Atmel AT24C16C I2C-Compatible, (2-Wire) Serial EEPROM 16-Kbit (2048 x 8) DATASHEET Standard Features Low-voltage and standard-voltage operation VCC = 1.7V to 5.5V Internally organized as 2,048 x 8 (16K) I2C-compatible (2-wire) serial interface Schmitt Trigger, filtered inputs for noise suppression Bidirectional data transfer protocol 1MHz (2.5V, 2.7V, 5V), 400kHz (1.7V) compatibility Write Protect pin for hardware data protection 16-byte Page Write mode Partial page writes allowed Self-timed write cycle (5ms max) High-reliability Endurance: 1,000,000 write cycles Data retention: 100 years Green package options (Pb/Halide-free/RoHS compliant) 8-lead PDIP, 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN, 5-lead SOT23, and 8-ball VFBGA Die options: wafer form and tape and reel Description The Atmel® AT24C16C provides 16,384 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 2,048 words of eight bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. AT24C16C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN, 5-lead SOT23, and 8-ball VFBGA packages and is accessed via a 2-wire serial interface. Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 1. Pin Configurations and Pinouts Table 1. Pin Configuration Pin Name Function NC No Connect SDA Serial Data SCL Serial Clock Input WP Write Protect GND Ground VCC Power Supply 8-lead SOIC 8-lead PDIP NC 1 8 VCC NC 1 8 VCC NC 2 7 WP NC 2 7 WP NC 3 6 SCL NC 3 6 SCL GND 4 5 SDA GND 4 5 SDA NC NC NC GND Top View Top View 8-lead TSSOP 8-pad UDFN/XDFN 1 2 3 4 VCC WP SCL SDA 8 7 6 5 Top View VCC 8 1 NC WP 7 2 NC SCL 6 3 NC SDA 5 4 GND Bottom View 5-lead SOT23 SCL 1 GND 2 SDA 3 5 4 8-ball VFBGA WP VCC Top View Note: 2. VCC 8 1 NC WP 7 2 NC SCL 6 3 NC SDA 5 4 GND Bottom View Drawings are not to scale. Absolute Maximum Ratings Operating Temperature . . . . . . . . . . .–55C to +125C Storage Temperature . . . . . . . . . . . .–65C to +150C Voltage on any pin with respect to ground . . . . . . . . . . . . . –1.0V to +7.0V Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V DC Output Current. . . . . . . . . . . . . . . . . . . . . . . 5.0mA *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 2 3. Block Diagram VCC GND WP Start Stop Logic SDA Serial Control Logic Device Address Comparator Data Latches Load COMP Read/Write A2 High Voltage Pump & Timing Enable INC Data Word ADDR/Counter A1 Row Decoder SCL EEPROM Array Column Decoder Serial MUX DOUT / ACK Logic DIN DOUT 4. Pin Description Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open-collector devices. Device/Page Addresses: The AT24C16C does not use the device address pins, which limits the number of devices on a single bus to one (see Section 7. “Device Addressing” on page 9). Write Protect (WP): AT24C16C has a Write Protect pin that provides hardware data protection. The Write Protect pin allows normal Read/Write operations when connected to Ground (GND). When the Write Protect pin is connected to VCC, the Write Protection feature is enabled and operates as shown in Table 4-1. Table 4-1. Write Protect Part of the Array Protected WP Pin Status AT24C16C At VCC Full Array At GND Normal Read/Write Operations Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 3 5. Memory Organization AT24C16C, 16K Serial EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires a 11-bit data word address for random word addressing. Table 5-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25°C, f = 1.0MHz, VCC = 5.5V. Symbol Test Condition CI/O CIN Note: 1. Table 5-2. Max Units Conditions Input/Output capacitance (SDA) 8 pF VI/O = 0V Input capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V This parameter is characterized and is not 100% tested. DC Characteristics Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted). Symbol Parameter Max Units VCC1 Supply Voltage 5.5 V ICC Supply Current VCC = 5.0V Read at 100kHz 0.4 1.0 mA ICC Supply Current VCC = 5.0V Write at 100kHz 2.0 3.0 mA ISB1 Standby Current VCC = 1.7V VIN = VCC or VSS 1.0 μA ISB2 Standby Current VCC = 5.5V VIN = VCC or VSS 6.0 μA ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA VIL Input Low Level(1) –0.6 VCC x 0.3 V VIH Input High Level(1) VCC x 0.7 VCC + 0.5 V VOL2 Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V VOL1 Output Low Level VCC = 1.7V IOL = 0.15mA 0.2 V Note: 1. Test Condition Min Typ 1.7 VIL min and VIH max are reference only and are not tested. Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 4 Table 5-3. AC Characteristics Applicable over recommended operating range from TAI = -40C to 85C, VCC = +1.7V to 5.5V, CL = 1TTL Gate and 100pF (unless otherwise noted). 1.7V Min 2.5V, 2.7V, 5.0V Symbol Parameter Max Min fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low 1.2 0.4 μs tHIGH Clock Pulse Width High 0.6 0.4 μs tI Noise Suppression Time tAA Clock Low to Data Out Valid 0.1 tBUF Time the bus must be free before a new transmission can start. 1.2 0.5 μs tHD.STA Start Condition Hold Time 0.6 0.25 μs tSU.STA Start Condiition Setup Time 0.6 0.25 μs tHD.DAT Data In Hold Time 0 0 μs tSU.DAT Data In Setup Time 100 100 ns 400 100 (1) 0.9 0.05 Max Units 1000 kHz 50 ns 0.55 μs tR Inputs Rise Time tF Inputs Fall Time(1) tSU.STO Stop Condition Setup Time 0.6 .25 μs tDH Data Out Hold Time 50 50 ns tWR Write Cycle Time 5 Endurance(1) 3.3V, 25C, Page Mode 1,000,000 Note: 1. 0.3 0.3 μs 300 100 ns 5 ms Write Cycles This parameter is ensured by characterization only. Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 5 6. Device Operation Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 6-4 on page 8). Data changes during SCL high periods will indicate a Start or Stop Condition as defined below. Start Condition: A high-to-low transition of SDA with SCL high is a Start Condition which must precede any other command (see Figure 6-5 on page 8). Stop Condition: A low-to-high transition of SDA with SCL high is a Stop Condition. After a read sequence, the Stop Condition command will place the EEPROM in a standby power mode (see Figure 6-5 on page 8). Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. Standby Mode: The AT24C16C features a low-power standby mode which is enabled: Upon power-up. After the receipt of the Stop Condition and the completion of any internal operations. 2-wire Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be reset by following these steps: 1. Create a Start Condition, 2. Clock nine cycles, 3. Create another Start Condition followed by Stop Condition as shown below. The device is ready for next communication after above steps have been completed. Figure 6-1. Software Reset Dummy Clock Cycles SCL 1 Start Condition 2 3 8 9 Start Condition Stop Condition SDA Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 6 Figure 6-2. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O tHIGH tF tR tLOW SCL tSU.STA tLOW tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA tDH tBUF SDA OUT Figure 6-3. Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th bit ACK WORDn (1) tWR Stop Condition Notes: 1. Start Condition The write cycle time tWR is the time from a valid Stop Condition of a Write sequence to the end of the internal clear/write cycle. Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 7 Figure 6-4. Data Validity SDA SCL Data Stable Data Stable Data Change Figure 6-5. Start Condition and Stop Condition Definition SDA SCL Start Condition Stop Condition Figure 6-6. Output Acknowledge 1 SCL 8 9 DATA IN DATA OUT Start Condition Acknowledge Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 8 7. Device Addressing Standard EEPROM Access: The 16K EEPROM device requires an 8-bit device address word following a Start Condition to enable the chip for a Read or Write operation. The device address word consists of a mandatory “1010” (Ah) sequence for the first four Most Significant Bits (MSB) as shown in Figure 10. on page 12. This is common to all the EEPROM devices. The next three bits used for memory page addressing are the most significant bits of the data word address which follows. The eighth bit of the device address is the Read/Write operation select bit. A Read operation is initiated if this bit is high and a Write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state. Figure 7-1. Device Address Density Access Area 16K EEPROM Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 0 1 0 P2 P1 P0 R/W MSB 8. LSB Write Operations Byte Write: A Write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the Write sequence with a Stop Condition. At this time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the Write is complete (see Figure 8-1). Figure 8-1. Byte Write S T A R T Device Address W R I T E Word Address S T O P Data SDA Line M S B R A / C W K A C K A C K Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 9 Page Write: The 16K EEPROM devices are capable of a 16-byte Page Write. A Page Write is initiated in the same way as a Byte Write, but the microcontroller does not send a Stop Condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the Page Write sequence with a Stop Condition (see Figure 8-2). The data word address lower four bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than eight data words are transmitted to the EEPROM, the data word address will roll-over and previous data will be overwritten. Figure 8-2. Page Write S T A R T Device Address W R I T E Word Address (n) Data (n) Data (n + 1) S T O P Data (n + x) SDA Line R A / C W K M S B A C K A C K A C K A C K Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled, Acknowledge Polling can be initiated. This involves sending a Start Condition followed by the device address word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the Read or Write sequence to continue. 9. Read Operations Read operations are initiated in the same way as Write operations with the exception that the Read/Write select bit in the device address word is set to one. There are three read operations: Current Address Read Random Address Read Sequential Read. Current Address Read: The internal data word address counter maintains the last address accessed during the last Read or Write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address roll-over during Read is from the last byte of the last memory page to the first byte of the first page. The address roll-over during Write is from the last byte of the current page to the first byte of the same page. Once the device address with the Read/Write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input zero but does generate a following Stop Condition (see Figure 9-1). Figure 9-1. Current Address Read S T A R T Device Address R E A D S T O P Data SDA Line M S B R A / C W K N O A C K Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 10 Random Read: A Random Read requires a Dummy Byte Write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another Start Condition. The microcontroller now initiates a Current Address Read by sending a device address with the Read/Write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following Stop Condition (see Figure 9-2). Figure 9-2. Random Read S T A R T W R I T E Device Address S T A R T Word Address (n) Device Address R E A D S T O P Data (n) SDA Line M S B R A / C W K A C K A C K N O A C K Dummy Write Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address Read. After the microcontroller receives a data word, it responds with an Acknowledge. As long as the EEPROM receives an Acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will roll-over and the Sequential Read will continue. The Sequential Read operation is terminated