ATMEL AT75C221-C256

Features
• ARM7TDMI® ARM® Thumb® Processor Core
– In-Circuit Emulator, 40 MHz operation
• 16-bit Fixed-point OakDSPCore®
•
•
•
•
•
•
•
•
•
•
•
•
– Up to 60 MHz operations
– 104K bytes of Integrated Fast RAM, Codec Interface
Ethernet Bridge
– Dual Ethernet 10/100 Mbps MAC Interface
– 16-Kbyte Frame Buffer
1 K-Byte Boot ROM, Embedding a Boot Program
– Enable Application Download from DataFlash®
External Bus Interface
– On-chip 32-bit SDRAM Controller
– 4 Chip Select Static Memory Controller
Multi-level Priority, Individually Maskable, Vectored Interrupt Controller
Three 16-bit Timer/Counters
Two UARTs with Modem Control Lines
Serial Peripheral Interface (SPI)
Two PIO Controllers, Managing up to 48 General-purpose I/O Pins
Supported by a Wide Range of Ready-to-use Application Software
– Multi-tasking Operating System, Networking
– Voice-processing Functions
Available in a 208-lead PQFP Package and 256-ball BGA Package
Power Supplies
– VDDIO 3.3V nominal
– VDDCORE and VDDOSC 1.8V nominal
0°C to + 70°C Operating Temperature Range
Smart Internet
Appliance
Processor
(SIAP™)
AT75C221
Summary
Description
The AT75C221, Atmel’s latest device in the family of smart internet appliance processors (SIAP™), is a high-performance processor designed for professional internet
appliance applications such as the Ethernet IP phone. The AT75C221 is built around
an ARM7TDMI microcontroller core running at 40 MHz with an OakDSPCore coprocessor running at 60 MHz and a dual Ethernet 10/100 Mbits/sec MAC interface.
In a typical standalone IP phone, the DSP handles the voice processing functions
(voice compression, acoustic echo cancellation, etc.) while the dual-port Ethernet
10/100 Mbits/sec MAC interface establishes the connection to the Ethernet physical
layer (PHY) that links the network and the PC. In such an application, the power of the
ARM7TDMI allows it to run a VoIP protocol stack as well as all the system control
tasks.
Atmel provides the AT75C221 with several software modules, including:
•
A set of drivers for a Linux® kernel capable of driving the embedded peripherals.
•
A comprehensive set of tunable DSP algorithms for voice processing, tailored to
be run by the DSP subsystem.
6033CS–INTAP–05/04
Pinout
The AT75C221 ships in two alternative packages:
•
208-lead PQFP
•
256-ball BGA
The product features of the 256-ball BGA package are increased compared to the 208lead PQFP package.
The features available only with the BGA package are:
2
•
The 32-bit wide data bus (In PQFP, only a 16-bit wide data bus is supported.)
