PHILIPS PHP152NQ03LT

PHP/PHB152NQ03LT
TrenchMOS™ logic level FET
Rev. 01 — 20 February 2002
Product data
1. Description
N-channel logic level field-effect power transistor in a plastic package using
TrenchMOS™1 technology.
Product availability:
PHP152NQ03LT in SOT78 (TO-220AB)
PHB152NQ03LT in SOT404 (D2-PAK).
2. Features
■ Low gate charge
■ Low on-state resistance.
3. Applications
■ Optimized for DC to DC convertors.
4. Pinning information
Table 1:
Pinning - SOT78, SOT404 simplified outline and symbol
Pin Description
1
gate (g)
2
drain (d)
3
source (s)
mb
mounting base,
connected to drain (d)
Simplified outline
[1]
Symbol
mb
d
mb
g
MBB076
2
1
3
MBK116
MBK106
1 2 3
SOT78 (TO-220AB)
SOT404 (D2-PAK)
[1]
It is not possible to make connection to pin 2 of the SOT404 and SOT428 packages.
1.
TrenchMOS is a trademark of Koninklijke Philips Electronics N.V.
s
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
5. Quick reference data
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
Tj = 25 to 175 °C
−
25
V
ID
drain current (DC)
Tmb = 25 °C; VGS = 5 V
−
75
A
Ptot
total power dissipation
Tmb = 25 °C
−
230
W
Tj
junction temperature
−
175
°C
RDSon
drain-source on-state resistance
Tj = 25° C; VGS = 10 V; ID = 25 A
3
4
mΩ
Tj = 25° C; VGS = 5 V; ID = 25 A
3.6
5
mΩ
Min
Max
Unit
6. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
VDS
drain-source voltage (DC)
Tj = 25 to 175 °C
−
25
V
VDGR
drain-gate voltage (DC)
Tj = 25 to 175 °C; RGS = 20 kΩ
−
25
V
ID
drain current (DC)
Tmb = 25 °C; VGS = 5 V; Figure 2 and 3
−
75
A
Tmb = 100 °C; VGS = 5 V; Figure 2
−
75
A
VGS
gate-source voltage
−
±20
V
IDM
peak drain current
Tmb = 25 °C; pulsed; tp ≤ 10 µs; Figure 3
−
240
A
Ptot
total power dissipation
Tmb = 25 °C; Figure 1
−
230
W
Tstg
storage temperature
−55
+175
°C
Tj
operating junction temperature
−55
+175
°C
Source-drain diode
IS
source (diode forward) current (DC) Tmb = 25 °C
−
75
A
ISM
peak source (diode forward) current Tmb = 25 °C; pulsed; tp ≤ 10 µs
−
240
A
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
2 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
03ai30
03aa16
120
120
Pder
Ider
(%)
(%)
80
80
40
40
0
0
0
50
100
150
200
o
Tmb ( C)
0
P tot
P der = ----------------------- × 100%
P
°
50
100
150
200
Tmb (ºC)
ID
I der = ------------------- × 100%
I
°
tot ( 25 C )
D ( 25 C )
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
Fig 2. Normalized continuous drain current as a
function of mounting base temperature.
03ai32
103
ID
(A)
RDSon = VDS / ID
tp = 10 µs
102
1 ms
DC
10
10 ms
1
1
102
10
VDS (V)
Tmb = 25 °C; IDM is single pulse.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
3 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
7. Thermal characteristics
Table 4:
Thermal characteristics
Symbol Parameter
Conditions
Min Typ Max Unit
Rth(j-mb)
thermal resistance from junction to mounting base Figure 4
-
-
0.65 K/W
Rth(j-a)
thermal resistance from junction to ambient
vertical in still air; SOT78 package
-
60
-
K/W
mounted on a printed circuit board;
SOT404 minimum footprint;
SOT404 package
-
50
-
K/W
7.1 Transient thermal impedance
03ai31
10
Zth(j-mb)
(K/W)
1
δ = 0.5
10-1
0.2
0.1
0.05
δ=
P
0.02
10-2
single pulse
tp
T
t
tp
T
10-3
10-5
10-4
10-3
10-2
10-1
1
tp (s)
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
4 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
8. Characteristics
Table 5:
Characteristics
Tj = 25 °C unless otherwise specified
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tj = 25 °C
25
−
−
V
Tj = −55 °C
22
−
−
V
1
1.5
2
V
Tj = 175 °C
0.5
−
−
V
Tj = −55 °C
−
−
2.3
V
−
0.05
1
µA
Static characteristics
V(BR)DSS drain-source breakdown voltage
VGS(th)
gate-source threshold voltage
ID = 0.25 mA; VGS = 0 V
ID = 1 mA; VDS = VGS; Figure 9
Tj = 25 °C
IDSS
drain-source leakage current
VDS = 25 V; VGS = 0 V
Tj = 25 °C
Tj = 175 °C
−
−
500
µA
−
10
100
nA
Tj = 25 °C
−
3.6
5
mΩ
Tj = 175 °C
−
6.5
8.7
mΩ
−
3
4
mΩ
IGSS
gate-source leakage current
VGS = ±15 V; VDS = 0 V
RDSon
drain-source on-state resistance
VGS = 5 V; ID = 25 A; Figure 7 and 8
VGS = 10 V; ID = 25 A; Figure 7
Tj = 25 °C
Dynamic characteristics
Qg(tot)
total gate charge
−
42
−
nC
Qgs
gate-source charge
−
13.5
−
nC
Qgd
gate-drain (Miller) charge
−
14.5
−
nC
Ciss
input capacitance
−
3550 −
pF
ID = 50 A; VDD = 15 V; VGS = 5 V; Figure 13
VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 11
Coss
output capacitance
−
1020 −
pF
Crss
reverse transfer capacitance
−
400
−
pF
td(on)
turn-on delay time
−
28
−
ns
tr
rise time
−
115
−
ns
td(off)
turn-off delay time
−
86
−
ns
tf
fall time
−
77
−
ns
−
0.85
1.2
V
-
45
-
ns
-
40
-
nC
VDD = 15 V; ID = 25 A; VGS = 5 V;
RG = 5.6 Ω; resistive load
Source-drain diode
