TI CD74HC4053MT High-speed cmos logic analog multiplexers/demultiplexer Datasheet

CD54/74HC4051, CD54/74HCT4051,
CD54/74HC4052, CD74HCT4052,
CD54/74HC4053, CD74HCT4053
Data sheet acquired from Harris Semiconductor
SCHS122I
High-Speed CMOS Logic
Analog Multiplexers/Demultiplexers
November 1997 - Revised July 2004
Features
[ /Title
(CD54
HC405
1,
CD74
HC405
1,
CD74
HCT40
51,
CD74
HC405
2,
Ordering Information
• Wide Analog Input Voltage Range . . . . . . . . . . ±5V Max
PART NUMBER
• Low “On” Resistance
- 70Ω Typical (VCC - VEE = 4.5V)
- 40Ω Typical (VCC - VEE = 9V)
CD74HC4051E
• Low Crosstalk between Switches
TEMP. RANGE
(oC)
-55 to 125
PACKAGE
16 Ld PDIP
CD74HC4051M
-55 to 125
16 Ld SOIC
CD74HC4051MT
-55 to 125
16 Ld SOIC
CD74HC4051M96
-55 to 125
16 Ld SOIC
• Fast Switching and Propagation Speeds
CD74HC4051NSR
-55 to 125
16 Ld SOP
• “Break-Before-Make” Switching
CD74HC4051PWR
-55 to 125
16 Ld TSSOP
• Wide Operating Temperature Range . . -55oC to 125oC
CD74HC4051PWT
-55 to 125
16 Ld TSSOP
CD74HC4052E
-55 to 125
16 Ld PDIP
CD74HC4052M
-55 to 125
16 Ld SOIC
• CD54HC/CD74HC Types
- Operation Control Voltage . . . . . . . . . . . . . . 2V to 6V
- Switch Voltage . . . . . . . . . . . . . . . . . . . . . . . 0V to 10V
- High Noise Immunity . . . NIL = 30%, NIH = 30% of VCC,
VCC = 5V
• CD54HCT/CD74HCT Types
- Operation Control Voltage . . . . . . . . . . . 4.5V to 5.5V
- Switch Voltage . . . . . . . . . . . . . . . . . . . . . . . 0V to 10V
- Direct LSTTL Input
Logic Compatibility . . . VIL = 0.8V Max, VIH = 2V Min
- CMOS Input Compatibility . . . . . II ≤ 1μA at VOL, VOH
CD74HC4052MT
-55 to 125
16 Ld SOIC
CD74HC4052M96
-55 to 125
16 Ld SOIC
CD74HC4052NSR
-55 to 125
16 Ld SOP
CD74HC4052PW
-55 to 125
16 Ld TSSOP
CD74HC4052PWR
-55 to 125
16 Ld TSSOP
CD74HC4052PWT
-55 to 125
16 Ld TSSOP
CD74HC4053E
-55 to 125
16 Ld PDIP
CD74HC4053M
-55 to 125
16 Ld SOIC
CD74HC4053MT
-55 to 125
16 Ld SOIC
CD74HC4053M96
-55 to 125
16 Ld SOIC
CD74HC4053NSR
-55 to 125
16 Ld SOP
CD74HC4053PW
-55 to 125
16 Ld TSSOP
These devices are digitally controlled analog switches which
utilize silicon gate CMOS technology to achieve operating
speeds similar to LSTTL with the low power consumption of
standard CMOS integrated circuits.
CD74HC4053PWR
-55 to 125
16 Ld TSSOP
CD74HC4053PWT
-55 to 125
16 Ld TSSOP
These analog multiplexers/demultiplexers control analog
voltages that may vary across the voltage supply range (i.e.
VCC to VEE). They are bidirectional switches thus allowing
any analog input to be used as an output and vice-versa.
The switches have low “on” resistance and low “off” leakages. In addition, all three devices have an enable control
which, when high, disables all switches to their “off” state.
