This is the PDF file of catalog No.R82E-2. APPLICATION MANUAL R82E2.pdf 97.09.29 This is the PDF file of catalog No.R82E-2. Contents 1. Features of Murata Chip Trimmer Potentiometers 2. Specifications 1. Precautions in Storage 1. Considerations in Design 2. Standard Land Patterns 1. One Side Chip Mounting 2. Both Side Chip Mounting 3. Mixed Mounting of Chip Components and Leaded Components 1. Solder Paste Stenciling 2. Mounting the Product 3. Compatibility with Chip Placers 4. Sensor Level Adjustment 5. Reflow Soldering 6. Adhesive Application and Curing Types and Characteristics of Adhesive 7. Flux Coating Types and Characteristics of Flux 8. Wave Soldering 9. Soldering and Resoldering with a Soldering Iron 10. Cleaning 1. Adjustments 2. Automatic Adjustments 3. Lock Painting Ex.1. Poor Contact Caused by Flux Adhesion Ex.2. Cracking of the Substrate Ex.3. Poor Contact Caused by a Deformed Driver Plate R82E2.pdf 97.09.29 This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Features of Murata Chip Trimmer Potentiometers POZ3 Series POZ3AN (Top adjustment type for reflow soldering) Driver plate Wiper Terminal (2) Resistive element (carbon) Terminal (1) Resin substrate Terminal (3) POZ3KN (Rear adjustment type for reflow soldering) Driver plate Terminal (2) Terminal (1) Wiper Terminal (3) Resistive element (carbon) Resin substrate RVG3 Series RVG3S08 (for reflow soldering) Driver plate Wiper Stopper Terminal (2) Stopper Resistive element (cermet) Terminal (1) Terminal (3) Ceramic substrate This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 RVG3A08 (for flow and reflow soldering) Driver plate Wiper Terminal (2) Resistive element (cermet) Terminal (1) Ceramic substrate Terminal (3) RVG4M Series RVG4M (for flow and reflow soldering) Terminal (2) Driver plate Wiper Rubber Ceramic substrate Terminal (1) Resistive element (cermet) Terminal (3) POG5 Series POG5 (for reflow soldering) Gear Case Terminals(1) and (3) Adjustment screw Terminal (2) Wiper Ceramic substrate Resistive element (cermet) This is the PDF file of catalog No.R82E-2. 82E2.pdf 97.09.29 2. Specifications POZ3 Series RVG3 Series RVG4M Series POG5 Series Triangular No. of terminals 3 (divider type) Adjustment method Carbon 1 Automatic Manual Soldering Reflow soldering Flow soldering Gold plating(nickel undercoating) Electrode surface treatment Solder plating (nickel undercoating) Solder plating (copper undercoating) 3 mm square Size 4 mm square 5 mm square 1.50mm 1.85mm Product thickness 2.00mm 2.10mm 3.70mm 5.00mm 0.040g(40mg) Product weight 0.080g(80mg) 0.180g(180mg) Cleaning Necessary 2 Not necessary Lock painting Possible Not possible 250 pcs./reel Taping packaging (reel with a diameter of 180 mm) 500 pcs./reel 1500 pcs./reel 2000 pcs./reel 2500 pcs./reel (2) (3) They can be used as the rheostat type by connecting lands (2) and (3). (2 terminals (rheostat type) (1) 1 (1) 2 Cleaning is needed only when there is an adhesion of foreign matter such as flux on the resistive element. 3 Only terminal (2) is gold-plated with a nickel undercoat. (2) ) N PO G5 H N G5 A 3 G4 M 3 G4 M 3 PO 58 08 08 3 G3 A 3K N RV Terminal layout RV Cermet RV Resistive element material RV G3 S0 8 Item PO Z PO Z 3A N Series This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Precautions in Storage Electrode Surface Treatment Series Storage Environment Storage Method Storage Period Electrode surface treatment POZ3 Gold plating (nickel undercoating) RVG3 RVG4M Terminals (1) & (3): Solder plating (nickel undercoating) Terminal (2) : Gold plating (nickel undercoating) POG5 Solder plating (copper undercoating) This is the PDF file of catalog No.R82E-2. 