002 0.0202 0.1437 0.0930 0.1000% 0.0200% 0.0200% 0.0200% 97.6800% 1.9300% 0.3900% 8.5000% 5.5000% 219 44 44 44 9,355 185 37 265 172 0.0219% 0.0044% 0.0044% 0.0044% 0.9355% 0.0185% 0.0037% 0.0265% 0.0172% Trade secret 0.0169 1.0000% 31 0.0031% Trade secret Trade secret Trade secret Trade secret 7440-22-4 7440-21-3 7440-57-5 Trade secret Trade secret Trade secret 0.0338 0.0676 0.0085 0.0254 1.3013 19.8800 1.1100 17.7795 15.8040 5.1363 2.0000% 4.0000% 0.5000% 1.5000% 77.0000% 100.0000% 100.0000% 4.5000% 4.0000% 1.3000% 62 125 16 47 2,401 36,685 2,048 32,809 29,164 9,478 0.0062% 0.0125% 0.0016% 0.0047% 0.2401% 3.6685% 0.2048% 3.2809% 2.9164% 0.9478% 1333-86-4 60676-86-0 0.7902 355.5900 0.2000% 90.0000% 1,458 656,179 0.1458% 65.6179% CAS Number 7440-50-8 7440-21-3 7439-95-4 Package Weight (mg): Weight by mg 541.9103 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 11 of 22 48L- TSOP I Pb-Free Package B2. Using Cu Wire and NiPdAu Lead Finish Material Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Fe Si Mn Zn Mg Ni Pd Au Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline 7440-50-8 7439-89-6 7440-21-3 7439-96-5 7440-66-6 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 114.9989 0.1220 0.8844 % weight of substance per Homogenous material 98.3824% 0.1044% 0.7566% 0.0610 0.6099 0.2135 4.9845 0.0976 0.0171 0.7664 0.0414 0.0621 0.0414 0.0621 0.0518 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 29690-82-2 Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 CAS Number Package Weight (mg): 198,848 211 1,529 % weight of substance per package 19.8848% 0.0211% 0.1529% 0.0522% 0.5218% 0.1826% 97.7512% 1.9139% 0.3349% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 5.0000% 105 1,055 369 8,619 169 30 1,325 72 107 72 107 90 0.0105% 0.1055% 0.0369% 0.8619% 0.0169% 0.0030% 0.1325% 0.0072% 0.0107% 0.0072% 0.0107% 0.0090% 0.0052 0.0052 17.6200 0.4970 21.8592 21.8592 0.5000% 0.5000% 100.0000% 100.0000% 5.0000% 5.0000% 9 9 30,467 859 37,797 37,797 0.0009% 0.0009% 3.0467% 0.0859% 3.7797% 3.7797% 21.8592 21.8592 1.3116 303.4057 43.7184 1.3116 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 37,797 37,797 2,268 524,629 75,595 2,268 3.7797% 3.7797% 0.2268% 52.4629% 7.5595% 0.2268% Weight by mg 578.3256 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 12 of 22 48L- TSOP I Pb-Free Package B3. Using Cu Wire and Pure Sn Lead Finish Material Purpose of Use Substance Composition 7440-50-8 7439-89-6 7440-21-3 7439-96-5 7440-02-0 7440-66-6 7439-95-4 7440-22-4 113.8499 0.1220 0.8844 0.0610 4.9845 0.6099 0.2135 1.2637 % weight of substance per Homogenous material 93.3281% 0.1000% 0.7250% 0.0500% 4.0860% 0.5000% 0.1750% 1.0359% 4.1018 100.0000% 6,865 0.6865% CAS Number Weight by mg PPM % weight of substance per package Leadframe Base Material Cu Fe Si Mn Ni Zn Mg Ag Leadfinish External Plating Sn 7440-31-5 Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Hardener Dicyandiamide Organic peroxide Si Cu Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 1.4672 0.0793 0.1190 0.0793 0.1190 0.0991 0.0099 0.0099 33.8773 0.2802 21.7634 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% 5.0000% 0.5000% 0.5000% 100.0000% 100.0000% 5.0000% 2,456 133 199 133 199 166 17 17 56,699 469 36,424 0.2456% 0.0133% 0.0199% 0.0133% 0.0199% 0.0166% 0.0017% 0.0017% 5.6699% 0.0469% 3.6424% 29690-82-2 21.7634 5.0000% 36,424 3.6424% 21.7634 21.7634 1.3058 302.0760 43.5268 1.3058 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 36,424 36,424 2,185 505,568 72,848 2,185 3.6424% 3.6424% 