CD74HCT4051MT
-55 to 125
16 Ld SOIC
CD74HCT4051M96
-55 to 125
16 Ld SOIC
Description
Ordering Information
PART NUMBER
TEMP. RANGE
(oC)
PACKAGE
CD54HC4051F3A
-55 to 125
16 Ld CERDIP
CD54HC4052F3A
-55 to 125
16 Ld CERDIP
CD54HC4053F3A
-55 to 125
16 Ld CERDIP
CD54HCT4051F3A
-55 to 125
16 Ld CERDIP
CD74HCT4051E
-55 to 125
16 Ld PDIP
CD74HCT4051M
-55 to 125
16 Ld SOIC
CD74HCT4052E
-55 to 125
16 Ld PDIP
CD74HCT4052M
-55 to 125
16 Ld SOIC
CD74HCT4052MT
-55 to 125
16 Ld SOIC
CD74HCT4052M96
-55 to 125
16 Ld SOIC
CD74HCT4053E
-55 to 125
16 Ld PDIP
CD74HCT4053M
-55 to 125
16 Ld SOIC
CD74HCT4053MT
-55 to 125
16 Ld SOIC
CD74HCT4053M96
-55 to 125
16 Ld SOIC
CD74HCT4053PWR
-55 to 125
16 Ld TSSOP
CD74HCT4053PWT
-55 to 125
16 Ld TSSOP
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2004, Texas Instruments Incorporated
1
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Pinouts
CD54HC4051, CD54HCT4051
(CERDIP)
CD74HC4051
(PDIP, SOIC, SOP, TSSOP)
CD74HCT4051
(PDIP, SOIC)
TOP VIEW
A4 1
16 VCC
A6 2
15 A2
A 3
14 A1
A7 4
13 A0
A5 5
12 A3
E 6
11 S0
VEE 7
10 S1
GND 8
9 S2
CHANNEL
IN/OUT
COM OUT/IN
CHANNEL
IN/OUT
CD54HC4052
(CERDIP)
CD74HC4052
(PDIP, SOIC, SOP, TSSOP)
CD74HCT4052
(PDIP, SOIC)
TOP VIEW
B0 1
16 VCC
B2 2
15 A2
COM OUT/IN BN 3
14 A1
CHANNEL
IN/OUT
B3 4
13 AN
COM OUT/IN
B1 5
12 A0
E 6
11 A3
VEE 7
10 S0
GND 8
9 S1
CHANNEL
IN/OUT
CHANNEL
IN/OUT
CHANNEL
IN/OUT
ADDRESS
SELECT
CD54HC4053
(CERDIP)
CD74HC4053
(PDIP, SOIC, SOP, TSSOP)
CD74HCT4053
(PDIP, SOIC, TSSOP)
TOP VIEW
B1 1
16 VCC
B0 2
15 BN
COM OUT/IN
C1 3
14 AN
COM OUT/IN
COM OUT/IN CN 4
13 A1
IN/OUT C0 5
12 A0
E 6
11 S0
VEE 7
10 S1
GND 8
9 S2
CHANNEL
IN/OUT
2
CHANNEL
IN/OUT
CHANNEL
IN/OUT
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Functional Diagram of HC/HCT4051
CHANNEL IN/OUT
VCC
A7
A6
A5
A4
A3
A2
A1
A0
16
4
2
5
1
12
15
14
13
TG
TG
S0
11
TG
S1
TG
10
BINARY
TO
1 OF 8
DECODER
WITH
ENABLE
LOGIC
LEVEL
CONVERSION
S2
9
3
TG
TG
TG
E
6
TG
8
7
GND
VEE
TRUTH TABLE
HC/HCT4051
INPUT STATES
ENABLE
S2
S1
S0
“ON”
CHANNELS
L
L
L
L
A0
L
L
L
H
A1
L
L
H
L
A2
L
L
H
H
A3
L
H
L
L
A4
L
H
L
H
A5
L
H
H
L
A6
L
H
H
H
A7
H
X
X
X
None
X = Don’t care
3
A
COMMON
OUT/IN
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Functional Diagram of ’HC4052, CD74HCT4052
A CHANNELS IN/OUT
VCC
A3
A2
A1
A0
11
15
14
12
16
TG
TG
TG
S1
S0
BINARY
TO
1 OF 4
DECODER
WITH
ENABLE
LOGIC
LEVEL
CONVERSION
9
TG
13
COMMON A
OUT/IN
TG
3
COMMON B
OUT/IN
10
TG
E
6
TG
TG
8
7
1
5
2
4
GND
VEE
B0
B1
B2
B3
B CHANNELS IN/OUT
TRUTH TABLE
’HC4052, CD74HCT4052
INPUT STATES
ENABLE
S1
S0
“ON”
CHANNELS
L
L
L
A0, B0
L
L
H
A1, B1
L
H
L
A2. B2
L
H
H
A3, B3
H
X
X
None
X = Don’t care
4
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Functional Diagram of ’HC4053, CD74HCT4053
BINARY TO
1 OF 2
DECODERS
