IA
NT
Features
CO
M
PL
■
*R
oH
S
■
■
■
■
■
SIP (Single In-line Package)
Output voltage programmable from
0.75 Vdc to 5.5 Vdc via external resistor
Up to 6 A output current
Up to 92 % efficiency
Small size, low profile, cost-efficient open
frame design
Low output ripple and noise
■
■
■
■
■
■
High reliability
Remote on/off
Output overcurrent protection
(non-latching)
Constant switching frequency (300 kHz)
Wide operating temperature range
Sequencing function
SXT6A-12SA SIP Non-Isolated Power Module
How to Order
Description
Bourns SXT6A-12SA is a non-isolated DC-DC converter offering
designers a cost and space-efficient solution with standard
features such as remote on/off, precisely regulated programmable
output voltage, overcurrent and over-temperature protection, and
output voltage sequencing. These modules deliver up to 6 A of
output current with load efficiency of 92 % at 5 V output.
S X T 6A - 12 S A (-P)
®
Configuration
• S = SIP
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
• S = Single
Output Voltage (V)*
• A = Adjustable
Optional Positive On/Off Logic
*Fixed output voltage parts and optional features available; contact factory.
Absolute Maximum Ratings
Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if
exposed to absolute maximum ratings for extended time periods.
Characteristic
Min.
Max.
Units
Continuous Input Voltage
-0.3
15.0
Vdc
Operating Temperature Range
-40
+85
°C
Storage Temperature
-55
+125
°C
Sequencing Function
-0.3
Vin, max.
Vdc
Notes & Conditions
See Thermal Considerations section
Electrical Specifications
Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions.
Characteristic
Min.
Nom.
Max.
Units
Vdc
Adc
Over Vin range, Io max, Vout = 5 Vdc
30
65
mA
mA
Vin = 12 Vdc, Io = 0 A, mod. enabled,
-Vout = 0.75 Vdc
-Vout = 5.0 Vdc
1.8
mA
A2s
Operating Input Voltage
8.3
14.0
Maximum Input Current
-
4.5
Input No Load Current
Input Stand-by Current
Inrush Transient
0.4
Input Reflected Ripple Current
30
mAp-p
Input Ripple Rejection
30
dB
Notes & Conditions
Vin = 5.0 Vdc, module disabled
120 Hz
Caution: The power modules are not internally fused. An external input line fast acting fuse with a maximum rating of 6 A is required.
See the Safety Considerations section of this data sheet.
Applications
■
■
■
Intermediate Bus architecture
Distributed power applications
Workstations and servers
■
■
■
Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
1
SXT6A-12SA SIP Non-Isolated Power Module
Electrical Specifications (Continued)
Characteristic
Min.
Output Voltage Setpoint Accuracy
Output Voltage Tolerance
Voltage Adjustment Range
Nom.
Max.
Units
Notes & Conditions
-2.0
2.0
% Vo,set
-3.0
3.0
% Vo,set
Vin min, Io max, TA = 25 °C
Over all rated in out voltage, load and
temperature conditions
0.7525
5.5
Line Regulation
0.3
Vdc
% Vo,set
Load Regulation
0.4
% Vo,set
Temperature Regulation
Output Current
0.4
0.0
% Vo,set
6.0
Adc
Output Current Limit Inception (Hiccup Mode)
200
% Io max
Output Short Circuit Current
2.0
Adc
Output Ripple and Noise Voltage
RMS
Peak-to-Peak
15
50
External Capacitance
- ESR ≥ 1 mΩ
- ESR ≥ 10 mΩ
30
75
mVrms
mVpk-pk
1000
3000
µF
µF
Vo≤ 250 mV – Hiccup Mode
1 µF ceramic/10 µF tantalum capacitors
5 Hz to 20 MHz bandwidth
Efficiency
(Vin = 5 Vdc, TA= 25 °C, Full Load)
81.0
84.0
86.0
88.0
90.0
92.0
%
%
%
%
%
%
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Switching Frequency
300
kHz
Dynamic Load Response
2.5 A to 5 A; 5 A to 2.5 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
200
25
mV
µs
1 µF ceramic/10 µF tantalum capacitor
Peak Deviation
Settling Time (Vo<10 % peak deviation)
2.5 A to 5 A; 5 A to 2.5 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
50
50
mV
µs
3 x 100 µF polymer capacitors
Peak Deviation
Settling Time (Vo<10 % peak deviation)
Nom.