•
The Parallel I/O lines PA13 to PA18 and PA20 to PA31
•
The Parallel I/O lines PB10 to PB16
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
208-lead PQFP Package Pinout
Table 1. Pinout for 208-lead PQFP Package
Pin
Number
Signal Name
Pin
Number
Signal Name
Pin
Number
Signal Name
Pin
Number
Signal Name
1
GND
37
MB_TXD0
73
A15
109
RAS
2
SCLKA
38
MB_TXD1
74
A16
110
CAS
3
VDDIO
39
MB_TXD2
75
A17
111
NC(1)
4
FSA
40
GND
76
A18
112
WE
5
STXA
41
MB_TXD3
77
A19B/A0
113
DQM0
6
SRXA
42
MB_TXEN
78
A20/BA1
114
DQM1
7
NTRST
43
MB_TXCLK
79
A21
115
NC(1)
8
MA_COL
44
MB_RXD0
80
D0
116
GND
9
MA_CRS
45
MB_RXD1
81
D1
117
NC(1)
10
MA_TXER
46
MB_RXD2
82
D2
118
VDDCORE
11
MA_TXD0
47
MB_RXD3
83
D3
119
GND
12
MA_TXD1
48
MB_RXER
84
GND
120
VDDOSC
13
MA_TXD2
49
MB_RXCLK
85
D4
121
PLLRC
14
MA_TXD3
50
MB_RXDV
86
VDDIO
122
GND
15
MA_TXEN
51
MB_MDC
87
D5
123
GND
16
VDDIO
52
VDDIO
88
D6
124
XTALOUT
17
MA_TXCLK
53
GND
89
D7
125
XTALIN
18
GND
54
MB_MDIO
90
D8
126
VDDCORE
19
MA_RXD0
55
MB_LINK
91
D9
127
NCE0
20
MA_RXD1
56
A0
92
D10
128
NCE1
21
MA_RXD2
57
A1
93
D11
129
NCE2
22
MA_RXD3
58
A2
94
D12
130
VDDIO
23
MA_RXER
59
A3
95
D13
131
NCE3
24
MA_RXCLK
60
A4
96
D14
132
NWE0
25
GND
61
A5
97
VDDCORE
133
NWE1
26
VDDCORE
62
A6
98
GND
134
NC(1)
27
MA_RXDV
63
A7
99
D15
135
VDDIO
28
MA_MDC
64
A8
100
VDDIO
136
GND
29
MA_MDIO
65
A9
101
GND
137
NC(1)
30
MA_LINK
66
A10
102
VDDIO
138
NWR
(1)
31
MB_COL
67
A11
103
NC
139
NSOE
32
MB_CRS
68
A12
104
VDDIO
140
GND
33
GND
69
VDDIO
105
GND
141
VDDCORE
34
VDDCORE
70
GND
106
SDCK
142
VDDIO
35
VDDIO
71
A13
107
SDCS
143
MISO
36
MB_TXER
72
A14
108
SDA10
144
MOSI
3
6033CS–INTAP–05/04
Table 1. Pinout for 208-lead PQFP Package (Continued)
Pin
Number
Signal Name
Pin
Number
Signal Name
Pin
Number
Signal Name
Pin
Number
Signal Name
145
SPCK
161
TMS
177
PA5
193
GND
146
PA22
162
TCK
178
PA4
194
PB0
147
VDDIO
163
PA19
179
PA3
195
PB1
148
GND
164
VDDCORE
180
PA2
196
PB2
149
NRST
165
GND
181
PA1
197
PB3
150
FIQ
166
PA12
182
PA0
198
PB4
151
IRQ0
167
GND
183
GND
199
PB5
152
TST
168
VDDIO
184
RXDA
200
PB6
153
GND
169
PA11
185
TXDA
201
PB7
154
VDDCORE
170
PA10
186
NRSTA
202
PB8
171
PA9
187
NCTSA
203
PB9
(1)
155
NC
156
VDDIO
172
PA8
188
NDTRA
204
VDDIO
157
GND
173
PA7
189
NDSRA
205
DBW32
158
VDDIO
174
PA6
190
NDCDA
206
GND
159
TDO
175
VDDIO
191
RXDB
207
BO256
192
TXDB
208
VDDIO
160
Note:
TDI
176
NC
(1)
1. NC pins should be left unconnected.
Figure 1. 208-lead PQFP Package Orientation (Top View)
156
105
157
104
208
53
1
4
52
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
