Kemet C1210R225J5RACTU Surface mount multilayer ceramic chip capacitor Datasheet

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC
(Industrial Grade)
Overview
KEMET’s High Temperature X7R Dielectric capacitors are
formulated and designed for extreme temperature applications.
Constructed of a robust and proprietary base metal electrode
(BME) dielectric system, these devices are capable of reliable
operation in temperatures up to 175°C. Providing an attractive
combination of performance and robustness in general high
temperature applications, High Temperature X7R dielectric
capacitors are well suited for high temperature bypass and
decoupling applications or frequency discriminating circuits
where Q and stability of capacitance characteristics are not
critical. They exhibit a predictable change in capacitance with
respect to time, voltage and temperature up to 175°C.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
1210
R
Case Size1 Specification/
(L" x W")
Series1
0402
0603
0805
1206
1210
1812
G = 175°C
with standard
termination
R = 175°C
w/ Flexible
Termination
225
Capacitance
Code (pF)
First two digits
represent
significant
figures. Third
digit specifies
number of
zeros.
C
T050
Failure Rate/
Capacitance Rated Voltage
Dielectric
Design
Tolerance
(VDC)
Termination
Finish
Packaging/Grade (C-Spec)2
J = ±5%
K = ±10%
M = ±20%
C = 100%
Matte Sn
K
3
4 = 16
3 = 25
5 = 50
2 = 200
R
R = X7R
A
A = N/A
Blank = Bulk
7292 = Waffle Pack/Tray
TU = 7" Reel - Unmarked
(full reel quantity)
T050 = 50 pieces/7" Reel Unmarked
T100 = 100 pieces/7" Reel Unmarked
T250 = 250 pieces/7" Reel Unmarked
T500 = 500 pieces/7" Reel Unmarked
T1K0 = 1,000 pieces/Reel Unmarked
Flexible termination option is only available in 0603 (1608 metric) and larger case sizes.
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the "T1K0" packaging option, 1812 case size devices with
chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7" reels or a single 13" reel. The term "Unmarked" pertains to laser marking of components.
All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. Additional reeling or packaging options may be available.
Contact KEMET for details.
1
2
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
W
B
T
S
EIA
Size
Code
Metric
Size
Code
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0402
1005
1.00 (0.040) ±0.05 (0.002) 0.50 (0.020) ±0.05 (0.002)
0.30 (0.012) ± 0.10 (0.004)
0.30 (0.012)
Solder Reflow Only
0603
1608
1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006)
0.35 (0.014) ± 0.15 (0.006)
0.70 (0.028)
0805
2012
2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008)
0.50 (0.02) ± 0.25 (0.010)
0.75 (0.030)
1206
3216
See Table 2
for
Thickness
3.20 (0.126) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008)
Solder Wave
or
Solder Reflow
1210
3225
3.20 (0.126) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008)
0.50 (0.02) ± 0.25 (0.010)
N/A
Solder Reflow Only
1812
4532
4.50 (0.177) ±0.30 (0.012) 3.20 (0.126) ±0.30 (0.012)
0.60 (0.024) ± 0.35 (0.014)
L
Length
W
Width
T
Thickness
0.50 (0.02) ± 0.25 (0.010)
Solder Reflow Only
Dimensions – Millimeters (Inches) – Flexible Termination
EIA
Size
Code
Metric
Size
Code
B Bandwidth
S
Separation
Minimum
0603
1608
1.60 (0.064) ±0.17 (0.007) 0.80 (0.032) ±0.15 (0.006)
0.45 (0.018) ±0.15 (0.006)
0.58 (0.023)
0805
2012
2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008)
0.50 (0.02) ±0.25 (0.010)
0.75 (0.030)
1206
3216
3.30 (0.130) ±0.40 (0.016) 1.60 (0.063) ±0.20 (0.008)
1210
3225
See Table 2
0.60 (0.024) ±0.25 (0.010)
for Thickness
3.30 (0.130) ±0.40 (0.016) 2.50 (0.098) ±0.20 (0.008)
0.60 (0.024) ±0.25 (0.010)
Solder Wave
or
Solder Reflow
N/A
Solder Reflow Only
1812
4532
4.50 (0.178) ±0.40 (0.016) 3.20 (0.126) ±0.30 (0.012)
L Length
W Width
T
Thickness
0.70 (0.028) ±0.35 (0.014)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Mounting
Technique
Solder Reflow Only
C1075_X7R_HT_SMD • 3/30/2015
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Overview cont'd
Concerned with flex cracks resulting from excessive stresses
produced during board flexure and thermal cycling? These
devices are available with KEMET's Flexible termination
technology which inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can result
in low IR or short circuit failures. Although flexible termination
technology does not eliminate the potential for mechanical
damage that may propagate during extreme environmental and
handling conditions, it does provide superior flex performance over
standard termination systems.