VSD
source-drain (diode forward) voltage IS = 25 A; VGS = 0 V; Figure 12
trr
reverse recovery time
Qr
recovered charge
IS = 10 A; dIS/dt = −100 A/µs; VGS = 0 V
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
5 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
03ai33
03ai35
80
80
10 V 5 V 3.5 V 3.3 V T = 25 ºC
j
ID
VDS > ID x RDSon
ID
(A)
3.1 V
(A)
60
60
2.9 V
40
40
2.7 V
20
20
175 ºC
2.5 V
Tj = 25 ºC
VGS = 2.3 V
0
0
0
0.2
0.4
0.6
0.8
1
VDS (V)
Tj = 25 °C
0
2
3
VGS (V)
4
Tj = 25 °C and 175 °C; VDS > ID x RDSon
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
03ai34
VGS = 3.1 V
Tj = 25 ºC
03af18
2
0.012
RDSon
1
a
(Ω)
1.6
0.008
3.3 V
1.2
3.5 V
0.8
5V
0.004
10 V
0.4
0
0
0
20
40
60
ID (A)
80
-60
60
120
180
Tj (ºC)
Tj = 25 °C
R DSon
a = ---------------------------R DSon ( 25 °C )
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
0
Rev. 01 — 20 February 2002
6 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
03aa33
2.5
max
(V)
03aa36
10-1
ID
(A)
10-2
VGS(th)
2
typ
min
10-3
1.5
typ
max
min
1
10-4
0.5
10-5
10-6
0
-60
0
60
120
Tj (°C)
180
0
1
2
3
VGS (V)
Tj = 25 °C; VDS = 5 V
ID = 1 mA; VDS = VGS
Fig 9. Gate-source threshold voltage as a function of
junction temperature.
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
03ai37
104
C
Ciss
(pF)
103
Coss
Crss
102
10-1
1
102
10
VDS (V)
VGS = 0 V; f = 1 MHz
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
7 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
03ai36
80
IS
03ai38
10
VGS
VGS = 0 V
(A)
ID = 50 A
(V)
Tj = 25 ºC
8
60
VDD = 15 V
6
40
4
20
2
175 ºC
Tj = 25 ºC
0
0
0
0.4
0.8
VSD (V)
1.2
Tj = 25 °C and 175 °C; VGS = 0 V
0
40
60
80
100
QG (nC)
ID = 50 A; VDD = 15 V
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
values.
Fig 13. Gate-source voltage as a function of gate
charge; typical values.
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
20
Rev. 01 — 20 February 2002
8 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
9. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
E
SOT78
A
A1
p
q
mounting
base
D1
D
L2
L1(1)
Q
b1
L
1
2
3
b
c
e
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
b1
c
D
D1
E
e
L
L1(1)
L2
max.
p
q
Q
mm
4.5
4.1
1.39
1.27
0.9
0.7
1.3
1.0
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
2.54
15.0
13.5
3.30
2.79
3.0
3.8
3.6
3.0
2.7
2.6
2.2
Note
1. Terminals in this zone are not tinned.
OUTLINE
VERSION
REFERENCES
IEC
SOT78
JEDEC
EIAJ
3-lead TO-220AB
SC-46
EUROPEAN
PROJECTION
ISSUE DATE
00-09-07
01-02-16
Fig 14. SOT78 (TO-220AB).
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
9 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
Plastic single-ended surface mounted package (Philips version of D2-PAK); 3 leads
(one lead cropped)
SOT404
A
A1
E
mounting
base
D1
D
HD
2
Lp
1
3
c
b
e
e
Q
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
c
D
max.
D1
E
e
Lp
HD
Q
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
11
1.60
1.20
10.30
9.70
2.54
2.90
2.10
15.80
14.80
2.60
2.20
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-06-25
01-02-12
SOT404
Fig 15. SOT404 (D2-PAK)
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
10 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
10. Revision history
Table 6:
Revision history
Rev Date
01
20020220
CPCN
Description
-
Product Data; initial version
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Product data
Rev. 01 — 20 February 2002
11 of 13
PHP/PHB152NQ03LT
Philips Semiconductors
TrenchMOS™ logic level FET
11. Data sheet status
Data sheet status[1]
Product status[2]
Definition
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips Semiconductors
reserves the right to change the specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published at a
later date. Philips Semiconductors reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product.
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the right to
make changes at any time in order to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change Notification (CPCN) procedure
SNW-SQ-650A.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
12. Definitions
13. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: [email protected].
Product data
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09353
Rev. 01 — 20 February 2002
12 of 13
Philips Semiconductors
PHP/PHB152NQ03LT
TrenchMOS™ logic level FET
Contents
1
2
3
4
5
6
7
7.1
8
9
10
11
12
13
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Transient thermal impedance . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
© Koninklijke Philips Electronics N.V. 2002.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 20 February 2002
Document order number: 9397 750 09353