DISCRETE SEMICONDUCTORS DATA SHEET M3D574 PESD5V2S18U ESD protection array Product specification 2003 Apr 28 Philips Semiconductors Product specification ESD protection array FEATURES PESD5V2S18U PINNING • Uni-directional ESD protection of up to 18 lines PIN DESCRIPTION 1 to 5 cathode (k1 to k5) • Maximum peak reverse power: PPP = 100 W at tp = 8/20 µs 6 and 16 • Low clamping voltage: VCL = 12 V max. at IZSM = 10 A 7 to 15 cathode (k6 to k14) 17 to 20 cathode (k15 to k18) common anode (a1; a2) • Low leakage current: IR = 100 nA typ. at VRWM = 5.2 V • IEC 61000-4-2, level 4 (ESD); 15 kV (air) and 8 kV (contact). handbook, 4 columns 1 20 2 19 APPLICATIONS 3 18 • Printer parallel ports 4 17 • Computers and peripherals 5 16 • Communication systems. 6 15 7 14 8 13 9 12 10 11 1 20 DESCRIPTION Monolithic ESD protection device designed to protect up to 18 transmission or data lines from the damage caused by electrostatic discharge (ESD) and surge pulses. 10 11 MHC510 Fig.1 Simplified outline (SSOP20; SOT339-1) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT IPP non-repetitive peak reverse current tp = 8/20 µs − 10 A PPP non-repetitive peak reverse power dissipation tp = 8/20 µs − 100 W Tstg storage temperature −65 +150 °C Tj +150 °C IEC 61000-4-2 (contact discharge) 30 −65 − kV HBM MIL-Std 883 − kV junction temperature electrostatic discharge voltage ESD standards compliance IEC 61000-4-2, level 4 (ESD) >15 kV (air); >8 kV (contact) HBM MIL-Std 883, class 3 >4 kV 2003 Apr 28 2 10 Philips Semiconductors Product specification ESD protection array PESD5V2S18U THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER CONDITIONS thermal resistance from junction to ambient VALUE UNIT 135 K/W one or more diodes loaded Note 1. Refer to SOT339-1 standard mounting conditions. ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER VRWM crest working reverse voltage IR reverse current VCL clamping voltage VBR breakdown voltage rdiff differential resistance Cd diode capacitance 2003 Apr 28 CONDITIONS MIN. TYP. MAX. UNIT − − 5.2 V VRWM = 5.2 V − 0.1 1 µA IZSM = 3 A; tp = 8/20 µs; see Fig.5 − − 8 V IZSM = 10 A; tp = 8/20 µs; see Fig.5 − − 12 V IZ = 5 mA 6.4 6.8 7.2 V IZ = 1 mA − − 40 Ω IZ = 5 mA − − 8 Ω VR = 0; f = 1 MHz; see Fig.4 − 100 − pF 3 Philips Semiconductors Product specification ESD protection array PESD5V2S18U MHC485 103 handbook, halfpage MHC486 102 handbook, halfpage PZSM (W) IZSM (A) 102 10 10 10−2 Fig.2 10−1 1 tp (ms) 1 10−2 10 Maximum non-repetitive peak reverse power as a function of pulse duration. Fig.3 MHC487 110 10−1 1 tp (ms) 10 Maximum non-repetitive peak reverse current as a function of pulse duration. MHC488 11 handbook, halfpage handbook, Cd halfpage VCL (V) (pF) 100 10 90 80 9 70 60 8 50 7 40 0 1 2 3 4 5 3 6 4 VR (V) f = 1 MHz; Tamb = 25 °C tp = 8/20 µs Fig.4 Fig.5 Diode capacitance as a function of reverse voltage; typical values. 2003 Apr 28 4 5 6 7 8 9 10 IPP(A) Clamping voltage as a function of peak reverse pulse current; typical values. Philips Semiconductors Product specification ESD protection array PESD5V2S18U ESD TESTER RZ 450 Ω RG 223/U 50 Ω coax CZ DIGITIZING OSCILLOSCOPE 10× ATTENUATOR 50 Ω note 1 Note 1: attenuator is only used for open socket high voltage measurements IEC 1000-4-2 network CZ = 150 pF; RZ = 330 Ω 1/18 PESD5V2S18U vertical scale = 200 V/Div horizontal scale = 50 ns/Div vertical scale = 5 V/Div horizontal scale = 50 ns/Div GND GND unclamped +1 kV ESD voltage waveform (IEC 1000−4−2 network) clamped +1 kV ESD voltage waveform (IEC 1000−4−2 network) GND GND vertical scale = 200 V/Div horizontal scale = 50 ns/Div unclamped −1 kV ESD voltage waveform (IEC 1000−4−2 network) vertical scale = 5 V/Div horizontal scale = 50 ns/Div clamped −1 kV ESD voltage waveform (IEC 1000−4−2 network) Fig.6 ESD clamping test set-up and waveforms. 2003 Apr 28 5 MHC489 Philips Semiconductors Product specification ESD protection array PESD5V2S18U PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8 0o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 2003 Apr 28 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 6 o Philips Semiconductors Product specification ESD protection array PESD5V2S18U DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Apr 28 7 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/01/pp8 Date of release: 2003 Apr 28 Document order number: 9397 750 10889