84 BGA (6X6X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BU
B1 : 35.8180 mg
B2 : 35.5692 mg
Body Size (mil/mm)
Package Weight – Site 2
6 x 6 x 0.6mm
B1 : 34.7526 mg
B2 : 34.9649 mg
SUMMARY
The 84L-BGA package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 121302, 123605 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BU84ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 1 of 8
84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Goldwire material
Material
Purpose of Use
Substrate
Base Material
Solder Ball
External Plating
Die Attach
Die
Wire
Mold
Compound
Adhesive
Circuit
Interconnect
Encapsulation
Substance
Composition
CAS Number
SiO2
Acrylic
60676-86-0
Trade Secret
Epoxy
Trade Secret
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Modified epoxy
resin
Epoxy resin
Daspone
Treated fumed
silica
Substituted silane
Elastomeric
polymer
Epoxy resin
Si
Au
Ion impurities
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
13676-54-5
25722-66-2
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
Trade Secret
80-08-0
67762-90-7
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
1.2804
11.0000
35,747
% weight
of
substance
per
package
3.5747
1.1640
0.9312
10.0000
8.0000
32,498
25,998
3.2498
2.5998
1.7460
2.0370
4.2428
0.1746
0.0640
4.9551
0.0503
0.0252
15.0000
17.5000
36.4500
1.500
0.5500
98.5000
1.0000
0.5000
48,747
56,871
118,454
4,875
1,787
138,341
1,404
702
4.8747
5.6871
11.8454
0.4875
0.1787
13.8341
0.1404
0.0702
1.2749
0.2920
0.1460
65.5000
15.0000
7.5000
35,594
8,151
4,076
3.5594
0.8151
0.4076
0.0584
0.0584
3.0000
3.0000
1,630
1,630
0.1630
0.1630
0.0584
0.0584
3.2770
1.4643
0.0001
11.1761
0.6853
0.5607
0.0374
3.0000
3.0000
100.0000
99.9900
0.0100
89.7000
5.5000
4.5000
0.3000
1,630
1,630
91,491
40,883
4.089
312,028
19,132
15,653
1,044
0.1630
0.1630
9.1491
4.0883
0.0004
31.2028
1.9132
1.5653
0.1044
% Total:
100.0000
Weight by
mg
35.8180
% weight of
substance per
Homogenous
material
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 2 of 8
84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper-Palladium Wire material
Material
Purpose of Use
Substrate
Base Material
Solder Ball
External Plating
Die Attach
Die
Wire
Mold
Compound
Adhesive
Circuit
Interconnect
Encapsulation
Substance
Composition
CAS Number
SiO2
Acrylic
60676-86-0
Trade Secret
Epoxy
Trade Secret
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Modified epoxy
resin
Epoxy resin
Daspone
Treated fumed
silica
Substituted silane
Elastomeric
polymer
Epoxy resin
Si
Cu
Pd
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
13676-54-5
25722-66-2
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
Trade Secret
80-08-0
67762-90-7
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
1.2804
11.0000
35,998
% weight
of
substance
per
package
3.5998
1.1640
0.9312
10.0000
8.0000
32,725
26,180
3.2725
2.6180
1.7460
2.0370
4.2428
0.1746
0.0640
4.9551
0.0503
0.0252
15.0000
17.5000
36.4500
1.5000
0.5500
98.5000
1.0000
0.5000
49,088
57,269
119,281
4,909
1,800
139,309
1,414
707
4.9088
5.7269
11.9281
0.4909
0.1800
13.9309
0.1414
0.0707
1.2749
0.2920
0.1460
65.5000
15.0000
7.5000
35,843
8,208
4,104
3.5843
0.8208
0.4104
0.0584
0.0584
3.0000
3.0000
1,642
1,642
0.1642
0.1642
0.0584
0.0584
3.2770
1.1828
0.0328
11.1761
0.6853
0.5607
0.0374
3.0000
3.0000
100.0000
97.3000
2.7000
89.7000
5.5000
4.5000
0.3000
1,642
1,642
92,131
33,254
923
314,209
19,266
15,763
1,051
0.1642
0.1642
9.2131
3.3254
0.0923
31.4209
1.9266
1.5763
0.1051
% Total:
100.0000
Weight by
mg
35.5692
% weight of
substance per
Homogenous
material
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 3 of 8
84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
ASSEMBLY Site 2: Advanced Semiconductor Engineering Chung-Li
Package Qualification Report # 123401, 123603 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BU84ASE Chung-Li
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 4 of 8
84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Copper/Palladium Wire Material
Material
Substrate
Purpose of Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Bismaleimide(B)
Triazine / Epoxy
Resin
Continuous
Filament Fiber
Glass
Inorganic Filler
105391-33-1
2.1458
% weight of
substance per