256-ball BGA Package Pinout
Table 1. Pinout for 256-ball BGA Package
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
A1
GND
B18
TDI
A2
PB9
B19
D15
VDDIO
H20
NSOE
NC
(1)
D16
PA24
J1
MA_TXEN
(1)
D17
GND
J2
MA_TXD3
A3
PB4
B20
NC
A4
PB1
C1
PB10
D18
PA29
J3
MA_TXD2
A5
NDSRB
C2
PA28
D19
VDDCORE
J4
MA_TXD1
A6
NRSTB
C3
DBW32
D20
IRQ1
J17
NWR
A7
RXDB
C4
PB6
E1
STXA
J18
NWE3
A8
NDSRA
C5
PB2
E2
FSA
J19
NC(1)
A9
TXDA
C6
NRIB
E3
SCLKA
J20
NWE2
A10
PA2
C7
NCTSB
E4
PA25
K1
MA_RXD0
A11
PA3
C8
NRIA
E17
PA30
K2
MA_TXCLK
A12
PA6
C9
NCTSA
E18
TST
K3
NC(1)
A13
PA10
C10
PA0
E19
IRQ0
K4
VDDIO
(1)
A14
PA13
C11
PA4
E20
NC
K17
NWE1
A15
PA15
C12
PA8
F1
PB13
K18
NWE0
A16
PA19
C13
PA12
F2
PB12
K19
NCE3
A17
NC
(1)
C14
PA14
F3
SRXA
K20
NCE2
A18
PA23
C15
PA18
F4
VDDIO
L1
MA_RXD1
A19
TDO
C16
PA21
F17
VDDIO
L2
MA_RXD2
A20
(1)
C17
TCK
F18
FIQ
L3
MA_RXD3
B1
NC
BO256
C18
NC
(1)
(1)
F19
NC
L4
MA_RXER
(1)
F20
SPCK
L17
VDDIO
B2
PB8
C19
NC
B3
PB7
C20
PA31
G1
MA_COL
L18
NCE0
B4
PB3
D1
PB11
G2
PB15
L19
NC(1)
B5
PB0
D2
PA27
G3
PB14
L20
NCE1
B6
NDTRB
D3
PA26
G4
NTRST
M1
MA_RXCLK
B7
TXDB
D4
GND
G17
NRST
M2
VDDCORE
B8
NDCDA
D5
PB5
G18
PA22
M3
MA_RXDV
B9
NRSTA
D6
VDDIO
G19
MOSI
M4
MA_MDC
B10
PA1
D7
NDCDB
G20
MISO
M17
PLLRC
B11
PA5
D8
GND
H1
MA_TXD0
M18
NC(1)
B12
PA7
D9
NDTRA
H2
MA_TXER
M19
XTALOUT
B13
PA11
D10
RXDA
H3
MA_CRS
M20
XTALIN
B14
VDDCORE
D11
VDDIO
H4
GND
N1
MA_MDIO
B15
PA16
D12
PA9
H17
GND
N2
MA_LINK
B16
PA20
D13
GND
H18
VDDIO
N3
MB_COL
B17
TMS
D14
PA17
H19
VDDCORE
N4
GND
5
6033CS–INTAP–05/04
Table 1. Pinout for 256-ball BGA Package (Continued)
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
Pin
Signal Name
N17
GND
T20
SDCS
V7
A11
W14
D12
N18
DQM3
U1
MB_RXD0
V8
A14
W15
VDDCORE
N19
VDDCORE
U2
MB_RXD2
V9
A18
W16
D17
N20
VDDOSC
U3
MB_RXCLK
V10
A22
W17
D20
P1
MB_CRS
U4
GND
V11
D2
W18
D24
P2
VDDCORE
U5
A1
V12
D6
W19
VDDIO
P3
MB_TXD0
U6
VDDIO
V13
D10
W20
NC(1)
P4
MB_TXD3
U7
A8
V14
D14
Y1
NC(1)
P17
RAS
U8
GND
V15
NC(1)
Y2
MB_MDIO
P18
DQM0
U9
A17
V16
D19
Y3
A2
P19
DQM1
U10
VDDIO
V17
D23
Y4
A3
P20
DQM2
U11
D3
V18
D26
Y5
A6
(1)
R1
MB_TXER
U12
D7
V19
NC
Y6
A10
R2
MB_TXD1
U13
GND
V20
D29
Y7
A13
R3
MB_TXEN
U14
D16
W1
MB_MDC
R4
VDDIO
U15
VDDIO
W2
Y8
A16
(1)
Y9
A20/BA1
(1)
NC
R17
VDDIO
U16
D22
W3
NC
Y10
A23
R18
SDA10
U17
GND
W4
MB_LINK
Y11
D0
R19
CAS
U18
D27
W5
A5
Y12
D4
W6
A9
Y13
D8
(1)
R20
WE
U19
NC
T1
MB_TXD2
U20
D30
W7
A12
Y14
D11
T2
MB_TXCLK
V1
MB_RXD3
W8
A15
Y15
D13
T3
MB_RXD1
V2
MB_RXDV
W9
A19/BA0
Y16
D15
W10
A21
Y17
D18
(1)
T4
MB_RXER
V3
NC
T17
D28
V4
A0
W11
D1
Y18
D21
T18
D31
V5
A4
W12
D5
Y19
D25
T19
SDCK
V6
A7
W13
D9
Y20
NC(1)
Note:
