DISCRETE SEMICONDUCTORS DATA SHEET PEMH13; PUMH13 NPN/NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 47 kΩ Product specification Supersedes data of 2003 Nov 07 2004 Apr 14 Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 47 kΩ FEATURES PEMH13; PUMH13 QUICK REFERENCE DATA • Built-in bias resistors SYMBOL • Simplifies circuit design VCEO collector-emitter voltage IO MAX. UNIT − 50 V output current (DC) − 100 mA TR1 NPN − − − APPLICATIONS TR2 NPN − − − • Low current peripheral driver R1 bias resistor 4.7 − kΩ • Replacement of general purpose transistors in digital applications R2 bias resistor 47 − kΩ • Reduces component count • Reduces pick and place costs. • Control of IC inputs. PARAMETER TYP. DESCRIPTION NPN/NPN resistor-equipped transistors (see “Simplified outline, symbol and pinning” for package details). PRODUCT OVERVIEW PACKAGE TYPE NUMBER PEMH13 PUMH13 PNP/PNP COMPLEMENT MARKING CODE NPN/PNP COMPLEMENT PHILIPS EIAJ SOT666 − 21 PEMB13 PEMD13 SC-88 H0*(1) PUMB13 PUMD13 SOT363 Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. SIMPLIFIED OUTLINE, SYMBOL AND PINNING PINNING TYPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL PIN PEMH13 PUMH13 handbook, halfpage 6 5 6 4 5 R1 4 R2 TR2 TR1 R2 1 2 3 1 Top view 2004 Apr 14 R1 MHC650 2 2 3 DESCRIPTION 1 emitter TR1 2 base TR1 3 collector TR2 4 emitter TR2 5 base TR2 6 collector TR1 Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 47 kΩ PEMH13; PUMH13 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION PEMH13 − plastic surface mounted package; 6 leads SOT666 PUMH13 − plastic surface mounted package; 6 leads SOT363 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor VCBO collector-base voltage open emitter − 50 V VCEO collector-emitter voltage open base − 50 V VEBO emitter-base voltage open collector − 10 V VI input voltage positive − +30 V negative − −5 V IO output current (DC) − 100 mA ICM peak collector current − 100 mA Ptot total power dissipation Tamb ≤ 25 °C SOT363 note 1 − 200 mW SOT666 notes 1 and 2 − 200 mW +150 °C Tstg storage temperature −65 Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Per device Ptot total power dissipation Tamb ≤ 25 °C SOT363 note 1 − 300 mW SOT666 notes 1 and 2 − 300 mW Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. 2004 Apr 14 3 Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 47 kΩ PEMH13; PUMH13 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Per transistor Rth(j-a) Tamb ≤ 25 °C thermal resistance from junction to ambient SOT363 note 1 625 K/W SOT666 notes 1 and 2 625 K/W Per device Rth(j-a) Tamb ≤ 25 °C thermal resistance from junction to ambient SOT363 note 1 416 K/W SOT666 notes 1 and 2 416 K/W Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor ICBO collector-base cut-off current VCB = 50 V; IE = 0 A − − 100 nA ICEO collector-emitter cut-off current VCE = 30 V; IB = 0 A − − 1 µA VCE = 30 V; IB = 0 A; Tj = 150 °C − − 50 µA IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A − − 170 µA hFE DC current gain VCE = 5 V; IC = 10 mA 100 − − VCEsat collector-emitter saturation voltage IC = 5 mA; IB = 0.25 mA − − 100 mV Vi(off) input-off voltage VCE = 5 V; IC = 100 µA − 0.6 0.5 V Vi(on) input-on voltage VCE = 0.3 V; IC = 5 mA 1.3 0.9 − V R1 input resistor 3.3 4.7 6.1 kΩ R2 -------R1 resistor ratio 8 10 12 Cc collector capacitance − − 2.5 2004 Apr 14 VCB = 10 V; IE = ie = 0 A; f = 1 MHz 4 pF Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 47 kΩ PEMH13; PUMH13 PACKAGE OUTLINES Plastic surface mounted package; 6 leads SOT666 D E A X Y S S HE 6 5 4 pin 1 index A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 01-01-04 01-08-27 SOT666 2004 Apr 14 EUROPEAN PROJECTION 5 Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 47 kΩ PEMH13; PUMH13 Plastic surface mounted package; 6 leads SOT363 D E B y X A HE 6 v M A 4 5 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT363 2004 Apr 14 REFERENCES IEC JEDEC EIAJ SC-88 6 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification NPN/NPN resistor-equipped transistors; R1 = 4.7 kΩ, R2 = 47 kΩ PEMH13; PUMH13 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Apr 14 7 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R75/03/pp8 Date of release: 2004 Apr 14 Document order number: 9397 750 13092