INTEGRATED CIRCUITS DATA SHEET TEA0677T Dual pre-amplifier and equalizer for reverse tape decks Product specification File under Integrated Circuits, IC01 August 1993 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0677T FEATURES GENERAL DESCRIPTION • Head pre-amplifiers The TEA0677T is a monolithic bipolar integrated circuit intended for applications in car radios. It includes head and equalization amplifiers with electronically switchable time constants. Furthermore it includes electronically switchable inputs for tape drives with reverse heads. The device is intended to replace the regular TEA0675T in low-cost car radios using the same PCB. External components that are necessary for Dolby B and music search features can be omitted. • Reverse head switching • Equalization with electronically switched time constants • 0 dB = 387.5 mV • Pin compatible to TEA0675 Dolby B, music search IC. The device will operate with power supplies in the range of 7.6 V to 12.0 V, output overload level increasing with increase in supply voltage. Current drain varies with supply voltage, so it is advisable to use a regulated power supply or a supply with a long time constant. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC supply voltage 7.6 10 12 V ICC supply current − 23 26 mA (S + N)/N signal-plus-noise to noise ratio 68 74 − dB ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TEA0677T 24 SO plastic SOT137A(1) Note 1. SOT137-1; 1996 August 27. August 1993 2 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors Dual pre-amplifier and equalizer for reverse tape decks August 1993 3 Product specification Fig.1 Block and application diagram. TEA0677T Instead of potentiometers at EQ AMP fixed resistors may be used. The value depends on applied heads. Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0677T PINNING SYMBOL PIN DESCRIPTION OUTA 1 output channel A n.c. 2 not connected n.c. 3 not connected n.c. 4 not connected n.c. 5 not connected n.c. 6 not connected EQA 7 equalizing output channel A EQFA 8 equalizing input channel A VCC 9 supply voltage INA1 10 input channel A1 (forward or reverse) VREF 11 reference voltage INA2 12 input channel A2 (reverse or forward) INB2 13 input channel B2 (reverse or forward) HS 14 head switch input INB1 15 input channel B1 (forward or reverse) GND 16 ground EQFB 17 equalizing input channel B EQB 18 equalizing output channel B EQS 19 equalizing switch input n.c. 20 not connected ACUR 21 auxiliary current n.c. 22 not connected n.c. 23 not connected OUTB 24 output channel B Fig.2 Pin configuration. Time constant switching for equalization (70 µs/120 µs) is achieved when pin 19 (EQS) is connected to ground via an 18 kΩ resistor (120µs) or left open-circuit (70 µs). FUNCTIONAL DESCRIPTION Head switching is achieved when pin 14 (HS) is connected to GND via a 27 kΩ resistor (inputs INA2, INB2 active), or left open-circuit (inputs INA1, INB1 active). The 10 µF capacitor at pin 14 sets the time constant for smooth switching. August 1993 4 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0677T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER MIN. MAX. UNIT VCC DC supply voltage 0 16 V VI input voltage (pin 1 to 24) except pin 11 (VREF) to VCC −0.3 VCC V tshort pin 11 (VREF) to VCC short-circuiting duration − 5 s Tamb operating ambient temperature −40 +85 °C Tstg storage temperature −65 +150 °C Ts soldering temperature (wave solder for 10 s at lead) − 260 °C Ves electrostatic handling (note 1) − − − Note to the Limiting values 1. Classification A: human body model; C = 100 pF, R = 1.5 kΩ, V ≥ 2 kV; charge device model; C = 200 pF, R = 0 Ω, V ≥ 500 V. CHARACTERISTICS VCC = 10 V; f = 20 Hz to 20 kHz; Tamb = +25 °C; all levels are referenced to 387.5 mV (RMS; 0 dB) at output; see Fig.1; EQ switch in the 70 µs position; unless otherwise specified. SYMBOL PARAMETER VCC supply voltage ICC supply current CONDITIONS pins 10, 12, 13 and 15 MIN. TYP. MAX. UNIT 7.6 10 12 V − 23 26 mA connected to VREF THD channel matching f = 1 kHz; VO = 0 dB −0.5 − +0.5 dB total harmonic distortion 2nd and 3rd f = 1 kHz; VO = 0 dB − 0.04 0.1 % harmonic f = 10 kHz; VO = 6 dB − 0.08 0.15 % VCC = 7.6 V; 12 14 − dB 45 50 − dB f = 1 kHz; VO = +10 dB; 64 70 − dB head room at output THD = 1%; f = 1 kHz PSRR power supply ripple rejection αCS channel separation 0.25 V (RMS); f = 1 kHz; see Fig.3 see Fig.4 αCC crosstalk between active and inactive input f = 1 kHz; VO = +10 dB 70 77 − dB RLmin minimum load resistance at output f = 1 kHz; VO = 12 dB; 10 − − kΩ 29 30 31 dB THD = 1% Gv voltage gain (pre-amplifier) from input pins 10, 12, 13 and 15 to pin EQF Voff input offset voltage − 2 − mV IB input bias current − 0.1 0.4 µA REQ equalizing resistor 4.7 5.8 6.9 kΩ RI input resistance head inputs 60 100 − kΩ August 1993 f = 1 kHz 5 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks SYMBOL AV N PARAMETER TEA0677T CONDITIONS MIN. TYP. MAX. UNIT open-loop gain pins INA1/INA2 to pin OUTA f = 10 kHz 80 86 − dB pins INB1/INB2 to pin OUTB f = 400 Hz 104 110 − dB unweighted; − 0.7 1.4 µV 68 74 − dB − − ±0.15 V equivalent noise voltage input (RMS value) 20 Hz to 20 kHz; Rsource = 0 Ω (S+N)/N signal-plus-noise to noise ratio internal gain 40 dB linear; CCIR/ARM weighted; see Fig.4 DC output voltage; pins 1 (OUTA) reference to VREF; and 16 (OUTB) tape head DC coupled IOGND DC output current capability to ground −2 − − mA IOVCC DC output current capability to VCC 300 − − µA ZO output impedance − 80 100 Ω Switching thresholds Equalization (pin 19) VEQS voltage at pin EQS − − 5 V IEQ70 70 µs input current − − −150 µA IEQ120 120 µs input current −250 − −1000 µA Head switch (pin 14) VIN1 inputs INA1 and INB1 active 0.65VCC 0.775VCC 1.0VCC V IIN1 maximum input current −150 90 µA VIN2 inputs INA2 and INB2 active 0.1VCC 0.225VCC 0.35VCC V IIN2 maximum input current −50 −90 note 1 150 −150 µA Note to the characteristics 1. For an application with a fixed EQ time constant of 120 µs the equalizing network may be applied completely external. In this application the 8.2 kΩ resistor has to be changed to 14 kΩ and the internal resistor REQ = 5.8 kΩ must be short-circuited by fixing the EQ-switch input at the 70 µs position (pin 19; EQS left open-circuit). To activate the inputs INA1 and INB1 pin 10 (HS) may be left open-circuit. In this event the DC level at pin 10 (HS) is 0.775 VCC. General note It is recommended to switch off VCC with a gradient of 400 V/s at maximum to avoid plops on tape in the event of contact between tape and tape head while switching off. August 1993 6 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors Dual pre-amplifier and equalizer for reverse tape decks August 1993 7 Product specification TEA0677T Fig.3 Test circuit for power supply ripple rejection. This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors Dual pre-amplifier and equalizer for reverse tape decks August 1993 8 Product specification TEA0677T Fig.4 Test circuit for channel separation and signal-to-noise ratio. Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0677T Fig.5 PCB layout example. August 1993 9 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks Table 1 TEA0677T Component list pcb layout example. COMPONENT VALUE R1, R11 270 kΩ R2, R12 180 kΩ R3, R13, R20 1.5 kΩ R4, R14 24 kΩ R5, R15 8.2 kΩ R6, R16 330 kΩ R7, R17 1 kΩ R8, R18 0.18 kΩ R9 68 kΩ to 1000 kΩ R10 27 kΩ R19 18 kΩ R21, R22 0 kΩ C1, C11, C7, C17, C20 10 µF C2, C12 330 nF C3, C13 100 nF C4, C14 15 nF C5, C15 4.7 nF C6, C16 10 nF C8, C9, C18, C19 0.47 nF C10 100 µF August 1993 10 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0677T PACKAGE OUTLINE SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD August 1993 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 11 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0677T SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. August 1993 12 Philips Semiconductors Product specification Dual pre-amplifier and equalizer for reverse tape decks TEA0677T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1993 13