6
1. NC Balls should be left unconnected.
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Figure 2. 256-ball Package Orientation (Top View)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
7
6033CS–INTAP–05/04
Signal Description
Table 1. Signal Description
Block
Signal Name
Function
Type
VDDIO
I/O Lines Power Supply
VDDCORE
Device Core Power Supply
VDDOSC
PLL and Oscillator Power Supply
GND
Ground
A0-A23
Address Bus
D0-D31
Data Bus
SDCK
SDRAM Clock
Output
DQM0-DQM3
SDRAM Byte Masks
Output
SDCS
SDRAM Chip Select
Output
SDA10
SDRAM Address Line 10
Output
RAS
Row Address Strobes
Output
CAS
Column Address Strobes
Output
WE
Write Enable
Output
BA0-BA1
Bank Address Line
Output
NCE0-NCE3
Chip Selects
Output
NWE0-NWE3
Byte Select/Write Enable
Output
NSOE
Output Enable
Output
NWR
Memory Block Write Enable
Output
PIO Controller A
PA0-PA31
PIO Controller A I/O Lines
Input/Output
PIO Controller B
PB0-PB15
PIO Controller B I/O Lines
Input/Output
TCLK0-TCLK2
Timer Counter Clock 0 to 2
Input
TIOA0-TIOA2
Timer Counter I/O Line A 0 to 2
Input/Output
TIOB0-TIOA2
Timer Counter I/O Line B 0 to 2
Input/Output
MISO
Master In/Slave Out
Input/Output
MOSI
Master Out/Slave In
Input/Output
SPCK
Serial Clock
Input/Output
NPCS0/NSS
Peripheral Chip Select 0/Slave Select
Input/Output
NPCS1-NPCS3
Peripheral Chip Select 1 to 3
Power Supplies
Output
External Bus Interface
Synchronous Dynamic
Memory Controller
Input/Output
Static Memory Controller
Timer Counter
Serial Peripheral Interface
8
Output
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
Table 1. Signal Description (Continued)
Block
Signal Name
Function
Type
RXDA-RXDB
Receive Data
Input
TXDA-TXDB
Transmit Data
Output
NRTSA-NRSTB
Ready to Send
Output
NCTSA-NCTSB
Clear to Send
Input
NDTRA-NDTRB
Data Terminal Ready
NDSRA-NDSRB
Data Set Ready
Input
NDCDA-NDCDB
Data Carrier Detect
Input
NRIA-NRIB
Ring Indicator
Input
MA_COL
MAC A Collision Detect
Input
MA_CRS
MAC A Carrier Sense
Input
MA_TXER
MAC A Transmit Error
Output
MA_TXD0-MA_TXD3
MAC A Transmit Data Bus
Output
MA_TXEN
MAC A Transmit Enable
Output
MA_TXCLK
MAC A Transmit Clock
Input
MA_RXD0-MA_RXD3
MAC A Receive Data Bus
Input
MA_RXER
MAC A Receive Error
Input
MA_RXCLK
MAC A Receive Clock
Input
MA_RXDV
MAC A Receive Data Valid
Output
MA_MDC
MAC A Management Data Clock
Output
MA_MDIO
MAC A Management Data Bus
MA_LINK
MAC A Link Interrupt
Input
MB_COL
MAC B Collision Detect
Input
MB_CRS
MAC B Carrier Sense
Input
MB_TXER
MAC B Transmit Error
Output
MB_TXD0-MB_TXD3
MAC B Transmit Data Bus
Output
MB_TXEN
MAC B Transmit Enable
Output
MB_TXCLK
MAC B Transmit Clock
Input
MB_RXD0-MB_RXD3
MAC B Receive Data Bus
Input
MB_RXER
MAC B Receive Error
Input
MB_RXCLK
MAC B Receive Clock
Input
MB_RXDV
MAC B Receive Data Valid
Output
MB_MDC
MAC B Management Data Clock
Output
MB_MDIO
MAC B Management Data Bus
MB_LINK
MAC B Link Interrupt
UART A and UART B
MAC A Interface
MAC B Interface
Output
Input/Output
Input/Output
Input
9
6033CS–INTAP–05/04
Table 1. Signal Description (Continued)
Block
In-Circuit Emulator
Signal Name
Function
Type
NTRST
Test Reset
Input
TCK
Test Clock
Input
TMS
Test Mode Select
Input
TDI
Test Data Input
Input
TDO
Test Data Output
SCLKA
Serial Clock
Input/Output
FSA
Frame Pulse
Input/Output
STXA
Transmit Data to Codec
Output
SRXA
Receive Data to Codec
Input
OAKAIN0-OAKAIN1
OakDSPCore User Input
Input
OAKAOUT0-OAKAOUT1
OakDSPCore User Output
NRST
Reset
Input
FIQ
Fast Interrupt
Input
IRQ0-IRQ1
Interrupt Lines
Input
PLLRC
PLL RC Filter
Analog
XTALIN
Crystal Input
Analog
XTALOUT
External Crystal
Analog
TST
Test Mode
Input
B0256
Package Size Option (1 = 256 pins)
Input
DBW32
External Data Bus Width for CS0 (1 = 32 bits)
Input
ACLKO
ARM Clock Output
Output
Codec Interface
DSP Subsystem
Output
Miscellaneous
10
Output
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
Block Diagram
Figure 3. AT75C221 Block Diagram
JTAG Debug
Interface
ICE
Audio Codec
and I/O Lines
ARM7TDMI MCU Core
Boot ROM
OakDSPCore
DSP Subsystem
External Bus
Interface
MII PHY
Interface
MII PHY
Interface
Ethernet
10/100 Mbps
MAC Interface
ASB/ASB
Bridge
Ethernet
10/100 Mbps
MAC Interface
32k Bytes
SRAM
SDRAMC
16- or 32-bit data
Memory Bus
SMC
Peripheral Data
Controller
Peripheral Bridge
OSC.
