8L QFN 1.7X1.7X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

8L – QFN 1.7x1.7x0.6mm
Chip on Leads (Saw Version)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
LG
5.7000 mg
Body Size (mil/mm)
Package Weight – Site 2
1.7x1.7x0.6mm
N/A
SUMMARY
The QFN COL 8L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology Philippines (P3/P4)
Package Qualification Report #084902 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
COA-LG08Amkor
Philippines
(P3/P4)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-52608 Rev.*D
Page 1 of 4
8L – QFN 1.7x1.7x0.6mm
Chip on Leads (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Ni
Si
Mg
Ni
Pd
Au
Specific
EpoxyResin
Bisphenol A
Glycidylether
Fused Silica
Additive
Si
Au
Pd
Epoxy Resin -1
Epoxy Resin -2
Phenol resin
Silica
Carbon Black
Metal Hydroxide
Others
CAS Number
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
Trade secret
25068-38-6
60676-86-0
Trade secret
7440-21-3
7440-57-5
7440-05-3
Trade secret
Trade secret
Trade secret
60676-86-0
1333-86-4
Trade secret
Trade Secret
Package Weight (mg):
2.3184
0.0723
0.0157
0.0036
0.0884
0.0015
0.0001
96.2000%
3.0000%
0.6500%
0.1500%
98.2500%
1.6200%
0.1300%
406,740
12,684
2,748
634
15,513
256
21
% weight
of
substance
per
package
40.6740%
1.2684%
0.2748%
0.0634%
1.5513%
0.0256%
0.0021%
0.0135
15.0000%
2,368
0.2368%
0.0045
0.0630
0.0090
0.4200
0.0099
0.0001
0.1072
0.0536
0.0804
2.2190
0.0054
0.1340
0.0804
5.0000%
70.0000%
10.0000%
100.0000%
99.0000%
1.0000%
4.0000%
2.0000%
3.0000%
82.8000%
0.2000%
5.0000%
3.0000%
789
11,053
1,579
73,684
1,737
18
18,807
9,404
14,105
389,305
940
23,509
14,105
0.0789%
1.1053%
0.1579%
7.3684%
0.1737%
0.0018%
1.8807%
0.9404%
1.4105%
38.9305%
0.0940%
2.3509%
1.4105%
Weight by
mg
% weight of
substance per
Homogeneous
material
5.7000
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-52608 Rev.*D
Page 2 of 4
100.0000
8L – QFN 1.7x1.7x0.6mm
Chip on Leads (Saw Version)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 5.0
<2.0
Cadmium
PPM
< 2.0
< 2.0
< 5.0
< 0.5
<2.0
Cr VI
PPM
< 2.0
< 2.0
< 5.0
< 0.16
<2.0
Mercury
PPM
< 2.0
< 2.0
< 10.0
< 0.5
<2.0
PBB
PPM
<0.0005
<0.0005
<50.0
------<5.0
PBDE
PPM
<0.0005
<0.0005
<45.0
-------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-52608 Rev.*D
Page 3 of 4
8L – QFN 1.7x1.7x0.6mm
Chip on Leads (Saw Version)
Pb-Free Package
Document History Page
Document Title: 8L - QFN 1.7X1.7X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE
MATERIAL DECLARATION DATASHEET
Document Number:
001-52608
Rev.
**
*A
*B
ECN No. Orig. of
Change
2665393 MLA
3522694 MLA
4055294 YUM
*C
*D
4771626 HLR
5285407 HLR
MEL
Description of Change
New release.
Correct wire composition in table.
Added assembly site name in the assembly heading.
Changed assembly code to assembly site name.
Removed Tube materials in the Indirect Material section.
Sunset Due – No Change.
Changed Cypress Logo.
Changed the substances with “------------- “and Proprietary
to “Trade Secret".
Removed distribution and posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-52608 Rev.*D
Page 4 of 4
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