when the microcontroller does not respond with a zero but does generate a following Stop Condition (see Figure 9-3). Figure 9-3. Sequential Read Device Address R E A D Data (n) Data (n + 1) Data (n + 2) S T O P Data (n + x) SDA Line R A / C WK A C K A C K A C K N O A C K Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 11 10. Ordering Code Detail AT2 4 C 1 6 C - S S H M - B Atmel Designator Shipping Carrier Option B or blank = Bulk (Tubes) T = Tape and Reel Product Family 24C = Standard Serial EEPROM Operating Voltage M = 1.7V to 5.5V Package Device Grade or Wafer/Die Thickness Device Density H 16 = 16K U Device Revision 11 = Green, NiPdAu Lead Finish, Industrial Temperature Range (-40˚C to +85˚C) = Green, Matte Sn Lead Finish, Industrial Temperature Range (-40˚C to +85˚C) = 11mil Wafer Thickness Package Option P = SS = X = MA = ME = ST = C = WWU = PDIP JEDEC SOIC TSSOP UDFN XDFN SOT23 VFBGA Wafer Unsawn Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 12 11. Product Markings AT24C16C: Package Marking Information 8-lead TSSOP 8-lead SOIC 8-lead PDIP 8-pad UDFN 2.0 x 3.0 mm Body ATMLUYWW ###% @ AAAAAAAA ATMLHYWW ###% @ AAAAAAAA 8-pad XDFN 8-ball VFBGA 5-lead SOT-23 1.8 x 2.2 mm Body 1.5 x 2.0 mm Body ###%U Top Mark ### YXX ###U YMXX YMXX Note 1: ### H%@ YXX ATHYWW ###% @ AAAAAAA Bottom Mark PIN 1 designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT24C16C Truncation Code ###: 16C Date Codes Y = Year 3: 2013 4: 2014 5: 2015 6: 2016 Voltages 7: 2017 8: 2018 9: 2019 0: 2020 M = Month A: January B: February ... L: December WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Assembly Lot Number @ = Country of Assembly AAA...A = Atmel Wafer Lot Number % = Minimum Voltage M: 1.7V min Grade/Lead Finish Material H: Industrial/NiPdAu U: Industrial/Matte Tin/SnAgCu Trace Code Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) Example: AA, AB.... YZ, ZZ AT: Atmel ATM: Atmel ATML: Atmel 7/8/13 TITLE Package Mark Contact: [email protected] 24C16CSM, AT24C16C Package Marking Information DRAWING NO. REV. 24C16CSM D Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 13 12. Ordering Codes 12.1 AT24C16C Ordering Information Atmel Ordering Code AT24C16C-PUM Lead Finish Package Bulk Form Only (Lead-free/Halogen-free) 8P3 Voltage Operation Range 1.7V to 5.5V Industrial Temperature (–40C to 85C) AT24C16C-SSHM-B(1) 8S1 AT24C16C-SSHM-T (2) AT24C16C-XHM-B(1) NiPdAu (Lead-free/Halogen-free) 8X AT24C16C-XHM-T(2) AT24C16C-MAHM-T(2) 8MA2 AT24C16C-MEHM-T(2) — 8ME1 AT24C16C-STUM-T(2) Matte Sn (Lead-free/Halogen-free) 5TS1 AT24C16C-CUM-T(2) SnAgCu (Lead-free/Halogen-free) 8U3-1 — Wafer Sale AT24C16C-WWU11M(3) Notes: 1. 2. 3. B = Bulk T = Tape and Reel SOIC = 4K per reel TSSOP, UDFN, XDFN, SOT23, and VFBGA = 5K per reel For Wafer sales, please contact Atmel Sales. Package Type 8P3 8-lead, 0.300" wide, Plastic Dual Inline (PDIP) 8S1 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.40mm body, Plastic Thin Shrink Small Outline (TSSOP) 8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN) 8ME1 8-lead, 1.80mm x 2.20mm body, 0.40mm pitch, Extra Thin Dual Flat No Lead (XDFN) 5TS1 5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23) 8U3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Die Ball Grid Array (VFBGA) Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 14 13. Packaging Information 8P3 — 8-lead PDIP E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A SYMBOL MIN MAX NOM A b2 L b3 b 4 PLCS Side View NOTE 2 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 D1 0.005 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 0.150 2 0.100 BSC eA 0.300 BSC 0.115 3 3 e L Notes: 0.210 0.130 4 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 06/21/11 Package Drawing Contact: [email protected] TITLE GPC DRAWING NO. 8P3, 8-lead, 0.300” Wide Body, Plastic Dual In-line Package (PDIP) PTC 8P3 Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 REV. D 15 13.1 8S1 — 8-leadJEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. SYMBOL MIN A 1.35 NOM MAX – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° 6/22/11 Package Drawing Contact: [email protected] TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. REV. 8S1 G Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 16 13.2 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e A2 MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 E1 4.30 4.40 4.50 3, 5 b 0.19 – 0.30 4 SYMBOL D Side View Notes: COMMON DIMENSIONS (Unit of Measure = mm) 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. E NOTE 2, 5 6.40 BSC e 0.65 BSC L 0.45 0.60 0.75 L1 1.00 REF C 0.09 - 0.20 6/22/11 TITLE Package Drawing Contact: [email protected] 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) GPC TNR DRAWING NO. 8X Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 REV. D 17 13.3 8MA2 — 8-pad UDFN E 1 8 Pin 1 ID 2 7 3 6 4 5 D C A2 A A1 E2 COMMON DIMENSIONS (Unit of Measure = mm) b (8x) SYMBOL 8 1 7 2 Pin#1 ID 6 D2 3 5 4 e (6x) L (8x) K MIN NOM D 2.00 BSC E 3.00 BSC MAX D2 1.40 1.50 1.60 E2 1.20 1.30 1.40 A 0.50 0.55 0.60 A1 0.0 0.02 0.05 A2 – – 0.55 C L NOTE 0.152 REF 0.30 0.35 e 0.40 0.50 BSC b 0.18 0.25 0.30 K 0.20 – – 3 7/15/11 Package Drawing Contact: [email protected] TITLE 8MA2, 8-pad, 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) GPC YNZ DRAWING NO. 8MA2 Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 REV. B 18 13.4 8ME1 — 8-pad XDFN D 7 8 6 5 E PIN #1 ID 2 1 3 4 A1 Top View A Side View e1 b L COMMON DIMENSIONS (Unit of Measure = mm) 0.10 PIN #1 ID 0.15 b e End View SYMBOL MIN NOM MAX A – – 0.40 A1 0.00 – 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 e 0.40 TYP e1 1.20 REF L 0.26 0.30 NOTE 0.35 9/10/2012 Package Drawing Contact: [email protected] TITLE GPC DRAWING NO. REV. 8ME1, 8-pad (1.80mm x 2.20mm body) Extra Thin DFN (XDFN) DTP 8ME1 B Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 19 13.5 5TS1 — 5-lead SOT23 e1 C 4 5 E1 C L E L1 1 3 2 END VIEW TOP VIEW b A2 SEATING PLANE e A A1 D SIDE VIEW COMMON DIMENSIONS (Unit of Measure = mm) 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information. SYMBOL MIN A A1 A2 c D E E1 L1 e e1 b 0.00 0.70 0.08 NOM 0.90 2.90 BSC 2.80 BSC 1.60 BSC 0.60 REF 0.95 BSC 1.90 BSC 0.30 - MAX 1.00 0.10 1.00 0.20 0.50 NOTE 3 1,2 1,2 1,2 3,4 5/31/12 Package Drawing Contact: [email protected] TITLE GPC 5TS1, 5-lead 1.60mm Body, Plastic Thin Shrink Small Outline Package (Shrink SOT) TSZ DRAWING NO. 5TS1 Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 REV. D 20 13.6 8U3-1 — 8-ball VFBGA E D 2. b PIN 1 BALL PAD CORNER A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 3 2 1 4 d (d1) 8 7 6 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) SYMBOL MIN NOM MAX BOTTOM VIEW A 0.73 0.79 0.85 8 SOLDER BALLS A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 Notes: b 0.20 0.25 0.30 1. This drawing is for general information only. D 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. NOTE 2 1.50 BSC E 2.0 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 3/27/12 Package Drawing Contact: [email protected] TITLE GPC DRAWING NO. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, VFBGA Package GXU 8U3-1 Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 REV. E 21 14. Revision History Doc. Rev. Date 8719B 07/2013 8719A 09/2010 Comments Minor grammetical corrections. Update Atmel logos and template. Initial document release. Atmel AT24C16C [DATASHEET] Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013 22 X X X X Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2013 Atmel Corporation. All rights reserved. / Rev.: Atmel-8719B-SEEPROM-AT24C16C-Datasheet_042013. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. 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