PL IA NT CO M *R oH S Features Applications ■ RoHS compliant* ■ HDMI 1.4 ■ ESD protection >25 kV ■ Digital Visual Interface (DVI) ■ Low capacitance <0.05 pF ■ USB 3.0 / USB OTG ■ Low leakage current <5 nA ■ Memory protection ■ SIM card ports ChipGuard® MLU Series - ESD Protectors General Information Device Symbol The ChipGuard® MLU Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLU family has been designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. V The ChipGuard® MLU Series has been manufactured to provide low 0.05 pF capacitance and leakage currents less than 5 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics @ 25 °C (unless otherwise noted) CG0402MLU / CG0603MLU (Note 3) Parameter Typical Continuous Operating Voltage Symbol 3.3x 05x 12x 24x Unit VDC 3.3 5 12 24 V Typical Clamping Voltage (Note 1) VC 25 Maximum Capacitance @ 1 VRMS 1 MHz CO 0.05 pF Maximum Leakage Current @ Max. VDC 5 nA Typical Trigger Voltage (Note 2) IL VT 250 V Maximum ResponseTime RT 1 ns ±8 ±15 kV kV ESD Protection: Per IEC 61000-4-2 Min. Contact Discharge (>1000 Reps) Min. Air Discharge (>1000 Reps) V Operating Temperature TOPR -40 to +125 ˚C Storage Temperature TSTG -55 to +150 ˚C Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. Part number suffix “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard® MLU Series - ESD Protectors Product Dimensions Recommended Pad Layout A A W DIMENSIONS: MM (INCHES) B B C L D CG0402 Series CG0603 Series L 1.00 ± 0.15 (0.04 ± 0.006) 1.60 ± 0.20 (0.064 ± 0.008) W 0.50 ± 0.10 (0.02 ± 0.004) A B Dimension CG0402 Series CG0603 Series A 0.51 (0.020) 0.76 (0.030) 0.80 ± 0.20 (0.032 ± 0.008) B 0.61 (0.024) 1.02 (0.040) 0.36 ± 0.05 (0.014 ± 0.002) 0.45 ± 0.10 (0.018 ± 0.004) C 0.51 (0.020) 0.50 (0.020) 0.25 ± 0.15 (0.10 ± 0.006) 0.30 ± 0.20 (0.012 ± 0.008) D 1.70 (0.067) 2.54 (0.100) Dim. Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling A Stage 1 Preheat Temperature (°C) 250 200 150 B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s Stage 3 Preheat Preheat to 200 °C 20 s to 40 s D Main Heating 200 °C 210 °C 220 °C 230 °C 240 °C 60 s to 70 s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s 50 110 sec. (min.) 30-70 sec. 30 s to 60 s C 100 0 Ambient to Preheating Temperature 120 sec. (min.) Time (seconds) • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. ChipGuard® MLU Series - ESD Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) 8.00 ± 0.30 (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) C 1.50 ± 0.10 (0.06 ± 0.004) 62.0 ± 1.50 (2.48 ± 0.06) 2.0 ± 0.50 (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP TAPE G W D 21.0 ± 0.80 (0.84 ± 0.032) 3.50 ± 0.05 (0.14 ± 0.002) NOTES: TAPE MATERIAL IS PAPER. 0.60 ± 0.05 TAPE THICKNESS IS (0.024 ± 0.002) COVER TAPE ADHESION IS 40 ± 15 GRAMS. DIMENSIONS: MM (INCHES) 9.0 ± 0.50 (0.36 ± 0.02) CG0402 Series CG0603 Series C 1.75 ± 0.05 (0.04 ± 0.002) 1.75 ± 0.10 (0.04 ± 0.004) D 2.00 ± 0.02 (0.08 ± 0.0008) 2.00 ± 0.05 (0.08 ± 0.002) L 1.12 ± 0.03 (0.045 ± 0.0012) 1.80 ± 0.20 (0.072 ± 0.008) W 0.62 ± 0.03 (0.025 ± 0.0012) 0.90 ± 0.20 (0.036 ± 0.008) G 2.0 ± 0.05 (0.08 ± 0.002) 4.0 ± 0.05 (0.16 ± 0.002) Dimension 180.8 ± 2.0 (7.12 ± 0.08) How to Order CG 0402 MLU - 12 G ® ChipGuard Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 3.3 = 3.3 V 05 = 5 V 12 = 12 V 24 = 24 V Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) REV. G 11/09 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Asia-Pacific: TEL +886-2 25624117 • FAX +886-2 25624116 Europe: TEL +41-41 7685555 • FAX +41-41 7685510 The Americas: TEL +1-951 781-5500 • FAX +1-951 781-5700 www.bourns.com