WITH ENABLE
VCC
LOGIC LEVEL
CONVERSION
16
IN/OUT
C1
C0
B1
B0
A1
A0
3
5
1
2
13
12
TG
S0
11
S1
10
14
A COMMON
OUT/IN
15
B COMMON
OUT/IN
4
C COMMON
OUT/IN
TG
TG
TG
S2
TG
9
TG
E
6
8
7
GND
VEE
TRUTH TABLE
’HC4053, CD74HCT4053
INPUT STATES
ENABLE
S0
S1
S2
“ON”
CHANNELS
L
L
L
L
C0, B0, A0
L
H
L
L
C0, B0, A1
L
L
H
L
C0, B1, A0
L
H
H
L
C0, B1, A1
L
L
L
H
C1, B0, A0
L
H
L
H
C1, B0, A1
L
L
H
H
C1, B1, A0
L
H
H
H
C1, B1, A1
H
X
X
X
None
X = Don’t care
5
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Absolute Maximum Ratings (Note 2)
Thermal Information
DC Supply Voltage, VCC - VEE . . . . . . . . . . . . . . . . . -0.5V to 10.5V
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V
DC Supply Voltage, VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.5V to -7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Switch Diode Current, IOK
For VI < VEE -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . .±20mA
DC Switch Current, (Note 2)
For VI > VEE -0.5V or VI < VCC + 0.5V . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
DC VEE Current, IEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20mA
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
For maximum reliability, nominal operating conditions should be selected so that
operation is always within the following ranges
PARAMETER
MIN
MAX
UNITS
2
6
V
4.5
5.5
V
2
10
V
0
-6
V
DC Input Control Voltage, VI
GND
VCC
V
Analog Switch I/O Voltage, VIS
VEE
VCC
V
Operating Temperature, TA
-55
125
oC
2V
0
1000
ns
4.5V
0
500
ns
6V
0
400
ns
Supply Voltage Range (For TA = Full Package Temperature Range), VCC (Note 2)
CD54/74HC Types
CD54/74HCT Types
Supply Voltage Range (For TA = Full Package Temperature Range), VCC - VEE
CD54/74HC Types, CD54/74HCT Types (See Figure 1)
Supply Voltage Range (For TA = Full Package Temperature Range), VEE (Note 3)
CD54/74HC Types, CD54/74HCT Types (See Figure 2)
Input Rise and Fall Times, tr, tf
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. All voltages referenced to GND unless otherwise specified..
3. In certain applications, the external load resistor current may include both VCC and signal line components. To avoid drawing VCC current
when switch current flows into the transmission gate inputs, the voltage drop across the bidirectional switch must not exceed 0.6V (calculated from rON values shown in Electrical Specifications table). No VCC current will flow through RL if the switch current flows into
terminal 3 on the HC/HCT4051; terminals 3 and 13 on the HC/HCT4052; terminals 4, 14 and 15 on the HC/HCT4053.
Recommended Operating Area as a Function of Supply Voltages
8
VCC - GND (V)
VCC - GND (V)
8
6
HCT
HC
4
2
0
0
2
4
6
8
10
6
HCT
2
0
12
VCC - VEE (V)
HC
4
0
-2
-4
-6
-8
VEE - GND (V)
FIGURE 1.
FIGURE 2.