0.2185% 50.5568% 7.2848% 0.2185% Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Trade Secret Trade Secret 1333-86-4 60676-86-0 76361-86-9 14808-60-7 Package Weight (mg): 597.4989 190,544 204 1,480 102 8,342 1,021 357 2,115 19.0544% 0.0204% 0.1480% 0.0102% 0.8342% 0.1021% 0.0357% 0.2115% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 13 of 22 48L- TSOP I Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-T CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 14 of 22 48L- TSOP I Pb-Free Package ASSEMBLY Site 4: Cypress Bangkok (SB) Package Qualification Report # 152916, 153705 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) COA-ZT48-SB As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 15 of 22 48L- TSOP I Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. Using Cu wire and Pure Sn Lead Finish Material CAS Number Weight by mg 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 91.0133 2.2415 0.0934 0.0467 0.1350 17.3577 0.4275 0.0178 0.0089 0.0257 173,577 4,275 178 89 257 17.3577% 0.4275% 0.0178% 0.0089% 0.0257% Tin Organic filler Silica Epoxy Resin A Epoxy Resin B Diluent Phenolic Hardener Adhesion promoter Silicon Copper Epoxy Resin Phenol Resin Carbon Black 7440-31-5 Trade Secret Trade Secret 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade Secret Trade Secret 1333-86-4 0.7141 0.0200 0.0080 0.0150 0.0150 0.0241 0.0150 0.0030 2.1398 0.1114 6.3277 2.3729 0.4746 7,141 200 80 150 150 241 150 30 21,398 1,114 63,277 23,729 4,746 0.7141% 0.0200% 0.0080% 0.0150% 0.0150% 0.0241% 0.0150% 0.0030% 2.1398% 0.1114% 6.3277% 2.3729% 0.4746% Silica (Amorphous) Phosphoric Catalyst 60676-86-0 Trade Secret 3.7444 0.1051 0.0421 0.0788 0.0788 0.1262 0.0788 0.0158 11.0000 0.5844 33.1789 12.4421 2.4884 362.479 3 4.1474 69.1305 0.7910 691,305 7,910 69.1305% 0.7910% Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation PPM % weight of substance per package % weight of substance per Homogenous material Substance Composition Copper Iron Zinc Phosphorus Silver Package Weight (mg): 524.1204 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 16 of 22 48L- TSOP I Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-T CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 17 of 22 48L- TSOP I Pb-Free Package ASSEMBLY Site 5: Powertech Technology LTD – (PTI-Suzhou) Package Qualification Report # 153902 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) Material Analysis report As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 18 of 22 48L- TSOP I Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. Using PdCu wire and Pure Sn Lead Finish Material Purpose of Use Die Circuit Bond wire Interconnect Die Attach Paste Leadframe Adhesive Base Material Substance Composition Lead Finish External plating PPM 7440-21-3 12.7100 100.0000% 24,026 2.4026% Copper 7440-50-8 0.2600 92.8571% 491 0.0491% Palladium (Pd) 7440-05-3 0.0200 7.1429% 38 0.0038% Silver Flake 7440-22-4 2.1310 75.0088% 4,028 0.4028% Bisphenol F 28064-14-4 0.4300 15.1355% 813 0.0813% 2-Ethylhexyl Glycidyl Ether 2461-15-6 0.2800 9.8557% 529 0.0529% Copper (Cu) 7440-50-8 132.5286 94.2765% 250,527 25.0527% Nickel (Ni) 7440-02-0 4.1502 2.9523% 7,845 0.7845% Silicon (Si) 7439-95-4 1.3834 0.9841% 2,615 0.2615% Magnesium (Mg) 7440-21-3 0.2767 0.1968% 523 0.0523% Silver 7440-22-4 0.1990 0.1416% 376 0.0376% Trade Secret 2.0365 1.4487% 3,850 0.3850% 60676-86-0 325.9435 88.4551% 616,150 61.6150% Epoxy Resin Trade Secret 25.4520 6.9072% 48,113 4.8113% Phenol Resin Trade Secret 14.5440 3.9470% 27,493 