MATERIAL DATA SHEET Material CI160808 Series Product Line Multilayer Chip Bead Date 04-December-2004 NO. Construction element Material group Material Weight (g) Materials CAS If applicable Average mass (%) 1 Ceramic Body Ceramic 0.0024 SiO2 ------ 100 Al2O3 ------ Business Confidential 100 2 Terminal 3 Sum (%) 0.00003 Ag 7440-22-4 1 Solder Barrier Terminal Electrode Nickel 0.00003 Ni 7440-02-0 1 4 Solder Tin 0.00003 Sn 7440-31-5 1 100 5 Circuit Silver 0.00051 Ag 7440-22-4 17 100 Total weight 0.003 Headquarters Riverside CA www.bourns.com Traces page 1 of 1