6
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
DC Electrical Specifications
TEST CONDITIONS
PARAMETER
VIS
(V)
VI
(V)
AMBIENT TEMPERATURE, TA
VEE
(V)
25oC
-40oC - 85oC
-55oC - 125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
0
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
0
4.5
-
70
160
-
200
-
240
Ω
0
6
-
60
140
-
175
-
210
Ω
-4.5
4.5
-
40
120
-
150
-
180
Ω
0
4.5
-
90
180
-
225
-
270
Ω
0
6
-
80
160
-
200
-
240
Ω
-4.5
4.5
-
45
130
-
162
-
195
Ω
0
4.5
-
10
-
-
-
-
-
Ω
0
6
-
8.5
-
-
-
-
-
Ω
-4.5
4.5
-
5
-
-
-
-
-
Ω
0
6
-
-
±0.1
-
±1
-
±1
μA
-5
5
-
-
±0.1
-
±1
-
±1
μA
0
6
-
-
±0.1
-
±1
-
±1
μA
-5
5
-
-
±0.2
-
±2
-
±2
μA
0
6
-
-
±0.2
-
±2
-
±2
μA
-5
5
-
-
±0.4
-
±4
-
±4
μA
VCC or
GND
0
6
-
-
±0.1
-
±1
-
±1
μA
VCC or
GND
0
6
-
-
8
-
80
-
160
μA
-5
5
-
-
16
-
160
-
320
μA
HC TYPES
High Level Input Voltage,
VIH
Low Level Input Voltage,
VIL
On Resistance, rON
IO = 1mA, (Figure 11)
VCC or VEE
VIL or
VIH
VCC to VEE
Maximum On Resistance
Between any Two
Channels, ΔrON
Switch On/Off Leakage
Current, IIZ
1 and 2 Channels
4053
4 Channels
4052
8 Channels
For Switch Off:
When VIS = VCC,
VOS = VEE;
When VIS = VEE,
VOS = VCC
For Switch On:
All Applicable
Combinations of
VIS and VOS
Voltage Levels
VIL or
VIH
4051
Control Input Leakage
Current, IIL
Quiescent Device
Current, ICC
IO = 0
When VIS = VEE,
VOS = VCC
When VIS = VCC,
VOS = VEE
7
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
DC Electrical Specifications (Continued)
TEST CONDITIONS
VIS
(V)
PARAMETER
VI
(V)
AMBIENT TEMPERATURE, TA
VEE
(V)
VCC
(V)
25oC
-40oC - 85oC
-55oC - 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HCT TYPES
High Level Input Voltage,
VIH
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input Voltage,
VIL
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
0
4.5
-
70
160
-
200
-
240
Ω
-
-
-
-
-
-
-
-
-
Ω
-4.5
4.5
-
40
120
-
150
-
180
Ω
0
4.5
-
90
180
-
225
-
270
Ω
-
-
-
-
-
-
-
-
-
Ω
-4.5
4.5
-
45
130
-
162
-
195
Ω
0
4.5
-
10
-
-
-
-
-
Ω
-
-
-
-
-
-
-
-
-
Ω
-4.5
4.5
-
5
-
-
-
-
-
Ω
0
6
-
-
±0.1
-
±1
-
±1
μA
-5
5
-
-
±0.1
-
±1
-
±1
μA
0
6
-
-
±0.1
-
±1
-
±1
μA
-5
5
-
-
±0.2
-
±2
-
±2
μA
0
6
-
-
±0.2
-
±2
-
±2
μA
-5
5
-
-
±0.4
-
±4
-
±4
μA
On Resistance, rON
IO = 1mA, (Figure 15)
VCC or VEE
VIL or
VIH
VCC to VEE
Maximum On Resistance
Between any Two
Channels, ΔrON
Switch On/Off Leakage
Current, IIZ
1 and 2 Channels
4053
4 Channels
4052
8 Channels
For Switch Off:
When VIS = VCC,
VOS = VEE;
When VIS = VEE,
VOS = VCC
For Switch On:
All Applicable
Combinations of
VIS and VOS
Voltage Levels
VIL or
VIH
4051
Control Input Leakage
Current, IIL
-
(Note 4)
-
5.5
-
-
±0.1
-
±1
-
±1
μA
Quiescent Device
Current, ICC
IO = 0
When VIS = VEE,
VOS = VCC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
μA
-4.5
5.5
-
-
16
-
160
-
320
μA
4.5 to
5.5
-
100
360
-
450
-
490
μA
Additional Quiescent
Device Current
Per Input Pin: 1 Unit
Load
When VIS = VCC,
VOS = VEE
ΔICC
(Note 5)
VCC 2.1
NOTES:
4. Any voltage between VCC and GND.
5. For dual supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
(NOTE)
4051, 4053
All
0.5
4052
All
0.4
TYPE
NOTE: Unit load is ΔICC limit specified in DC Specifications table,
e.g., 360mA max. at 25oC.