82E2.pdf 97.09.29 1. Considerations in Design Land Pattern Area Both Side Chip Mounting PCB Layout Through hole 10 mm or more 10 mm or more Other Considerations 10 mm or more 2. Standard Land Patterns POZ3AN 1.15 3.1 (2) 0.25 0.1 0.1max. 1.1 (2) 1.9 1 4 3.8 3.2 2.4 0.1 3.0 3.6 0.5 0.1 (1) 0.75 1.85 0.1 2.2 1.0 (3) 1.0 0.75 (1) (3) 1.0 0.7 1.0 0.3 ( Standard tolerance:in mm ) 0.1 ( Standard tolerance:in mm ) This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 POZ3KN 2.1 1.85 0.1 0.25 0.1 Part to be soldered 2.4 0.1 0 1.5 (2) 6.0 1.0 5.4 4.4 0.5 0.1 1.15 2.2 3.0 3.0 1.1 0.85 0.9 0.85 1.0 3.0 3.1 (2) (1) (3) 3.2 1.25 0.5 1.25 0.3 ( Standard tolerance:in mm ) (3) 0.1 ( Standard tolerance:in mm ) (1) RVG3S08 3.0 2.3 0.1 1.0 (2) 1.2 3.0 1.5 1.25 1.6 (2) 4.1 0.3 0.1 0.85 Part to be soldered 0.9 1 Driver plate rotation area 1.5 (3) 1.1 0.8 (1) 2.2 (1) 1.1 (3) 4.6 1.5 3.9 0.5 0.1 2 1 (0.3) 1.75 1.1 0.8 1.1 0.3 ( Standard tolerance:in mm ) 0.7 1.1 0.7 0.1 ( Standard tolerance:in mm ) RVG3A08 2.2 1.85 0.1 3.0 2.4 0.1 1.2 3.0 0.3 0.1 0.7 (2) 1.5 90 3.5 0.5 0.1 4 1.6 (2) (1) 0.7 1.1 0.7 (3) (1) 2.2 0.9 4.6 0.7 0.65 1.5 0.6 (3) (0.3) 1.75 1.1 #2 #1 CLOCKWISE #3 0.3 ( Standard tolerance:in mm ) 1.1 0.8 1.1 0.1 ( Standard tolerance:in mm ) This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 RVG4M08/58 4.0 0.7 3.8 (2) 4 (2) (3) 0.55 0.1 0.35 0.1 Depth 0.75 6.4 (1) 1.7 1.8 M 4.7 1 (2.4) 2.7 0.1 2.0 0.2 1.5 (1) (3) 1.1 1.6 1.1 (0.3) 2.4 1.5 1.2 3.2 1.7 0.6 0.85 1.8 0.3 ( Standard tolerance:in mm ) 0.85 0.1 ( Standard tolerance:in mm ) 4.8 POG5ANtype 3-1.3 2.4 5.0 (2) 3-0.7 3-0.8 3.9 (3) 3-1.6 0.5 3-0.9 (2) (1) (3) (1) 2.9 1.2 2.6 Diameter : 1.5 Slot width : 0.6 Slot depth : 0.5 3.5 Electric adjustment section 2.5 2.5 0.2 0.1 ( Standard tolerance:in mm ) 0.3 ( Standard tolerance:in mm ) 2.4 3.7 4.9 0.5 1.2 4.0 2.3 Electric adjustment section Diameter : 1.5 Slot width : 0.6 Slot depth : 0.5 3-1.3 4.8 POG5HNtype (1) (2) 2.6 3-0.8 (3) 3-1.6 3-0.9 2.3 3-0.7 (3) (2) (1) 0.3 ( Standard tolerance:in mm ) 0.1 ( Standard tolerance:in mm ) This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. One Side Chip Mounting Reflow Soldering System PCB Solder Paste Stenciling Flow Soldering System PCB Adhesive Application Chip Placing Reflow Soldering Check Chip Placing Adhesive Setting Check Inspection Cleaning Flux Application PCB Reversing Flow Soldering 2. Both Side Chip Mounting Cleaning Solder Paste Stenciling PCB Inspection Chip Placing PCB Reversing One Side Reflow/ One Side Flow System Chip Placing Both Side Reflow System Solder Paste Stenciling 3. Mixed Mounting of Chip Components and Leaded Components Adhesive Application Flow Soldering PCB Reversing Chip Placing Adhesive Application Flux Application PCB Reversing Reflow Soldering Check Solder Paste Stenciling Insertion of Leaded Components Chip Placing Reflow Soldering Check PCB Reversing Chip Placing PCB Adhesive Setting Flux Application PCB Reversing Inspection Solder Paste Stenciling PCB Adhesive Setting Check Cleaning Adhesive Application Reflow Soldering Check Flow Soldering Cleaning Inspection Check Reflow Soldering Chip Placing Check Cleaning Inspection This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Solder Paste Stenciling The Amount of Solder Paste Electrode Solder Series POZ3AN, RVG3A, RVG4M, POG5 POZ3KN Standard applying thickness 150 200 m 100 150 m 2. Mounting the Product Dimensions of the Positioning Claws Recommended Thickness of the Positioning Claws Product Claw Claw T= 2.0 mm or more Width of the Positioning Claws Product Claw Terminal (3) W Terminal (1) W= 4.0 mm or more Correct Dimensions of the Pick-up Nozzle Incorrect Recommended for the POZ3 and RVG3 Series 2.5—2.8mm 2.0mm Recommended for the RVG4M and POG5 Series 4.0mm 2.0mm Pressure A nozzle whose suction surface is flat and free of notches or V grooves is recommended. This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Adjustment of the Pick-up Nozzle Bottom Dead Point Precautions in Mounting the Product 3. Compatibility with Chip Placers When Using Commercial Chip Placers Position Detection Methods Employed by Various Commercial Chip Placers Detection method Typical model Manufacturer Pulsar 100 series 120C, 140C, CKD 135C Vacuum sensor system Panasert MIC, MID, MA, MF PANASONIC ECM series MAMIYA ELECTRONICS OCM-8000 series OKANO ELECTRIC Vacuum sensor photocell system CM-60F, -62F, -60P, -62P, -92P MATSUSHITA ELECTRIC WORKS KYUSHU MATSUSHITA ELECTRIC