Units
Notes & Conditions
15,000,000
hours
3.5
(0.12)
g
(oz.)
General Specifications
Characteristic
Calculated MTBF
Weight
2
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SXT6A-12SA SIP Non-Isolated Power Module
Feature Specifications
Characteristic
Min.
Remote Enable
Open = On (Logic Low)
Low = Off (Logic High)
>2.5
Turn-On Delay and Rise Times
Case 1: On/Off Low – Vin Applied
Case 2: Vin Applied, then On/Off Set Low
Case 3: Output Voltage Rise
Sequencing Delay Time
Tracking Accuracy
Nom.
Max.
Units
0.4
14
Vdc
Vdc
2.5
2.5
3.0
msec
msec
msec
10
msec
100
200
Output Voltage Overshoot
200
400
mV
mV
1
% Vo, set
Overtemperature Protection
135
°C
Input Undervoltage Lockout
-Turn-on Threshold
-Turn-off Threshold
7.45
7.15
V
V
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Notes & Conditions
10 µA max.
1 mA max.
(10 %-90 % of Vo setting)
Delay from Vin, min. to application of
voltage on SEQ pin
Power Up: 2 V/ms
Power Down: 1 V/ms
Io max, Vin=5.5, TA=25 °C
See Thermal Consideration section
3
SXT6A-12SA SIP Non-Isolated Power Module
Characteristic Curves
The curves provided below are typical characteristics for the SXT6A-12SA modules at 25 °C. For any specific test configurations or any
specific test requests, please contact Bourns.
100.0
100.0
Vin=14 V
Vin=12 V
Vin=8.3 V
95.0
Efficiency (%)
Efficiency (%)
95.0
90.0
85.0
80.0
90.0
85.0
80.0
70.0
1.0
2.0
3.0
4.0
Output Current (A dc)
5.0
70.0
1.0
6.0
100.0
Efficiency (%)
Efficiency (%)
85.0
80.0
2.0
3.0
4.0
Output Current (A dc)
5.0
85.0
80.0
70.0
1.0
6.0
Fig. 2 Efficiency vs. Output Current (Vout = 1.5 Vdc )
Vin=14 V
Vin=12 V
Vin=8.3 V
2.0
3.0
4.0
Output Current (A dc)
5.0
6.0
Fig. 5 Efficiency vs. Output Current (Vout = 3.3 Vdc )
100.0
100.0
Vin=14 V
Vin=12 V
Vin=8.3 V
95.0
Efficiency (%)
95.0
90.0
85.0
80.0
75.0
70.0
1.0
6.0
90.0
75.0
70.0
1.0
5.0
95.0
90.0
75.0
Efficiency (%)
3.0
4.0
Output Current (A dc)
100.0
Vin=14 V
Vin=12 V
Vin=8.3 V
95.0
2.0
Fig. 4 Efficiency vs. Output Current (Vout = 2.5 Vdc )
Fig. 1 Efficiency vs. Output Current (Vout = 1.2 Vdc )
90.0
85.0
80.0
Vin=14 V
Vin=12 V
Vin=8.3 V
75.0
2.0
3.0
4.0
Output Current (A dc)
5.0
Fig. 3 Efficiency vs. Output Current (Vout = 1.8 Vdc )
4
Vin=14 V
Vin=12 V
Vin=8.3 V
75.0
75.0
6.0
70.0
1.0
2.0
3.0
4.0
Output Current (A dc)
5.0
6.0
Fig. 6 Efficiency vs. Output Current (Vout = 5.0 Vdc )
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SXT6A-12SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
Output Voltage
Vo (100 mV/div)
4.0
3.0
2.5
2.0
1.5
Output Current
Io (1.8 A/div)
Input Current (A)
Output Voltage (Vdc )
3.5
1.0
Iin, Adc
Vo, Vdc
0.5
0.0
6
8
10
Input Voltage (V)
12
14
Output Voltage: 100 mVolt 5 µs
Output Current (1.8 A/Div): 2 Volt 5 µs
Time (5 µs/div)
Fig. 10 Transient Response - 3 A - 6 A Step
(Vo = 3.3 Vdc )
No Load: 10 mVolt 2.5 µs
