DISCRETE SEMICONDUCTORS DATA SHEET andbook, halfpage M3D391 KMI16/1 Integrated rotational speed sensor Preliminary specification File under Discrete Semiconductors, SC17 1998 May 15 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 FEATURES PINNING • Open collector output signal PIN DESCRIPTION • Zero speed capability 1 • Wide air gap VCC 2 Vout • Wide temperature range 3 GND • Insensitive to vibration • EMC resistant. handbook, halfpage DESCRIPTION The KMI16/1 sensor detects rotational speed of ferrous gear wheels and reference marks. The sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a magnetized ferrite magnet. The frequency of the digital current output signal is proportional to the rotational speed of a gear wheel. CAUTION Do not press two or more products together against their magnetic forces. 1 2 3 MBK766 Fig.1 Simplified outline (SOT477B). QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC DC supply voltage 4.5 12 16.5 V Vout (low) remaining open collector voltage − − 0.5 V ICC DC supply current 6.5 10 12 mA dmax maximum sensing distance − 2 − mm ft operating tooth frequency 0 − 25000 Hz Tamb ambient operating temperature −40 − +150 °C 1998 May 15 target wheel m = 2 mm 2 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS Tamb = −40 to +150 °C; Iout (low) = 20 mA MIN. MAX. UNIT − 16 V output voltage −0.5 +10 V Tstg storage temperature −40 +150 °C Tamb ambient operating temperature −40 +150 °C Tsld soldering temperature − 260 °C VCC DC supply voltage Vout t ≤ 10 s CHARACTERISTICS Tamb = 25 °C; VCC = 12 V; d = 1.9 mm; ft = 2 kHz; test circuit: see Fig.5; sensor positioning: see Fig.11; gear wheel: module 2 mm; material 1.0715; see Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT remaining open collector voltage Iout (low) = 10 mA − − 0.5 V Iout (low) = 20 mA − − 1 V tr output signal rise time 10 to 90% value − 11.5 − µs tf output signal fall time 10 to 90% value − 0.3 − µs td switching delay time between stimulation pulse (generated by a coil) and output signal − 1 − µs ft operating tooth frequency for both rotation directions 0 − 25000 Hz dmin minimum sensing distance target wheel m = 2 mm; see Fig.11; and note 1 − 0.3 − mm dmax maximum sensing distance target wheel m = 2 mm; see Fig.11; and note 1 − 2 − mm δ duty cycle 30 50 70 % Vout (low) Note 1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.13). 1998 May 15 3 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 FUNCTIONAL DESCRIPTION The KMI16/1 sensor is sensitive to the motion of ferrous gear wheels or reference marks. The functional principle is shown in Fig.3. Due to the effect of flux bending, the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. Because of the chosen sensor orientation and the direction of ferrite magnetization, the KMI16/1 is sensitive to movement in the ‘y’ direction in front of the sensor only (see Fig.2). handbook, halfpage x x magnet with direction of magnetization y The magnetoresistive sensor element signal is amplified, temperature compensated and passed to a Schmitt trigger in the conditioning integrated circuit (Fig 4). The digital output signal level is independent of the sensing distance within the measuring range (Fig.10). A (3-wire) output current enables safe transfer of the sensor signal to the detecting circuit (see Fig.5). The integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures. z sensor IC MBK767 Fig.2 Component detail of the KMI16/1. gear wheel handbook, full pagewidth direction of motion magnetic field lines magnet z y sensor MRA957 (a) (b) (c) Fig.3 Functional principle. 1998 May 15 4 (d) Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 handbook, full pagewidth VCC VOLTAGE CONTROL SENSOR SCHMITT TRIGGER AMPLIFIER Vout open collector output GND MGL348 Fig.4 Block diagram. VCC handbook, halfpage 2.7 kΩ 10 kΩ SENSOR Vout 2.2 nF ICC MGL347 Fig.5 Test and application circuit. 