KEMET’s High Temperature X7R surface mount MLCCs are
manufactured in state of the art ISO/TS 16949:2009 certified
facilities and are proven to function reliably in harsh, high
temperature and high humidity, down-hole environments.
Benefits
•
•
•
•
•
•
Operating temperature range of -55°C to +175°C
Voltage derating not required
Lead (Pb)-Free, RoHS and REACH compliant
Base metal electrode (BME) dielectric system
EIA 0402, 0603, 0805, 1206, 1210 and 1812 case sizes
DC voltage ratings of 16 V, 25 V, 50 V & 200 V
•
•
•
•
Capacitance offerings ranging from 2.7 nF to 3.3 µF
Available capacitance tolerances of ±5%, ±10% & ±20%
Non-polar device, minimizing installation concerns
100% pure matte tin-plated termination finish allowing for
excellent solderability
• Flexible termination option available upon request
Applications
Typical applications include decoupling, bypass, filtering and transient voltage suppression in extreme environments such as down-hole
exploration, aerospace engine compartments and geophysical probes.
Application Notes
X7R dielectric is not recommended for AC line filtering or pulse applications.
Voltage derating of these capacitors is not required for application temperatures up to 175°C.
Qualification/Certification
High temperature Industrial grade products meet or exceed the requirements outlined Table 4, Performance & Reliability. Qualification
packages are available upon request.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions.
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25ºC
Insulation Resistance (IR) Limit at 25°C
-55°C to +175°C
±15% (-55°C to +125°C) beyond 125°C see "Capacitance vs. Temperature
Performance" plot - Reference Only
<3.0%
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
See Dissipation Factor Limit Table
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120 ± 5 secs at 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Dissipation Factor Limit Table
Rated DC Voltage
Dissipation Factor
16/25
3.5%
>25
2.5%
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
X7R
Rated DC
Voltage
16/25
>25
Capacitance
Value
All
Dissipation Factor
(Maximum %)
5.0
3.0
Capacitance
Shift
Insulation
Resistance
± 20%
10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Electrical Characteristics
Capacitance vs. Temperature Capacitance
Performance
(-55°C toPerformance
+175°C)
vs. Temperature
(-55°C to +175°C)
10.00
CAPACITANCE CHANGE %
0.00
-10.00
-20.00
-30.00
0603 (1608), 0.1µF, 25V
-40.00
0805 (2012), 0.27µF, 25V
1206 (3216), 1.0µF, 25V
-50.00
1210 (3225), 2.2µF, 25V
-60.00
1812 (4532), 3.3µF, 25V
-70.00
-80.00
1812 (4532), 1.0µF, 50V
-55
-40
-25
-10
5
20
35
50
65
80
95
110
125
140
155
170
TEMPERATURE (°C)
Capacitance vs. Bias Voltage Performance (25 VDC Rated )
Capacitance vs. Bias Voltage Performance
(25VDC Rated )
10.0
CAPACITANCE CHANGE %
0.0
-10.0
-20.0
-30.0
-40.0
0603 (1608), 0.1µF, 25V
-50.0
0805 (2012), 0.27µF, 25V
-60.0
1210 (3225), 2.2µF, 25V
-70.0
1812 (4532), 3.3µF, 25V
-80.0
0
5
10
15
20
25
BIAS DC VOLTAGE
Capacitance vs. Bias Voltage Performance (1812 Case Size, 1.0 µF, 50 VDC Rated)
Capacitance vs. Bias Voltage Performance
(1812 Case Size, 1.0µF, 50VDC Rated)
10.0
CAPACITANCE CHANGE %
5.0
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
1812 (4532), 1.0µF, 50V
-30.0
-35.0
-40.0
0
5
10
BIAS DC VOLTAGE
15
20
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
25
C1075_X7R_HT_SMD • 3/30/2015
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 1 – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)
Case Size/
Series
Capacitance Cap Code
2700 pF
3300 pF
3900 pF
4700 pF
5600 pF
6800 pF
8200 pF
10000 pF
12000 pF
15000 pF
18000 pF
22000 pF
27000 pF
33000 pF
39000 pF
47000 pF
56000 pF
68000 pF
82000 pF
0.1 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
2.7 µF
3.3 µF
Capacitance