Half Load: 10 mVolt 2.5 µs
Full Load: 10 mVolt 2.5 µs
Output Current
Io (1.8 A/div)
Output Voltage
Vo (10 mV/div)
Output Voltage
Vo (100 mV/div)
Fig. 7 Input Voltage vs. Io and Vo
(Vo = 3.3 V, Io = 6.0 A)
Time (2.5 µs/div)
Output Voltage: 100 mVolt 5 µs
Output Current (1.8 A/Div): 2 Volt 5 µs
Time (5 µs/div)
Fig. 8 Typical Output Ripple and Noise
(Vin = 12.0 V, Vo = 0.75 V, Io = 6.0 A)
No Load: 50 mVolt 2.5 µs
Half Load: 50 mVolt 2.5 µs
Full Load: 50 mVolt 2.5 µs
Time (2.5 µs/div)
Fig. 9 Typical Output Ripple and Noise
(Vin = 12.0 V, Vo = 3.3 V, Io = 6.0 A)
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Current
Io (1.8 A/div)
Output Voltage
Vo (50 mV/div)
Output Voltage
Vo (100 mV/div)
Fig. 11 Transient Response - 6 A - 3 A Step
(Vo = 3.3 Vdc )
Output Voltage: 100 mVolt 10 µs
Output Current (1.8 A/Div): 2 Volt 10 µs
Time (10 µs/div)
Fig. 12 Transient Response - 3 A - 6 A Step
(Vo = 3.3 Vdc , Cext = 2x100 µF Polymer Capacitors)
5
SXT6A-12SA SIP Non-Isolated Power Module
Output Voltage: 100 mVolt 10 µs
Output Current (1.8 A/Div): 2 Volt 10 µs
On/Off Voltage
Von/off (5 V/div)
On/Off Voltage
Von/off (2 V/div)
Output Voltage
Vo (1 V/div)
Output Voltage
Vo (0.5 V/div)
Time (10 µs/div)
Fig. 13 Transient Response - 6 A - 3 A Step
(Vo = 3.3 Vdc , Cext = 2x100 µF Polymer Capacitors)
Output Voltage
Vo (1 V/div)
Output Current
Io (1.8 A/div)
Output Voltage
Vo (100 mV/div)
Input Voltage
V in (5 V/div)
Characteristic Curves (Continued)
Output Voltage: 1 Volt 1 ms
On/Off Voltage: 5 Volt 1 ms
Output Voltage
Vo (1 V/div)
Time (1 ms/div)
Fig. 16 Typical Start-up with Application of Vin
(Vin = 12 Vdc , Vo = 3.3 Vdc , Io = 6 A)
Output Voltage:
500 mVolt 1 ms
On/Off Voltage:
2 Volt 1 ms
Time (1 ms/div)
Fig. 17 Typical Start-up using Remote On/Off with Prebias
(Vin = 12 Vdc , Vo = 1.8 Vdc , I o = 1 A, Vbias = 0.75 Vdc )
Output Current
Io (4 A/div)
On/Off Voltage
Von/off (2 V/div)
Time (1 ms/div)
Fig. 14 Typical Start-up using Remote On/Off
(Vin = 12 Vdc, Vo = 3.3 Vdc, Io = 6 A)
Output Voltage:
1 Volt 1 ms
Input Voltage:
5 Volt 1 ms
Output Voltage:
1 Volt 1 ms
On/Off Voltage:
2 Volt 1 ms
Time (1 ms/div)
Fig. 15 Typical Start-up using Negative Remote On/Off
with Low-ESR External Capacitors (100x100 µF Polymer)
Output Current (4 A/div): 20 mVolt 25 ms
Time (5 ms/div)
Fig. 18 Output Short Circuit Current
(Vin = 12.0 Vdc , Vo = 0.75 Vdc )
(Vin = 12.0 Vdc , Vo = 3.3 Vdc , Io = 6.0 A, Co = 1000 µF)
6
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SXT6A-12SA SIP Non-Isolated Power Module
7
7
6
5
5
6
0 LFM
100 LFM
200 LFM
4
3
2
1
Output Current (A)
Output Current (A)
Characteristic Curves (Continued)
0
15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C)
4
3
2
1
0 LFM
100 LFM
200 LFM
300 LFM
400 LFM
0
15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C)
Fig. 19 Derating Output Current vs.
