FAIRCHILD ISL9R8120S3S

ISL9R8120P2 / ISL9R8120S3S
8A, 1200V Stealth™ Diode
General Description
Features
The ISL9R8120P2 and ISL9R8120S3S are Stealth™ diodes
optimized for low loss performance in high frequency hard
switched applications. The Stealth™ family exhibits low
reverse recovery current (IRM(REC)) and exceptionally soft
recovery under typical operating conditions.
This device is intended for use as a free wheeling or boost
diode in power supplies and other power switching
applications. The low IRM(REC) and short ta phase reduce loss
in switching transistors. The soft recovery minimizes ringing,
expanding the range of conditions under which the diode may
be operated without the use of additional snubber circuitry.
Consider using the Stealth™ diode with a 1200V NPT IGBT to
provide the most efficient and highest power density design at
lower cost.
• Soft Recovery . . . . . . . . . . . . . . . . . . . . . . . . tb / ta > 5.5
• Fast Recovery . . . . . . . . . . . . . . . . . . . . . . . . . trr < 32ns
• Operating Temperature . . . . . . . . . . . . . . . . . . . . 150oC
• Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 1200V
• Avalanche Energy Rated
Applications
• Switch Mode Power Supplies
• Hard Switched PFC Boost Diode
• UPS Free Wheeling Diode
• Motor Drive FWD
• SMPS FWD
• Snubber Diode
Formerly developmental type TA49413.
Package
Symbol
JEDEC TO-263AB
JEDEC TO-220AC
CATHODE
(BOTTOM SIDE
METAL)
K
ANODE
CATHODE
CATHODE
(FLANGE)
N/C
A
ANODE
Device Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VRRM
VRWM
VR
Parameter
Repetitive Peak Reverse Voltage
Ratings
1200
Units
V
Working Peak Reverse Voltage
1200
V
DC Blocking Voltage
1200
V
A
IF(AV)
Average Rectified Forward Current (TC = 105oC)
8
IFRM
Repetitive Peak Surge Current (20kHz Square Wave)
16
A
IFSM
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz)
100
A
Power Dissipation
71
W
Avalanche Energy (1A, 40mH)
20
mJ
-55 to 150
°C
300
260
°C
°C
PD
EAVL
TJ, TSTG
TL
TPKG
Operating and Storage Temperature Range
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Application Note AN-7528
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2002 Fairchild Semiconductor Corporation
ISL9R8120P2 / ISL9R8120S3S Rev. A
ISL9R8120P2 / ISL9R8120S3S
May 2002
Device Marking
R8120P2
Device
ISL9R8120P2
Package
TO-220AC
Tape Width
N/A
Quantity
50
R8120S3S
ISL9R8120S3S
TO-263AB
24mm
800
Electrical Characteristics TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
TC = 25°C
-
-
100
µA
TC = 125°C
-
-
1.0
mA
Off State Characteristics
IR
Instantaneous Reverse Current
VR = 1200V
On State Characteristics
VF
Instantaneous Forward Voltage
IF = 8A
TC = 25°C
-
2.8
3.3
V
TC = 125°C
-
2.7
3.1
V
VR = 10V, IF = 0A
-
30
-
pF
ns
Dynamic Characteristics
CJ
Junction Capacitance
Switching Characteristics
trr
trr
IRM(REC)
QRR
Reverse Recovery Time
Reverse Recovery Time
Maximum Reverse Recovery Current
Reverse Recovered Charge
trr
Reverse Recovery Time
S
Softness Factor (tb/ta)
IRM(REC)
QRR
Maximum Reverse Recovery Current
Reverse Recovered Charge
trr
Reverse Recovery Time
S
Softness Factor (tb/ta)
IRM(REC)
QRR
dIM/dt
Maximum Reverse Recovery Current
Reverse Recovered Charge
IF = 1A, dIF/dt = 100A/µs, VR = 30V
-
25
32
IF = 8A, dIF/dt = 100A/µs, VR = 30V
-
35
44
ns
IF = 8A,
dIF/dt = 200A/µs,
VR = 780V, TC = 25°C
-
300
-
ns
-
4.3
-
A
-
525
-
nC
ns
IF = 8A,
dIF/dt = 200A/µs,
VR = 780V,
TC = 125°C
IF = 8A,
dIF/dt = 1000A/µs,
VR = 780V,
TC = 125°C
Maximum di/dt during tb
-
375
-
-
9
-
-
-
5.5
-
A
-
1.1
-
µC
-
200
-
ns
-
5.5
-
-
-
11
-
A
-
1.2
-
µC
-
310
-
A/µs
Thermal Characteristics
RθJC
Thermal Resistance Junction to Case
TO-220, TO-263
-
-
1.75
°C/W
RθJA
Thermal Resistance Junction to Ambient TO-220, TO-263
-
-
62
°C/W
©2002 Fairchild Semiconductor Corporation
ISL9R8120P2 / ISL9R8120S3S Rev. A
ISL9R8120P2 / ISL9R8120S3S
Package Marking and Ordering Information
1000
20
150oC
16
IR, REVERSE CURRENT (µA)
IF, FORWARD CURRENT (A)
18
14
12
10
150oC
8
6
125oC
4
0
0
0.5
1.0
1.5
2.0
2.5
3.0
125oC
100oC
10
75oC
1
0.1
25oC
2
100
3.5
4.0
25oC
0.01
200
4.5
300
400
500
VF, FORWARD VOLTAGE (V)