1998 May 15 5 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 APPLICATION INFORMATION Gear Wheel Dimensions Mounting conditions SYMBOL The recommended sensor position in front of a gear wheel is shown in Fig.11. The distance ‘d’ is measured between the sensor front and the tip of a gear wheel tooth. The KMI16/1 senses ferrous indicators like gear wheels in the ± y direction only (no rotational symmetry of the sensor); see Fig.2. The effect of incorrect mounting positions on sensing distance is shown in Figs 7, 8 and 9. The symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. German DIN UNIT z number of teeth d diameter m module m = d/z mm p pitch p = π × m mm PD pitch diameter (d in inch) inch DP diametric pitch DP = z/PD inch−1 CP circular pitch CP = π/DP inch mm ASA; note 1 Environmental conditions Due to eddy current effects the sensing distance depends on the tooth frequency (Fig.13). The influence of gear wheel module on the sensing distance is shown in Fig.12. 1998 May 15 DESCRIPTION Note 1. For conversion from ASA to DIN: m = 25.4 mm/DP; p = 25.4 mm × CP. 6 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 MRA998 4 handbook, halfpage d (mm) pitch 3 handbook, halfpage 2 y pitch diameter d MRA964 1 0 0 1 2 3 4 y (mm) pitch diameter module = -----------------------------------------number of teeth VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm. pitch = module × π Fig.7 Sensing distance as a function of positional tolerance in the y-axis; typical values. Fig.6 Gear wheel dimensions. MRA999 4 MRA982 4 handbook, halfpage handbook, halfpage d (mm) d (mm) 3 3 2 x 2 Θ d d 1 1 10 mm 0 0 1 2 3 Θ (deg) 4 0 −6 −4 −2 0 VCC = 12 V; ft = 2 kHz; module = 2 mm. VCC = 12 V; ft = 2 kHz; module = 2 mm. Fig.8 Fig.9 Sensing distance as a function of positional tolerance; typical values. 1998 May 15 7 2 4 6 x (mm) Sensing distance as a function of positional tolerance in the x-axis; typical values. Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 MRA962 4 handbook, halfpage d (mm) sensor handbook, halfpage d d 3 2 d gear wheel 1 MRA963 0 −50 0 50 100 150 200 Tamb (oC) VCC = 12 V; ft = 2 kHz; module = 2 mm. Fig.10 Sensing distance as a function of ambient temperature; typical values. Fig.11 Sensor positioning. MRA966 1.5 MRA965 4 handbook, halfpage handbook, halfpage d (mm) d d0 3 1 2 tooth frequency d ft 0.5 1 0 0 1 2 3 0 0 4 5 module m (mm) 1 2 3 4 f (kHz) do = measuring distance for a gear wheel with module m = 2 mm. VCC = 12 V; module = 2 mm. Fig.12 Normalized maximum sensing distance as a function of gear wheel module; typical values. 1998 May 15 Fig.13 Sensing distance as a function of tooth frequency; typical values. 8 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 PACKAGE OUTLINE Plastic single-ended combined package; magnetoresistive sensor element; bipolar IC; magnetized ferrite magnet (5.5 x 5.5 x 3.0 mm); 3 in-line leads M1 SOT477B v M A B HE1 K B A Q E A L1 M2 bp1 D L v M A B E1 M3 HE D1 L2 1 2 e1 3 bp c 0 2.5 5 mm e scale DIMENSIONS (mm are the original dimensions) UNIT A bp bp1 c D(1) mm 1.7 1.4 0.8 0.7 1.57 1.47 0.3 0.24 4.1 3.9 D1(1) E(1) 5.7 5.5 4.5 4.3 E1(1) e e1 HE HE1 K max. L L1 L2 M1 M2 M3 Q v 5.7 5.5 4.6 4.4 2.35 2.15 18.2 17.8 5.6 5.5 5.37 7.55 7.25 1.2 0.9 3.9 3.5 8.15 7.85 8.15 7.85 4.7 4.3 0.75 0.65 0.25 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT477B 1998 May 15 EUROPEAN PROJECTION ISSUE DATE 98-05-12 9 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 May 15 10 Philips Semiconductors Preliminary specification Integrated rotational speed sensor KMI16/1 NOTES 1998 May 15 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1998 SCA60 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 115106/1200/01/pp12 Date of release: 1998 May 15 Document order number: 9397 750 03883