Local Ambient Temp. and Airflow
Fig. 22 Derating Output Current vs.
Local Ambient Temp. and Airflow
(Vin = 12.0 Vdc , Vo = 0.75 Vdc )
(Vin = 12.0 Vdc , Vo = 3.3 Vdc )
6
0 LFM
100 LFM
200 LFM
300 LFM
400 LFM
25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C)
Output Current (A)
Output Current (A)
7
7
6
5
4
3
2
1
0
15 20
5
4
3
2
1
0 LFM
100 LFM
200 LFM
300 LFM
400 LFM
0
15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C)
Fig. 20 Derating Output Current vs.
Local Ambient Temp. and Airflow
Fig. 23 Derating Output Current vs.
Local Ambient Temp. and Airflow
(Vin = 12.0 Vdc , Vo = 1.8 Vdc )
(Vin = 12.0 Vdc , Vo = 5.0 Vdc )
Output Current (A)
7
6
5
4
3
2
0 LFM
100 LFM
200 LFM
300 LFM
400 LFM
1
0
15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C)
Fig. 21 Derating Output Current vs.
Local Ambient Temp. and Airflow
(Vin = 12.0 Vdc , Vo = 2.5 Vdc )
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
7
SXT6A-12SA SIP Non-Isolated Power Module
Operating Information
Remote On/Off
The SXT6A-12SA comes standard with Active LOW Negative On/Off logic, i.e., OPEN or LOW (< 0.4 V) will turn ON the device.
To turn the device OFF, increase the voltage level on the On/Off pin above 2.4 V, as shown in Figure 23, placing the part into low
dissipation sleep mode.
The SXT6A-12SA-P comes with Active HIGH Positive On/Off logic, i.e., OPEN or HIGH (>2.4 V) will turn on the device. To turn OFF,
decrease the voltage level on the On/Off pin below 0.4 V.
The signal levels of the On/Off pin input is defined with respect to ground.
SXT6A-12SA
Fig. 24(a) Circuit Configuration for using
Negative Logic On/Off
SXT6A-12SA-P
Fig. 24(b) Circuit Configuration for using
Positive On/Off
Input Considerations
The input must have a stable low impedance AC source for optimum performance. This can be accomplished with external ceramic
capacitors, tantalum capacitors and/or polymer capacitors. Using low impedance tantalum capacitors requires about 20 µF per amp
and an ESR of 250 mΩ per amp of output current. Tantalum capacitors with a combined value of 150 µF and less than 40mΩ ESR
would be adequate. This can be implemented with (1) 150 µF tantalum capacitors with an ESR less than of 40mΩ. Ceramic capacitors
are also recommended to reduce high frequency ripple on the input.
Output Considerations
To maintain the specified output ripple and transient response, external capacitors must be used. An external 1 µF ceramic capacitor in
parallel with a 10 µF low ESR tantalum capacitor will usually meet the specified performance. Improved performance can be achieved
by using more capacitance. Low ESR polymer capacitors may also be used. Two 100 µF, 9 mΩ or lower ESR capacitors are
recommended.
Safety Information
In order to comply with safety requirements the user must provide a fuse in the unearthed input line. This is to prevent earth being
disconnected in the event of a failure.