System
Controller
SPI
Serial Peripherals
Boot DataFlash
PLL
Interrupt and
Fast Interrupt
I/O Lines
I/O Lines
Advanced
Interrupt
Controller
USART A
Serial Port
USART B
Serial Port
PIO Controller A
PIO Controller B
Timer/Counter 0
PWM Signals
Timer/Counter 1
PWM Signals
Timer/Counter 2
PWM Signals
11
6033CS–INTAP–05/04
Application Example
Figure 4. DSP Subsystem
Oak Program Bus
Oak Data Bus
2K x 16 X-RAM
Codec Interface
2K x 16 Y-RAM
32K x 16
Program RAM
16K x 16
Generalpurpose RAM
OakDSPCore
256 x 16
Dual-port
Mailbox
On-chip
Emulation
Module
Bus Interface Unit
DSP Subsystem
ASB
Figure 5. Application Example Overview: Standalone Ethernet Telephone
Keyboard Screen
Network
PC
Speaker
Microphone
Handset
Ethernet
10/100 Mbps PHY
Ethernet
10/100 Mbps PHY
Speaker
Phone
Interface
Voice
Codec
Analog Front End
Dual-port
Ethernet
10/100 Mbps
MAC
Interface
SDRAM
Controller
VolP
Protocol
Stack
Voice
Processing
DSP Subsystem
SDRAM
External Bus
Interface
SRAM
Controller
Flash
ARM7TDMI Core
AT75C221
12
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
Functional
Description
ARM7TDMI Core
The ARM7TDMI is a three-stage pipeline, 32-bit RISC processor. The processor architecture is Von Neumann load/store architecture, characterized by a single data and
address bus for instructions and data. The CPU has two instruction sets: the ARM and
the Thumb instruction set. The ARM instruction set has 32-bit wide instructions and provides maximum performance. Thumb instructions are 16-bit wide and give maximum
code density.
Instructions operate on 8-bit, 16-bit and 32-bit data types.
The CPU has seven operating modes. Each operating mode has dedicated banked registers for fast exception handling. The processor has a total of 37 32-bit registers,
including six status registers.
DSP Subsystem
The AT75C221 DSP subsystem is composed of:
•
An OakDSPCore running at 60 MIPS
•
2K x 16 of X-RAM
•
2K x 16 of Y-RAM
•
16K x 16 of General Purpose Data RAM
•
32K x 16 of Loadable Program RAM
•
One 256 x 16 Dual-port Mailbox
•
One Codec Interface
The DSP subsystem is fully autonomous. The local X- and Y-RAM allows it to reach its
maximum processing rate, and a local large data RAM enables complex DSP algorithms to be implemented. The large size of the loadable program RAM permits the use
of functions as complex as a low bit-rate vocoder.
During boot time, the ARM7TDMI core has the ability to maintain the OakDSPCore in
reset state and to upload DSP code. When the OakDSPCore reverts to an active state,
this code is executed.
When the OakDSPCore is running the dual-port mailbox is used as the communication
channel between the ARM7TDMI and the OakDSPCore.