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
Cap Code
C0402G
C0603G/R
C0805G/R
C1206G/R
Voltage Code
4
3
5
1
3
Rated Voltage
(VDC)
16
25
50
100
25
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
Rated Voltage
(VDC)
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
Capacitance
Tolerance
Voltage Code
Case Size/
Series
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
C1210G/R
C1812G/R
5
1
3
5
1
3
5
1
3
5
1
3
5
1
2
50
100
25
50
100
25
50
100
25
50
100
25
50
100
200
GN
GN
GN
GN
GM
GM
GM
GM
GB
GB
GB
GB
GB
GB
GC
GE
GG
GJ
GL
GE
GG
GJ
GL
GB
GB
GB
GB
GB
GB
GC
GE
GG
GJ
GL
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
BB
BB
BB
BB
BB
BB
BB
BB
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
BB
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
DN
DN
DN
DN
DN
DP
DP
DF
DG
DG
DP
DP
DG
DG
DG
DN
DN
DN
DN
DN
DP
DP
DF
DG
DG
ED
ED
ED
ED
EP
EP
EJ
EJ
EJ
EP
EJ
EJ
EJ
ED
ED
ED
ED
EP
EP
EJ
EJ
EJ
FE
FE
FF
FF
FG
FG
FH
FM
FK
FK
FH
FM
FK
FK
FE
FE
FF
FF
FG
FG
FH
FM
FK
FK
16
25
50
100
25
50
100
25
50
100
25
50
100
25
50
100
25
50
100
200
4
3
5
1
3
5
1
3
5
1
3
5
1
3
5
1
3
5
1
2
C0402G
C0603G/R
C0805G/R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1206G/R
C1210G/R
C1812G/R
C1075_X7R_HT_SMD • 3/30/2015
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CF
DN
DP
DF
DG
ED
EP
EJ
FE
FF
FG
FH
FM
FK
GB
GC
GE
GG
GJ
GN
GL
GM
0402
0603
0805
0805
0805
0805
1206
1206
1206
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
0.50 ± 0.05
0.80 ± 0.07
0.78 ± 0.10
0.90 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.00 ± 0.10
1.20 ± 0.20
1.70 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
2.10 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.30 ± 0.10
1.55 ± 0.10
1.70 ± 0.15
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
10,000
4,000
4,000
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50,000
15,000
15,000
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
2,500
2,000
2,500
2,500
2,500
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
500
500
0
0
0
0
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
0402
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
0603
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.65
1.90
5.90
2.90
1.50
1.45
1.80
5.00
2.30
1.40
1.25
1.70
4.30
2.00
1210
3225
1.60
1.65
2.80
5.90
3.80
1.50
1.45
2.70
5.00
3.20
1.40
1.25
2.60
4.30
2.90
1812
4532
2.10
1.80
3.60
7.00
4.60
2.00
1.60
3.50
6.10
4.00
1.90
1.40
3.40
5.40
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
C
V2
X
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Termination Finish
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second maximum
Liquidous Temperature (TL)
217°C
Time Above Liquidous (tL)
60 – 150 seconds
Peak Temperature (TP)
260°C
Time Within 5°C of Maximum Peak
Temperature (tP)
30 seconds maximum
Ramp-Down Rate (TP to TL)
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
Temperature
Profile Feature
TL
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
tL
Tsmax
Tsmin
25
tS
25° C to Peak
Time
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Terminal Strength
JIS–C–6429
Board Flex
JIS–C–6429
Test or Inspection Method
Appendix 1, Note:
Package Size
Force
(L" x W")
0402
5 N (0.51 kg)
0603
10 N (1.02 kg)
≥ 0805
18 N (1.83 kg)
Duration
60 seconds
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling
KEMET defined
50 cycles (-55°C to +220°C). Measurement at 24 hours +/- 4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
Biased Humidity
MIL–STD–202 Method 103
Moisture Resistance
MIL–STD–202 Method 106
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
Storage Life
KEMET defined
Vibration
MIL–STD–202 Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method 213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MIL–STD–202 Method 215
Add aqueous wash chemical, OKEM Clean or equivalent.