The converter must be installed as per guidelines outlined by the various safety approvals if safety agency approval is required for the
overall system. The positive input lead must be provided with a fact acting fuse with a maximum rating of 6 A.
Overtemperature Protection
The device will shut down if it becomes too hot (typically 135 °C - at controller IC). Once the converter cools, it automatically restarts.
This feature does not guarantee the converter won’t be damaged by temperatures above its rating.
8
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SXT6A-12SA SIP Non-Isolated Power Module
Operating Information (Continued)
Overcurrent Protection
The device has an internally set output current limit to protect it from overloads, placing the unit in hiccup mode. Once the overload is
removed the converter automatically resumes normal operation. No user adjustments are available. An external fuse in series with the
input voltage is also required for complete overload protection.
Input Undervoltage Lockout
The device operation is disabled if the input voltage drops below the specified input range. Once the input returns to the specified
range operation automatically resumes. No user adjustments are available.
Output Voltage Setting
The output voltage can be programmed to any voltage between 0.75 Vdc and 5.5 Vdc by connecting a single resistor between the trim
pin and the GND pin of the module, as shown in Fig. 25 below.
If left open circuit the output voltage will default to 0.75 Vdc. The correct Rtrim value for a specific voltage can be calculated using the
following equation:
Rtrim = [10.5/(Vo-0.7525)-1] KΩ
For example, to set the SXT6A-12SA to 3.3 V the following
Rtrim resistor must be used:
VIN (+)
VO (+)
ON/OFF
TRIM
LOAD
Rtrim
Rtrim = [10.5/(3.3-0.7525)-1] KΩ
GND
Rtrim = 3.122 kΩ,
The closest standard 1 % E96 value is 3.09 kΩ.
Table 1 provides the Rtrim values required for some common output
voltage set points. The nearest standard E96 1 % resistor value is also given.
Vo (V)
0.75
1.2
1.5
1.8
2.5
3.3
5.0
SXT6A-12SA Rtrim Values
Rtrim (kΩ)
Open
22.46
13.05
9.024
5.009
3.122
1.472
Fig. 25 Circuit Configuration to Program Output
Voltage using an External Resistor
1 % Value
Open
22.6
13.0
9.09
4.99
3.09
1.47
Table 1
The output voltage of the device can also be set by applying a voltage between the TRIM and GND pins. The Vtrim equation can be
written as follows:
Vtrim = (0.7 – 0.0667 x{Vo – 0.7225))
To set Vo = 3.3 V, the Vtrim required would therefore be 0.530 V.
Table 2 provides the Vtrim values required for some common output voltage set points.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
9
SXT6A-12SA SIP Non-Isolated Power Module
Operating Information (Continued)
Vo (V)
0.75
1.2
1.5
1.8
2.5
3.3
5.0
SXT6A-12SA Vtrim Values
Vtrim (V)
Open
0.670
0.650
0.630
0.583
0.530
0.4166
Table 2
Voltage Margining
Output voltage margining can be implemented as follows and as shown in Figure 26.
1) Trim-up: Connect a resistor, Rm-up, from the Trim pin to the ground pin for adjusting the voltage upwards, and
2) Trim-down: Connect a resistor, Rm-down, from the Trim pin to the output pin for adjusting the voltage downwards.
Please consult your local Bourns field applications engineer for more details and the calculation of the required resistor values.
Vo
Vo
Vin
Rmargin-down
Q2
On/Off
Trim
Rmargin-up
Rtrim
Q1
COM
Fig. 26 Circuit Configuration for Margining Output Voltage
Sequencing Function
Bourns XT Series modules have a sequencing feature that enables users to implement various types of output voltage sequencing in
their applications. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the
set-point voltage. The final SEQ pin voltage must be set higher than the set-point voltage of the module. The output voltage follows the
voltage on the SEQ pin on a one-to-one basis. By connecting multiple modules together, customers can get multiple modules to track
their output voltages to the voltage applied on the SEQ pin.