A programmable codec interface is directly connected to the OakDSPCore. It allows the
connection of most industrial voice, multimedia or data codecs.
Ethernet MAC
The AT75C221 features two identical Ethernet MACs with the same attributes as
follows:
•
Compatible with IEEE Standard 802.3
•
10 and 100 Mbits per Second Data Throughput Capability
•
Full- and Half-duplex Operation
•
Media Independent Interface to the Physical Layer
•
Register Interface to Address, Status and Control Registers
•
DMA Interface
•
Interrupt Generation to Signal Receive and Transmit Completion
•
28-byte Transmit and 28-byte Receive FIFOs
•
Automatic Pad and CRC Generation on Transmitted Frames
13
6033CS–INTAP–05/04
•
Address Checking Logic to Recognize Four 48-bit Addresses
•
Supports Promiscuous Mode Where All Valid Frames are Copied to Memory
•
Supports Physical Layer Management through MDIO Interface
The Ethernet MAC is the hardware implementation of the MAC sub-layer OSI reference
model between the physical layer (PHY) and the logical link layer (LLC). It controls the
data exchange between a host and a PHY layer according to Ethernet IEEE 802.3u data
frame format. The Ethernet MAC contains the required logic and transmit and receive
FIFOs for DMA management. In addition, it is interfaced through MDIO/MDC pins for
PHY layer management. The Ethernet MAC transfers data in media-independent interface (MII).
Peripheral Multiplexing
on PIO Lines
The AT75C221 features two PIO Controllers, PIOA and PIOB, multiplexing I/O lines of
the peripheral set.
The PIO Controller A manages 32 I/O lines, PA0 to PA31, but only the I/O lines PA0 to
PA12 PA19 and PA22 are available in the 208-lead package.
The PIO Controller B manages only 16 I/O lines, PB0 to PB15, but only the I/O lines
PB0 to PB9 are available in the 208-lead package.
Each I/O line of a PIO Controller can be multiplexed with a peripheral I/O.
Power Supplies
The AT75C221 has three types of power supply pins:
•
VDDCORE pins power the core, including the ARM7TDMI processor, the DSP
subsystem, the memories and the peripherals; voltage is between 1.65V and 1.95V,
1.8V nominal.
•
VDDIO pins power the I/O lines, including those of the External Bus Interface and
those of the peripherals; voltage is between 3.0V and 3.6V, 3.3V nominal.
•
VDDOSC pins power the PLL and oscillator cells; voltage is between 1.65V and
1.95V, 1.8V nominal.
Ground pins are common to all power supplies.
System Controller
The AT75C221 features a System Controller, which takes care of and controls:
•
The Test Mode
•
The Reset
•
The Clocks of the System
•
The Chip Identifier
The System Controller manages the reset of the entire system and integrates a clock
generator made up of an oscillator and a PLL.
Memory Controller
The AT75C221 architecture is made up of two Advanced System Buses, the ARM ASB
and the MAC ASB. Both handle a single memory space.
The ARM ASB handles the access requests of the ARM7TDMI and the PDC. It handles
also the access requests coming from the MAC ASB. It connects with the External Bus
Interface, the Peripheral Bridge and the Internal Memories, including the mailbox with
the DSP Subsystem. It also connects with the MAC ASB.
The MAC ASB handles the access requests of the DMAs of both Ethernet MACs. It also
handles the access requests coming from the the ARM ASB. It connects essentially with
the Frame Buffer, but also connects with the ARM ASB.
14
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
The major advantage of this double-ASB architecture is that the Ethernet traffic does not
occupy the main ASB bandwidth, ensuring that the ARM7TDMI can perform at its maximum speed while the Ethernet traffic goes through the Frame Buffer.
Boot Program
The AT75C221 can boot in several ways; including from internal boot software and a
hardware connection of DataFlash. When the ARM7TDMI processor is released from
reset, it basically attempts a fetch from address 0x00000000. Depending on the hardware configuration, the memory mapping can be altered and thus modify how the
system boots.
Peripherals
The Peripheral Bridge allows access to the embedded peripheral user interfaces. It is
optimized for low power consumption, as it is built without usage of any clock. However,
any access on the peripheral is performed in two cycles.
The AT75C221 peripherals are designed to be programmed with a minimum number of
instructions. Each peripheral has 16K bytes of address space allocated in the upper part
of the address space.
