8L – QFN 1.7x1.7x0.6mm Chip on Leads (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LG 5.7000 mg Body Size (mil/mm) Package Weight – Site 2 1.7x1.7x0.6mm N/A SUMMARY The QFN COL 8L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Philippines (P3/P4) Package Qualification Report #084902 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) COA-LG08Amkor Philippines (P3/P4) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-52608 Rev.*D Page 1 of 4 8L – QFN 1.7x1.7x0.6mm Chip on Leads (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Ni Si Mg Ni Pd Au Specific EpoxyResin Bisphenol A Glycidylether Fused Silica Additive Si Au Pd Epoxy Resin -1 Epoxy Resin -2 Phenol resin Silica Carbon Black Metal Hydroxide Others CAS Number 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 Trade secret 25068-38-6 60676-86-0 Trade secret 7440-21-3 7440-57-5 7440-05-3 Trade secret Trade secret Trade secret 60676-86-0 1333-86-4 Trade secret Trade Secret Package Weight (mg): 2.3184 0.0723 0.0157 0.0036 0.0884 0.0015 0.0001 96.2000% 3.0000% 0.6500% 0.1500% 98.2500% 1.6200% 0.1300% 406,740 12,684 2,748 634 15,513 256 21 % weight of substance per package 40.6740% 1.2684% 0.2748% 0.0634% 1.5513% 0.0256% 0.0021% 0.0135 15.0000% 2,368 0.2368% 0.0045 0.0630 0.0090 0.4200 0.0099 0.0001 0.1072 0.0536 0.0804 2.2190 0.0054 0.1340 0.0804 5.0000% 70.0000% 10.0000% 100.0000% 99.0000% 1.0000% 4.0000% 2.0000% 3.0000% 82.8000% 0.2000% 5.0000% 3.0000% 789 11,053 1,579 73,684 1,737 18 18,807 9,404 14,105 389,305 940 23,509 14,105 0.0789% 1.1053% 0.1579% 7.3684% 0.1737% 0.0018% 1.8807% 0.9404% 1.4105% 38.9305% 0.0940% 2.3509% 1.4105% Weight by mg % weight of substance per Homogeneous material 5.7000 PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-52608 Rev.*D Page 2 of 4 100.0000 8L – QFN 1.7x1.7x0.6mm Chip on Leads (Saw Version) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 5.0 < 5.0 <2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 0.5 <2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 0.16 <2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 0.5 <2.0 PBB PPM <0.0005 <0.0005 <50.0 ------<5.0 PBDE PPM <0.0005 <0.0005 <45.0 -------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-52608 Rev.*D Page 3 of 4 8L – QFN 1.7x1.7x0.6mm Chip on Leads (Saw Version) Pb-Free Package Document History Page Document Title: 8L - QFN 1.7X1.7X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-52608 Rev. ** *A *B ECN No. Orig. of Change 2665393 MLA 3522694 MLA 4055294 YUM *C *D 4771626 HLR 5285407 HLR MEL Description of Change New release. Correct wire composition in table. Added assembly site name in the assembly heading. Changed assembly code to assembly site name. Removed Tube materials in the Indirect Material section. Sunset Due – No Change. Changed Cypress Logo. Changed the substances with “------------- “and Proprietary to “Trade Secret". Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-52608 Rev.*D Page 4 of 4