Figure 1. Forward Current vs Forward Voltage
500
500
900 1000 1100 1200
VR = 780V, TC = 125oC
400
t, RECOVERY TIMES (ns)
t, RECOVERY TIMES (ns)
800
450
400
350
300
250
200
150
tb AT IF = 16A, 8A, 4A
350
300
250
200
150
100
100
ta AT dIF/dt = 200A/µs, 500A/µs, 800A/µs
50
0
2
4
10
6
8
12
IF, FORWARD CURRENT (A)
14
0
200
16
dIF/dt = 800A/µs
11
dIF/dt = 600A/µs
10
9
8
7
6
5
dIF/dt = 200A/µs
4
0
2
4
6
8
10
12
14
16
IF, FORWARD CURRENT (A)
Figure 5. Maximum Reverse Recovery Current vs
Forward Current
©2002 Fairchild Semiconductor Corporation
400
500
600
700
800
900
1000
Figure 4. ta and tb Curves vs dIF/dt
IRM(REC) , MAX REVERSE RECOVERY CURRENT (A)
VR = 780V, TC = 125oC
13
12
300
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 3. ta and tb Curves vs Forward Current
14
ta AT IF = 16A, 8A, 4A
50
0
IRM(REC) , MAX REVERSE RECOVERY CURRENT (A)
700
Figure 2. Reverse Current vs Reverse Voltage
VR = 780V, TC = 125oC
tb AT dIF/dt = 200A/µs, 500A/µs, 800A/µs
450
600
VR , REVERSE VOLTAGE (V)
16
VR = 780V, TC = 125oC
IF = 16A
14
12
IF = 8A
10
IF = 4A
8
6
4
100
200
300
400
500
600
700
800
900
1000
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
Figure 6. Maximum Reverse Recovery Current vs
dIF/dt
ISL9R8120P2 / ISL9R8120S3S Rev. A
ISL9R8120P2 / ISL9R8120S3S
Typical Performance Curves
2000
VR = 780V, TC = 125oC
QRR, REVERSE RECOVERED CHARGE (nC)
11
IF = 16A
10
IF = 8A
9
8
7
6
IF = 4A
5
4
3
2
100
200
900
300
400
500
600
700
800
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
IF = 8A
1200
1000
IF = 4A
800
600
200
400
300
200
100
100
10
400
500
600
700
800
-4.4
900
1000
500
IF = 8A, VR = 780V, dIF/dt = 200A/µs
-4.8
450
IRM(REC)
-5.2
400
-5.6
350
tRR
-6.0
25
50
VR , REVERSE VOLTAGE (V)
75
100
125
TC, CASE TEMPERATURE
Figure 9. Junction Capacitance vs Reverse
Voltage
IF(AV), AVERAGE FORWARD CURRENT (A)
300
Figure 8. Reverse Recovered Charge vs dIF/dt
IRM(REC) , MAX REVERSE RECOVERY CURRENT (A)
CJ , JUNCTION CAPACITANCE (pF)
f = 1MHZ
1
1400
dIF /dt, CURRENT RATE OF CHANGE (A/µs)
500
0.1
IF = 16A
1600
400
100
1000
Figure 7. Reverse Recovery Softness Factor vs
dIF/dt
0
0.03
VR = 780V, TC = 125oC
1800
tRR , RECOVERY TIMES (ns)
S, REVERSE RECOVERY SOFTNESS FACTOR
12
300
150
(oC)
Figure 10. Reverse Recovery Current and Times
vs Case Temperature
8
6
4
2
0
90
100
110
120
130
TC, CASE TEMPERATURE
140
150
(oC)
Figure 11. DC Current Derating Curve
©2002 Fairchild Semiconductor Corporation
ISL9R8120P2 / ISL9R8120S3S Rev. A
ISL9R8120P2 / ISL9R8120S3S
Typical Performance Curves (Continued)
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
ZθJA, NORMALIZED
THERMAL IMPEDANCE
1.0
PDM
0.1
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
SINGLE PULSE
PEAK TJ = PDM x ZθJA x RθJA + TA
0.01
10-5
10-4
10-3
10-2
10-1
t, RECTANGULAR PULSE DURATION (s)
100
101
Figure 12. Normalized Maximum Transient Thermal Impedance
Test Circuit and Waveforms
VGE AMPLITUDE AND
RG CONTROL dIF/dt
t1 AND t2 CONTROL IF
L
IF
DUT
RG
CURRENT
SENSE
dIF
trr
dt
ta
tb
0
+
VGE
-
MOSFET
t1
0.25 IRM
VDD
IRM
t2
Figure 13. Itrr Test Circuit
Figure 14. trr Waveforms and Definitions
I = 1A
L = 40mH
R < 0.1Ω
VDD = 50V
EAVL = 1/2LI2 [VR(AVL) /(VR(AVL) - VDD)]
Q1 = IGBT (BVCES > DUT VR(AVL))
L
CURRENT
SENSE
VAVL
R
+
VDD
Q1
VDD
DUT
IL
t0
Figure 15. Avalanche Energy Test Circuit
©2002 Fairchild Semiconductor Corporation
IL
I V
t1
t2
t
Figure 16. Avalanche Current and Voltage
Waveforms
ISL9R8120P2 / ISL9R8120S3S Rev. A
ISL9R8120P2 / ISL9R8120S3S
Typical Performance Curves (Continued)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E2CMOSTM
EnSignaTM
FACT™
FACT Quiet Series™
FAST â
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC â
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench â
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER â UHC™
SMART START™
UltraFET â
SPM™
VCX™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
STAR*POWER is used under license
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LIFE SUPPORT POLICY
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
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support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H5