PDC: Peripheral Data
Controller
The AT75C221 features a six-channel Peripheral Data Controller (PDC) dedicated to
the two on-chip UARTs and the SPI. One PDC channel is connected to the receiving
channel and one to the transmitting channel of each UART and of the SPI.
Each PDC channel operates as DMA (Direct Memory Access).
The User Interface of a PDC channel is integrated in the memory space of each peripheral. It contains a 32-bit address pointer register and a 16-bit count register. When the
programmed number of bytes is transferred, an end-of-transfer signal is sent to the
peripheral and is visible in the peripheral status register. This status bit might trigger an
interrupt.
EBI: External Bus
Interface
The External Bus Interface generates the signals which control access to external memories or peripheral devices. It contains two controllers: the SDRAM Controller and the
Static Memory Controller and manages the sharing of data and address buses between
both controllers.
SDRAMC: SDRAM
Controller
The SDRAM Controller extends the memory capabilities of a chip by providing the interface to an external 16- or 32-bit SDRAM device. The page size supports ranges from
2048 to 8192 and the number of columns from 256 to 2048. It supports byte (8-bit), halfword (16-bit) and word (32-bit) accesses. The maximum addressable SDRAM size is
256M bytes.
The SDRAM Controller supports a read or write burst length of one location. It keeps
track of the active row in each bank, thus maximizing SDRAM performance, e.g., the
application may be placed in one bank and data in the other banks. So as to optimize
performance, it is advisable to avoid accessing different rows in the same bank.
The SDRAM Controller’s function is to make the SDRAM device access protocol transparent to the user.
SMC: Static Memory
Controller
The AT75C221 features a Static Memory Controller that enables interfacing with a wide
range of external static memory on peripheral devices, including Flash, ROM, static
RAM, and parallel peripherals.
The SMC provides a glueless memory interface to external memory using common
address, data bus and dedicated control signals. The SMC is highly programmable and
15
6033CS–INTAP–05/04
has up to 24 bits of address bus, a 32- or 16-bit data bus and up to four chip select lines.
The SMC supports different access protocols allowing single clock-cycle accesses. The
SMC is programmed as an internal peripheral that has a standard APB bus interface
and a set of memory-mapped registers. It shares the external address and data buses
with the SDMC.
AIC: Advanced Interrupt
Controller
The AT75C221 integrates an Advanced Interrupt Controller (AIC) which is connected to
the fast interrupt request (nFIQ) and the standard interrupt request (nIRQ) inputs of the
ARM7TDMI processor. The processor’s nFIQ line can only be asserted by the external
fast interrupt request input (FIQ). The nIRQ line can be asserted by the interrupts generated by the on-chip peripherals and the two external interrupt request lines, IRQ0 to
IRQ1.
An 8-level priority encoder allows the user to define the priority between the different
interrupt sources. Internal sources are programmed to be level-sensitive or edge-triggered. External sources can be programmed to be positive- or negative-edge triggered
or high- or low-level sensitive.
PIO: Programmable I/O
Controller
The AT75C221 integrates 24 programmable I/O pins. Each pin can be programmed as
an input or an output. Each pin can also generate an interrupt. The programmable I/O is
implemented as two blocks, called PIO A and PIO B, 32 and 16 pins each, respectively.
These pins are used for several functions:
UART: Universal
Asynchronous Receiver
Transmitter
•
External I/O for internal peripherals
•
Keypad controller function
•
General-purpose I/O
The AT75C221 provides two identical full-duplex, Universal Asynchronous Receiver
Transmitters as UART A and UART B. These peripherals sit on the APB bus but are
also connected to the ASB bus (and hence external memory) via a dedicated DMA.
The main features of the UART are:
TC: Timer/Counter
•
Programmable Baud Rate Generator
•
Parity, Framing and Overrun Error Detection
•
Line Break Generation and Detection
•
Automatic Echo, Local Loopback and Remote Loopback Channel Modes
•
Interrupt Generation
•
Two Dedicated Peripheral Data Controller Channels
•
6-, 7- and 8-bit Character Length
•
Modem Control Signals
The AT75C221 features a timer/counter block which includes three identical 16-bit
timer/counter channels. Each channel can be independently programmed to perform a
wide range of functions including frequency measurement, event counting, interval measurement, pulse generation, delay timing and pulse-width modulation.
