MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Features Rev. V2 Die Bump Pad Layout (bump side up) • 802.11b/g and Bluetooth Applications • Low Insertion Loss: 0.5 dB 2.4 GHz to 2.5 GHz band • High Isolation: 32 dB Typical on RX • Low Harmonics: <-70 dBc @ 20 dBm • Flip-chip configuration • RoHS* Compliant Description The MASW-009276-000DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for Wafer Level Chip Scale Package (WLCSP) applications. Die Bump Pad Configuration Ordering Information Name Description VC1 Voltage Control 1 BT Blue Tooth TX/RX Port GND Ground RX 2.5 GHz RX Port VC3 Voltage Control 3 Part Number Package TX 2.5 GHz TX Port MASW-009276-000D3K Die in 3000 piece reel VC2 Voltage Control 2 MASW-009276-001SMB Sample Board SP3T RFC Antenna Port Absolute Maximum Ratings 1,2 Parameter Absolute Maximum Input Power @ 3 V Control +32 dBm Input Power @ 5 V Control +35 dBm Operating Voltage +8 volts Operating Temperature -40°C to +85°C Storage Temperature -65°C to +150°C 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM Technology does not recommend sustained operation near these survivability limits. 1 * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Electrical Specifications3: TA = 25°C, Z0 = 50 Ω, Vc = 0 V / 3 V, Pin = 0 dBm Parameter Test Conditions Units Min. Typ. Max. Insertion Loss RFC to Tx/Rx/BT, 2.4 GHz dB — 0.5 0.75 Isolation RFC to Tx, 2.4 GHz RFC to Rx, 2.4 GHz RFC to BT, 2.4 GHz dB dB dB 20 30 20 24 32 24 — — — Return Loss 2.4 - 2.5 GHz dB — 15 — IP3 RFC to Tx/Rx/BT, 2.4 GHz, 20 dBm Total Power, 1MHz Spacing dBm — 55 — Input P1dB RFC to Tx, 2.4 GHz RFC to Rx, 2.4 GHz RFC to BT, 2.4 GHz dBm — — — 32 28 32 — — — Harmonics RFC to Tx 2.4 GHz, 20 dBm dBm — -75 — Control Current |Vc| = 3 V µA — <1 10 3. External blocking capacitors on all RF ports. Recommended PCB Configuration Truth Table 4,5,6 VC1 VC2 VC3 RFC–BT RFC-TX RFC-RX 1 0 0 On Off Off 0 1 0 Off On Off 0 0 1 Off Off On 4. For positive voltage control, external DC blocking capacitors are required on all RF ports. 5. Differential voltage, V(state 1) - V(state 0), must be +2.7 V minimum and must not exceed +5 V. 6. 0 = 0 ± 0.3 V, 1 = +2.7 V to +5 V. Handling Procedures Please observe the following precautions to avoid damage: Parts List Static Sensitivity Part Value Case Style C1 - C4 39 pF 0402 C5 - C7 1000 pF 0402 Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Product Consistency Distribution Charts7 (on wafer RF test) LS L Process Capability Process Capability LS L P rocess Data LS L 20 Target * S ample M ean 24.1799 P rocess Data LS L 30 Target * S ample M ean 32.0545 O v erall C apability P pk 18 19 20 21 O v erall C apability 8.55 22 23 24 25 26 27 28 28 29 30 32 33 34 3.04 35 36 37 38 Isolation (dB) RRX X Isolation (dB) TX and BT Isolation (dB) (dB) Tx and BT Isolation Process Capability LB 31 P pk USL Process Capability LB P rocess Data LB 0 Target * USL 0.75 S ample M ean 0.513984 USL P rocess Data LB 0 Target * USL 2 S ample M ean 0.272007 O v erall C apability P pk O v erall C apability 2.64 P pk -0.0 0.1 0.2 0.3 0.4 0.5 0.6 Insertion (dB) (dB) Insertion Loss Loss - All Paths 0.7 0.00 0.28 3.69 0.56 0.84 1.12 1.40 1.68 Switch Current All Paths Current - All Paths(µA) (uA) 1.96 7. Represents >5 wafers, tested per electrical specifications, probed directly on the die to the solder bump: TA = 25°C, Z0 = 50 Ω, VC = 0/3V, PIN = 0 dBm 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Typical Performance Curves (plots = chip on board assembly) TX Isolation TX Insertion Loss 35 0.80 +25°C -40°C +85°C 0.75 0.70 25 0.65 20 0.60 2.40 2.42 2.44 2.46 2.48 +25°C -40°C +85°C 30 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) RX Isolation RX Insertion Loss 0.75 35 0.70 30 0.65 25 +25°C -40°C +85°C 0.60 20 +25°C -40°C +85°C 0.55 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 Frequency (GHz) 2.46 2.48 2.50 BT Isolation BT Insertion Loss 35 0.80 +25°C -40°C +85°C 0.75 30 0.70 25 0.65 20 0.60 2.40 2.44 Frequency (GHz) 2.42 2.44 2.46 Frequency (GHz) 2.48 2.50 15 2.40 +25°C -40°C +85°C 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Die Dimensions (Top and Side Views) Die Bump Pad Layout - Top View (bump side up) Rev. V2 PCB Top Metal / Solder Mask Die Bump Pad Layout - Bottom View (bump side down - as installed on board) 8. Orientation mark is only on material that is shipped in tape and reel. The mark is not available on die shipped on grip ring. 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.