2.7493% Crystal silica 14808-60-7 1.4544 0.3947% 2,749 0.2749% Carbon black 1333-86-4 1.0908 0.2960% 2,062 0.2062% Tin 7440-31-5 4.1100 100.0000% 7,769 0.7769% Amorphous silica Encapsulation Weight by mg % weight of substance per package Silicon Polyimide Mold compound CAS Number % weight of substance per Homogenous material Package Weight (mg): 529.0001 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 19 of 22 48L- TSOP I Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-T CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 <5.0 <5.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 20 of 22 48L- TSOP I Pb-Free Package Document History Page Document Title: Document Number: Rev. ** *A *B *C *D *E *F *G 48L-TSOP I PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05029 ECN No. Orig. of Description of Change Change 399031 GFJ New document 1190883 TZW Changed Cypress Logo Corrected body size to 12x18.4mm, added material declaration for site 3. Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Added Assembly Site 3. 2723062 HLR Updated CAS Number of Gold and Palladium. Changed from CML to WEB in distribution list. 2733283 MAHA Added package weight of assembly site 3 on page 1. 2791945 MAHA Corrected the % per homogeneous material values of the mold compound used for assembly site 1. 3305135 HLR Deleted Tube information of Declaration for Indirect Materials table. 3595720 NKZ Added reference QTP 092605 in Assembly 3. 3604264 COPI Added Material Composition for Assembly Site 2 – B2 – ASEK Copper Wire Qualification under QTP # 120202. *H 4055064 YUM *I 4106808 MRB Added Material Composition for Assembly Site 3 – B2 and B3 – OSET Copper Wire Qualification under QTP # 120406. Added assembly site name in the assembly heading in site 1, 2 and 3. Changed assembly code to assembly site name in site 1, 2 and 3. Update material composition to reflect 4 decimal on values. 1.Site 1 2.Site 2 : B1 3.Site 3 : B1 Corrected package weight on Assy site 1 from 541,9100 mg to 541,9101 mg and Assy site 2 B1 from 568,0000 mg to 568,0003 mg Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 21 of 22 48L- TSOP I Pb-Free Package Rev. *J *K *L ECN No. Orig. of Description of Change Change 4122014 CMG Added material composition for TSOPI 48L package assembly in ASE, Taiwan using Palladium-Coated Copper wire with reference QTP# 131008 Corrected package weight of Assy Site 3 - B1 from 541,9100 mg to 541,9103 mg on page9 Corrected Package Weight - Site 1 from 555.9100 mg to 555.9101 mg on page1 Corrected Package Weight – Site 3 B1 from 541.9101 mg to 541.9103 mg on page1 4454700 HLR Sunset Due – No Change. 4838327 CMG Added QTP# 141401 on Assembly Site 2 Corrected Die Attach substance composition of table B3 for Assembly Site 2 MLA Added table B2 for Assembly Site 1 based on QTP# 122502. *M 4896903 JVP Added Package Weight for Site 4 B1 in Page 1. Added QTP# 152916 on Assembly Site 4 (Cypress Bangkok-SB) Added Section I, II, III for Assembly Site 4 *N DCON 4939324 CHAL *O 5098477 CHAL *P 5278238 CMG Removed Distribution and Posting. Added QTP# 153705 on Assembly Site 4 (Cypress Bangkok-SB) for Legacy Spansion package Added Package Weight for Site 5, B1 in Page 1, Added QTP# 153902 on Assembly Site 5 (Powertech Technology LTD, Suzhou) Deleted all *** Revised Package Weight for Site 2 – B3 Revised Material Composition table for Site 2 section B3 DCON Updated Cypress logo with the new tagline. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data, Document No. 001-05029 Rev. *P Page 22 of 22