Each timer/counter channel has three external clock inputs, five internal clock inputs,
and two multi-purpose input/output signals that can be configured by the user. Each
channel drives an internal interrupt signal that can be programmed to generate processor interrupts via the AIC.
The timer/counter block has two global registers which act upon all three TC channels.
The Block Control Register allows the three channels to be started simultaneously with
16
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
the same instruction. The Block Mode Register defines the external clock inputs for
each timer/counter channel, allowing them to be chained.
SPI: Serial Peripheral
Interface
The Serial Peripheral Interface circuit is a synchronous serial data link that provides
communication with external devices in Master or Slave Mode. It also allows communication between processors if an external processor is connected to the system.
The Serial Peripheral Interface is essentially a shift register that serially transmits data
bits to other SPI's. During a data transfer, one SPI system acts as the “master”' which
controls the data flow, while the other system acts as the “slave'' which has data shifted
into and out of it by the master. Different CPU's can take turn being masters (Multiple
Master Protocol opposite to Single Master Protocol where one CPU is always the master while all of the others are always slaves), and one master may simultaneously shift
data into multiple slaves. However, only one slave may drive its output to write data
back to the master at any given time.
The main features of the SPI are:
•
Four Chip Selects with External Decoder Support Allow Communication with Up to
15 Peripherals
•
Serial Memories, such as DataFlash and 3-wire EEPROMs
•
Serial Peripherals, such as ADCs, DACs, LCD Controllers, CAN Controllers and
Sensors
•
External Coprocessors
•
Master or Serial Peripheral Bus Interface
•
8- to 16-bit Programmable Data Length Per Chip Select
•
Programmable Phase and Polarity Per Chip Select
•
Programmable Transfer Delays Between Consecutive Transfers and Between Clock
and Data Per Chip Select
•
Programmable Delay Between Consecutive Transfers
•
Selectable Mode Fault Detection
•
Connection to PDC Channel Capabilities Optimizes Data Transfers
•
One Channel for the Receiver, One Channel for the Transmitter
17
6033CS–INTAP–05/04
Ordering Information
Table 2 below provides package ordering information for the AT75C221.
Table 2. Ordering Information
18
Ordering Code
Package
Operating Temperature Range
AT75C221-Q208
PQFP208
0° to 70° C
AT75C221-C256
BGA256
0° to 70° C
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
Mechanical Characteristics and Packaging Information
BGA Packaging Information
Figure 6. AT75C221 BGA Package
∅ b
For BGA package data, see Table 3 on page 20,
19
6033CS–INTAP–05/04
BGA Package Data
.
Table 3. Dimensions (mm)
Symbol
Min
Nom
Max
A1
0.50
0.60
0.70
∅b
0.60
0.75
0.90
aaa
0.30
bbb
0.25
ccc
0.35
ddd
0.30
eee
0.15
A
1.92
2.13
2.34
B
0.28
0.32
0.38
D/E
26.8
27.0
27.2
D1/E1
24.0
24.7
e
1.27
f
8.05
20
AT75C221 Summary
6033CS–INTAP–05/04
AT75C221 Summary
PQFP Packaging Information
Figure 7. PQFP Package Drawing
C
C
1
For package data, see Table 4, Table 5 and Table 6 on page 22.
21
6033CS–INTAP–05/04
PQFP Package Data
Table 4. Dimensions (mm)
Symbol
Min
Nom
Max
c
0.11
c1
0.11
0.15
0.19
L
0.65
0.88
1.03
0.23
L1
1.60 REF
R2
0.13
R1
0.13
S
0.4
0.3
Tolerances of Form and Position
aaa
0.25
ccc
0.10
Table 5. Dimensions specific to PQFP Package (mm)
A
A1
A2
b
b1
Max
Min
Min
Nom
Max
Min
Max
Min
Nom
4.10
0.25
3.20
3.40
3.60
0.17
0.27
0.17
0.20
D
D1
E
E1
e
ddd
Max
BSC
BSC
BSC
BSC
BSC
BSC
0.23
31.20
28.00
31.20
28.00
0.50
0.10
Table 6. 208-lead PQFP Package Electrical Characteristics
Cs (pF)
R (mΩ)
Cm (pF)
Ls (nH)
Lm (nH)
Body
Size
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
28 x 28
53
71
1.4
1.7
0.56
0.73
6.7
8.4
3.9
5.1
22
AT75C221 Summary
6033CS–INTAP–05/04
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