For proper voltage sequencing, the input voltage is applied to the module. The On/Off pin should be set so as the module is ON by
default. An analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a 1:1 basis until
output reaches the set-point voltage, as shown in Figure 27.
To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the
modules tracks the voltages below their set-point voltages on a one-to-one basis, as shown in Figure 28. A valid input voltage must be
maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules.
When not using the sequencing feature, tie the SEQ pin to Vout. For additional guidelines please contact your local Bourns field
applications engineer.
10
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SXT6A-12SA SIP Non-Isolated Power Module
Vo: 1 Volt 500 µs
Vseq: 1 Volt 500 µs
Time (0.5 ms/div)
Fig. 27 Voltage Sequencing at Power Up
(Vin = 5.0 Vdc, Vo = 3.3 Vdc, I o = 6.0 A)
Output Voltage Sequencing Voltage
V seq (0.5 V/div)
Vo (0.5 V/div)
Output Voltage Sequencing Voltage
Vo (0.5 V/div)
V seq (0.5 V/div)
Operating Information (Continued)
Vo: 1 Volt 1 ms
Vseq: 1 Volt 1 ms
Time (0.5 ms/div)
Fig. 28 Voltage Sequencing at Power Down
(Vin = 5.0 Vdc, Vo = 3.3 Vdc, Io = 6.0 A)
Thermal Considerations
Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments.
Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration.
The data presented in Figures 19 to 22 is based on physical test results taken in a wind tunnel test. The test set-up is shown in
Figure 29.
The thermal reference points are (1) Tref1 = temperature at dual Mosfet as shown in Figure 26, and (2) Tref2 = temperature at controller
IC. For reliable operation, neither Tref1 or Tref2 should exceed 115 °C.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
11
SXT6A-12SA SIP Non-Isolated Power Module
Thermal Considerations (Continued)
Air
Flow
Tref1
Air Flow
WIND TUNNEL
Airflow and ambient
temp sensor probes
location
8.1 (0.32)
76.2 (3.0)
Q1
C4
L1
C2
UNIT UNDER TEST
C1
C3
PCB
Fig. 29 Tref1 Temperature Measurement Location
Fig. 30
Thermal Test Set-up
25.4 (1.0)
Product Dimensions
SIDE VIEW
BACK VIEW OF BOARD
25.4
(1.0000)
6.53
(0.257)
MAX.
12.70
(0.5000)
12.32
(0.4850)
5
4
A
3
2
1
DIMENSIONS:
MM
(INCHES)
5 PINS
Die-Tech 315-0969-00
0.64
0.38
X
(0.025) (0.015)
7.6
(0.30)
2.54
(0.100)
2.54
(0.100)
(
12.7
(0.500)
15.24
(0.600)
17.78
(0.700)
20.32
(0.800)
PIN
1
2
3
A
4
5
6.26
(0.246)
REF.
TOLERANCES:
0.5
(0.02)
0.25
DECIMAL .XX ±
(0.010)
DECIMAL .X ±
FUNCTION
VOUT
TRIM
GND
SEQ
VIN
ON/OFF
L1 (REF.)
0.64
(0.025)
5.62
(0.2210)
Fig. 31 Product Dimensions
12
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
SXT6A-12SA SIP Non-Isolated Power Module
Recommended Pad Layout
COMPONENT SIDE FOOTPRINT
25.4
(1.0000)
OUTLINE AREA
5.8
(0.23)
6.6
(0.26)
2.54
(0.100)
2.54
(0.100)
12.7
(0.500)
15.24
(0.600)
1.09
(0.043)
PLATED
THROUGH-HOLE
1.63
(0.064)
PAD SIZE
BOTH SIDES
DIMENSIONS:
MM
(INCHES)
PIN
1
2
3
A
4
5
FUNCTION
VOUT
TRIM
GND
SEQ
VIN
ON/OFF
17.78
(0.700)
20.32
(0.800)
Fig. 32 Recommended Pad Layout
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www.bourns.com
LONGFORM REV. A 03/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
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