1,000 hours at 175°C with 2 X rated voltage applied.
200°C, 0 VDC for 1,000 hours.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Construction – Standard Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Dielectric Material
(BaTiO3)
End Termination /
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination /
External Electrode (Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
End Termination /
External Electrode
(Cu)
Epoxy Layer
(Ag)
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
End Termination /
Inner Electrodes
External Electrode (Cu)
(Ni)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identifier(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
• X7R dielectric products in capacitance values outlined below
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
KEMET
ID
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
2-Digit
Capacitance
Code
C1075_X7R_HT_SMD • 3/30/2015
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Capacitor Marking (Optional) cont’d
Alpha
Character
9
A
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
0
1
2
3
4
0.1
10
10
100
1,000
10,000
B
0.11
1.1
11
110
1,100
11,000
C
0.12
12
12
120
1,200
12,000
D
0.13
13
13
130
1,300
E
0.15
15
15
150
1,500
5
6
7
8
100,000
1,000,000
10,000,000
100,000,000
110,000
1,100,000
11,000,000
110,000,000
120,000
1,200,000
12,000,000
120,000,000
13,000
130,000
1,300,000
13,000,000
130,000,000
15,000
150,000
1,500,000
15,000,000
150,000,000
160,000,000
Capacitance (pF)
F
0.16
16
16
160
1,600
16,000
160,000
1,600,000
16,000,000
G
0.18
18
18
180
1,800
18,000
180,000
1,800,000
18,000,000
180,000,000
H
0.2
20
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
22
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M
0.3
30
30
300
3,000
30,000
300,000
3,000,000
30,000,000
300,000,000
N
0.33
33
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
36
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
39
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
43
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S
0.47
4.7
47
470
4,700
47,000
470,000
4,700,000
47,000,000
470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
56
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
62
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
68
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X
0.75
75
75
750
7,500
75,000
750,000
7,500,000
75,000,000
750,000,000
Y
0.82
82
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
25
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
35
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d
0.4
40
40
400
4,000
40,000
400,000
4,000,000
40,000,000
400,000,000
e
0.45
45
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.5
50
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.6
60
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.7
70
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t
0.8
80
80
800
8,000
80,000
800,000
8,000,000
80,000,000
800,000,000
y
0.9
90
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
Embossed Plastic
EIA Case Size
Tape size (W)*
7" Reel
13" Reel
Punched Paper
7" Reel
Pitch (P1)*
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
4
4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD 1
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E1
P0
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
R Reference S1 Minimum
Note 2
Note 3
25.0
(0.984)
2.0 ±0.05
0.600
(0.079 ±0.002)
(0.024)
30
(1.181)
P2
T
Maximum
T1
Maximum
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
(0.138 ±0.002)
5.5 ±0.05
(0.217 ±0.002)
7.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.0 ±0.10
(0.315 ±0.004)
12.0 ±0.10
(0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
P2
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
R Reference
Note 2
25
(0.984)
T Maximum
W Maximum
A0 B 0
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Width (mm)
8,12
16 – 200
Bo
Maximum
Rotation (
20
10
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
°
s
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 56
10
72 – 200
5
°
S)
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
R
C1075_X7R_HT_SMD • 3/30/2015
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3 (Includes
Access Hole at
Slot Location
(Ø 40 mm minimum)
flange distortion
at outer edge)
W2 (Measured at hub)
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
W1 (Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape width
without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Sasso Marconi, Italy
Tel: 39-051-939111
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Skopje, Macedonia
Tel: 389-2-55-14-623
Shenzhen, China
Tel: 86-755-2518-1306
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Kamen, Germany
Tel: 49-2307-438110
North America
Northern Europe
Harlow, United Kingdom
Tel: 44-1279-460122
Taipei, Taiwan
Tel: 886-2-27528585
Espoo, Finland
Tel: 358-9-5406-5000
Southeast Asia
Singapore
Tel: 65-6701-8033
2835 KEMET Way
Simpsonville, SC 29681
Southeast
Lake Mary, FL
Tel: 407-855-8886
Northeast
Wilmington, MA
Tel: 978-658-1663
Central
Novi, MI
Tel: 248-306-9353
Beijing, China
Tel: 86-10-5877-1075
Shanghai, China
Tel: 86-21-6447-0707
Seoul, South Korea
Tel: 82-2-6294-0550
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
22
Similar pages