TCM-40, -41, -60 SANYO Photocell (line sensor) system Panasert MK , MK , MKH, MQ, MQ1, MQ2 PANASONIC Bulser 200 series CKD Panasert MSH, MSH- , MV , MV -F, MPA-V PANASONIC AM100 series Image processing (CCD camera) system Taping Versions TCM-1000, -1200, -3000 SANYO CP-6, CP -3 FUJI MACHINERY CM86C, 85C, 82C KYUSHU MATSUSHITA ELECTRIC Series RVG4M POZ3AN RVG3 POZ3KN POG5AN POG5HN Tape width 12mm 08mm 12mm 16mm 12mm Pitch 8mm 4mm 4mm 12mm 8mm This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 4. Sensor Level Adjustment Adjusting Procedure Single-line circuit Vacuum gauge Vacuum sensor VACUUM Vacuum pump Pick-up nozzle Double-line circuit Vacuum sensor for rectangular chips Changeover valve VACUUM Vacuum sensor for special shape chips Vacuum gauge Pick-up nozzle Chip Placer Positioning Claws Positioning claws Product Claws not provided Claws provided 5. Reflow Soldering Standard Soldering Conditions Preheating (in the air) Soldering 60—120 sec. 30 sec. or less Gradual cooling (in the air) 230 Temperature (˚C) Soldering Conditions 200 100 0 (Solder melting zone) This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 6. Adhesive Application and Curing The Amount of Adhesive to Be Applied Standard Amounts of Adhesive Applied Typical adhesives Standard amounts of application MR-8153RA 0.6 0.9mg NF-3000 0.8 1.1mg Viscosity of Adhesive Points of Application Adhesive 0.3 mm or more 0.3 mm or more Land PCB Control of Adhesive Curing 2-point application Types and Characteristics of Adhesive (1) Types of Adhesive (3)Adhesive Application Methods (2) Required Characteristics of Adhesive Application method Features Dispenser A sequential application method which allows control of the amount of adhesive according to the type and shape of components. Screen Printing A system in which adhesive is applied at a stroke through a screen. This method can save time required for application, though it requires set-up change when PCBs are changed. In this method, no coating is allowed after components are mounted. Transfer Pin The application of adhesive is completed at once with transfer pins. The amount of adhesive cannot be controlled in this method. This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Commercial Chip Mounting Adhesives Name MR-8153RA Ingredients Viscosity Acrylic resin 5500ps NF-1000-6R 1800ps Polyester resin JU-8VD UV• • • • • • • • • • • • • • • • • • • • • 10" 150˚C • • • • • • • • • • • • • • • • 10"min. UV• • • • • • • • • • • • • • • • • • • • • 10 15" 140 150˚C • • • • • • • 10"min. 3 mos.(20˚C) UV• • • • • • • • • • • • • • • • • • • • • 10 15" 140 150˚C • • • • • • • 30"min. Epoxy acrylate resin 400ps UV• • • • • • • • • • • • • • • • • • • • • 10"min. 140˚C• • • • • • • • • • • • • • • • 10"min. 1 mos.(20˚C) Epoxy resin 200ps 140˚C • • • • • • • • • • • • • • • • 2.5'min. 3 mos.(20˚C) JT-5S ULTRADYNE #5111 Application method Dispenser Screen printing 2 mos.(30˚C) 2200ps(H) 1800ps(M) 1300ps(L) NF-3000 JU-8V Pot life Curing temp. and time 500ps 130˚C• • • • • • • • • • • • • • • • 15' Epoxy resin ULTRADYNE #5111-W5 1.5 mos.(20˚C) 1300ps Single liquid type 7. Flux Coating Coating Thickness Ingredients Types and Characteristics of Flux (1) Functions of Flux (3) Cautions in Use (2) Types of Flux (4) Typical Commercial Flux Flux name CF-210V CF-220V GX-15T AGF-150X Gammalux D-350 Chlorine content 0.08wt% 0.09wt% 0.09wt% 0.10wt% 0.08wt% This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 8. Flow Soldering Standard Soldering Conditions Temperature (˚C) Soldering Conditions 250 cooling Preheating (in the air) Soldering Gradual (in the air) 200 100 0 60—120 sec. 5 sec. or less Cautions in Soldering This part tends to remain unwet. Terminations Direction of move PCB Product Solder flow 9. Soldering and Resoldering with a Soldering Iron Soldering iron Product Land Correct Soldering Conditions PCB Incorrect This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 10. Cleaning Cautions in Cleaning POG5 Series RVG4M Series Recommended Cleaning Time Range for the RVG4M Series Room