Homogenous
material
25.5000
65997-17-3
1.3127
15.6000
37,773
3.7773%
21645-51-2
0.9509
11.3000
27,362
2.7362%
Barium Sulfate
7727-43-7
0.7574
9.0000
21,794
2.1794%
Monomethlyl ether
34590-94-8
0.2104
2.5000
6,054
0.6054%
Talc
14807-96-6
0.0421
0.5000
1,211
0.1211%
Silica, amorphous
7631-86-9
0.0421
0.5000
1,211
0.1211%
Epoxy Resin
Cu
Ni
Au
Sn
Ag
Cu
Modified epoxy
resin
Epoxy resin
Daspone
Treated fumed
silica
Substituted silane
Elastomeric
polymer
Epoxy resin
Si
Cu
Pd
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
0.0842
2.6928
0.1262
0.0505
4.9289
0.0602
0.0251
0.2713
1.0000
32.0000
1.5000
0.6000
98.5000
1.0000
0.5000
2,423
77,485
3,631
1,453
141,828
1,732
722
7,807
0.2423%
7.7485%
0.3631%
0.1453%
14.1828%
0.1732%
0.0722%
0.7807%
Trade Secret
80-08-0
67762-90-7
0.0835
0.0292
0.0083
20.0000
7.0000
2,403
840
239
0.2403%
0.0840%
0.0239%
Trade Secret
Trade Secret
0.0083
0.0083
2.0000
239
239
0.0239%
0.0239%
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.0083
2.7244
0.1783
0.0034
15.6960
1.2600
0.9900
0.0540
2.0000
100.0000
97.3000
2.7000
87.2000
7.0000
5.5000
0.3000
239
78,394
5,131
98
451,650
36,256
28,487
1,554
0.0239%
7.8394%
0.5131%
0.0098%
45.1650%
3.6256%
2.8487%
0.1554%
Substance
Composition
CAS Number
Package Weight (mg):
Weight by mg
34.7526
65.0000
2.0000
61,745
% weight of
substance
per
package
6.1745%
PPM
2.0000
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 5 of 8
100.0000
84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Gold Wire Material
Material
Substrate
Purpose of Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
CAS Number
Weight by mg
105391-33-1
2.1458
% weight of
substance per
Homogenous
material
25.5000
65997-17-3
1.3127
15.6000
37,545
3.7545%
21645-51-2
0.9509
11.3000
27,196
2.7196%
Barium Sulfate
7727-43-7
0.7574
9.0000
21,660
2.1660%
Monomethlyl ether
34590-94-8
0.2104
2.5000
6,017
0.6017%
Talc
14807-96-6
0.0421
0.5000
1,203
0.1203%
Silica, amorphous
7631-86-9
0.0421
0.5000
1,203
0.1203%
Epoxy Resin
Cu
Ni
Au
Sn
Ag
Cu
Modified
epoxy
resin
Epoxy resin
Daspone
Treated
fumed
silica
Substituted silane
Elastomeric
polymer
Epoxy resin
Si
Au
Pd
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
0.0842
2.6928
0.1262
0.0505
4.9315
0.0602
0.0251
0.2713
1.0000
32.0000
1.5000
0.6000
98.5000
1.0000
0.5000
65.0000
2,407
77,014
3,610
1,444
141,041
1,722
717
7,758
0.2407%
7.7014%
0.3610%
0.1444%
14.1041%
0.1722%
0.0717%
0.7758%
-------------------80-08-0
67762-90-7
0.0835
0.0292
0.0083
20.0000
7.0000
2.0000
2,387
835
239
0.2387%
0.0835%
0.0239%
Trade Secret
Trade Secret
0.0083
0.0083
2.0000
2.0000
239
239
0.0239%
0.0239%
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.0083
2.7244
0.3875
0.0039
15.6960
1.2600
0.9900
0.0540
2.0000
100.0000
99.0000
1.0000
87.2000
7.0000
5.5000
0.3000
239
77,917
11,083
112
448,908
36,036
28,314
1,544
0.0239%
7.7917%
1.1083%
0.0112%
44.8908%
3.6036%
2.8314%
0.1544%
Substance
Composition
Bismaleimide(B)
Triazine / Epoxy
Resin
Continuous
Filament
Fiber
Glass
Inorganic Filler
Package Weight (mg):
34.9649
61,371
% weight of
substance
per
package
6.1371%
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 6 of 8
100.0000
84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier
bag
Shielding bag
Protective Band
Shipping and
inner/ pizza box
Desiccant
Bubble Pack
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-DESS-R
CoA-BUBP-R
Lead
PPM
PBDE
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 7 of 8
84- BGA (6 x 6 x 0.6 mm)
Pb-Free Package
Document History Page
Document Title: 84 - BGA (6X6X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Document Number: 001-78056
Rev.
**
*A
ECN No. Orig. of
Change
3564923 JSO
3787622 JSO
*B
4064088 YUM
*C
*D
4771626 HLR
5285407 HLR
MEL
Description of Change
Initial Release
Added CuPd material composition for Assembly Site 1.
Added Assembly Site 2 for CuPd and Au wire.
Added assembly site name in the Assembly heading in site
1 and 2.
Changed assembly code to assembly site name in site 1
and 2.
Sunset Due – No Change
Changed Cypress Logo.
Changed the substances with “------------- “and Proprietary
to “Trade Secret".
Removed distribution and posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78056 Rev. *D
Page 8 of 8