temperature dipping Hot dipping Ultrasonic (below 20W/ ) Steam cleaning Conditions Method 1 Method 2 5 min. or less 2 min. or less Method 3 POZ3 and RVG3 Series 1 min. or less Method 4 1 min. or less 1 min. or less (30 sec. or less recommended ) Method 5 1 min. or less 30 sec. or less 30 sec. or less This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 1. Adjustments Adjuster and Load Inspection of the Adjuster Range of Rotation of the Adjuster Types of Adjuster Recommended Adjusters for Manual Adjustments Series Recommended adjusters Manufacturer VESSEL MFG. POZ3 RVG3S08/3A08 RVG4M POG5 Trade name NO.9000 1.7 30 MURATA's trade name KMPOT12V TORAY INDUSTRIES, INC. TORAY TORAYCERAM ADJUSTER SA-2225 KMPOT13T VESSEL MFG. NO.9000 1.7 30 KMPOT12V Head shape Cross Flat blade (semicircular end) Cross TORAY INDUSTRIES, INC. TORAY TORAYCERAM ADJUSTER SA-2225 KMPOT13T Flat blade (semicircular end) VESSEL MFG. NO.9000 2.6 30 KMPOT15V Flat blade VESSEL MFG. NO.9000 1.3 30 KMPOT16V Flat blade FUTABA TOOL MFG. DA54 Flat blade This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 2. Automatic Adjustments Guiding Mechanism for Position Error Correction Bit for automatic adjustment (JB-2225) Product Actual position PCB 0.7mm (Offset from the bit center) Design position Errors up to correctable 0.7 mm PCB Recommended Bit for Automatic Adjustments TORAY TORAYCERAM ADJUSTER JB-2225 Dimensions 1.0 2.2 R1.20 0.05 0.7 5 20 0.40 1.5 0.05 0.03 1.0 (in mm) For further information on dimensions, contact TORAY INDUSTRIES, INC. Recommended Adjuster Bit for Automatic Adjustment Series POZ3 RVG3S08 RVG3A08 Recommended adjuster bit Manufacturer Trade name MURATA's trade name Head shape TORAY TORAY TORAYCERAM ADJUSTER JB-2225 KMPOT31T Flat blade (semicircular end) This is the PDF file of catalog No.R82E-2. 3. Lock Painting Paint Ingredients R82E2.pdf 97.09.29 This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Ex.1. Poor Contact Caused by Flux Adhesion Phenomenon Prevention PCB Layout Through hole 10 mm or more 10 mm or more 10 mm or more This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Ex.2. Cracking of the Substrate Phenomenon Prevention Perforation Slit V slot Ex.3. Poor Contact Caused by a Deformed Driver Plate Phenomenon Prevention This is the PDF file of catalog No.R82E-2. R82E2.pdf 97.09.29 Note: 1. Export Control For customers outside Japan Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons. For customers in Japan For products which are controlled items subject to “the Foreign Exchange and Foreign Trade Control Law” of Japan, the export license specified by the law is required for export. 2. Please contact our sales representatives or engineers before using our products listed in this catalog for the applications requiring especially high reliability what defects might directly cause damage to other party's life, body or property (listed below) or for other applications not specified in this catalog. Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Transportation equipment (automobiles, trains, ships,etc.) Traffic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 3. Product specifications in this catalog are as of September 1997, and are subject to change or stop the supply without notice. Please confirm the specifications before ordering any product. If there are any questions, please contact our sales representatives or engineers. 4. The categories and specifications listed in this catalog are for information only. Please confirm detailed specifications by checking the product specification document or requesting for the approval sheet for product specification, before ordering. 5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under licenses without our consent. 6. None of ozone depleting substances (ODS) under the Montreal Protocol is used in manufacturing process of us. http://www.murata.co.jp/ 2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone:81-75-951-9111 1874 Sumiyoshi-cho Kizuki, Nakahara-ku Kawasaki, 211-0021, Japan Phone:81-44-422-5153 Fax:81-44-433-0798