8
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Switching Specifications VCC = 5V, TA = 25oC, Input tr, tr = 6ns
TYPICAL
4051
4052
4053
CL
(pF)
HC
HCT
HC
HCT
HC
HCT
UNITS
Switch IN to OUT, tPHL, tPLH
15
4
4
4
4
4
4
ns
Switch Turn-Off (S or E), tPHZ, tPLZ
15
19
19
21
21
18
18
ns
Switch Turn-On (S or E), tPZH, tPZL
15
19
23
27
29
18
20
ns
-
50
52
74
76
38
42
pF
PARAMETER
Propagation Delay
Power Dissipation Capacitance, CPD (Note 6)
NOTE:
6. CPD is used to determine the dynamic power consumption, per package.
PD = CPD VCC2 fI + ∑ (CL + CS) VCC2 fO
fO = output frequency
fI = input frequency
CL = output load capacitance
CS = switch capacitance
VCC = supply voltage
Switching Specifications CL = 50pF, Input tr, tr = 6ns
AMBIENT TEMPERATURE, TA
25oC
PARAMETER
Propagation Delay, Switch
In to Out, tPLH, tPHL
Maximum Switch
Turn “Off” Delay
from S or E to
Switch Output
tPHZ, tPLZ
4051
4052
4053
-40oC - 85oC
HC
HCT
HC
-55oC - 125oC
HCT
HC
HCT
VEE
(V)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
MIN
0
2
-
60
-
-
-
75
-
-
-
90
-
-
ns
0
4.5
-
12
-
12
-
15
-
15
-
18
-
18
ns
0
6
-
10
-
-
-
13
-
-
-
15
-
-
ns
-4.5
4.5
-
8
-
8
-
10
-
10
-
12
-
12
ns
0
2
-
225
-
-
-
280
-
-
-
340
-
-
ns
0
4.5
-
45
-
45
-
56
-
56
-
68
-
68
ns
0
6
-
38
-
-
-
48
-
-
-
57
-
-
ns
-4.5
4.5
-
32
-
32
-
40
-
40
-
48
-
48
ns
0
2
-
250
-
-
-
315
-
-
-
375
-
-
ns
0
4.5
-
50
-
50
-
63
-
63
-
75
-
75
ns
0
6
-
43
-
-
-
54
-
-
-
65
-
-
ns
-4.5
4.5
-
38
-
38
-
48
-
48
-
57
-
57
ns
0
2
-
210
-
-
-
265
-
-
-
315
-
-
ns
0
4.5
-
42
-
44
-
53
-
55
-
63
-
66
ns
0
6
-
36
-
-
-
45
-
-
-
54
-
-
ns
-4.5
4.5
-
29
-
31
-
36
-
39
-
44
-
47
ns
9
MAX UNITS
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Switching Specifications CL = 50pF, Input tr, tr = 6ns (Continued)
AMBIENT TEMPERATURE, TA
25oC
PARAMETER
Maximum Switch
Turn “On” Delay
from S or E to
Switch Output
tPZL, tPZH
4051
4052
4053
Input (Control)
Capacitance, CI
-40oC - 85oC
HC
HCT
HC
-55oC - 125oC
HCT
HC
HCT
VEE
(V)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
MIN
0
2
-
225
-
-
-
280
-
-
-
340
-
-
ns
0
4.5
-
45
-
55
-
56
-
69
-
68
-
83
ns
0
6
-
38
-
-
-
48
-
-
-
57
-
-
ns
-4.5
4.5
-
32
-
39
-
40
-
49
-
48
-
59
ns
0
2
-
325
-
-
-
405
-
-
-
490
-
-
ns
0
4.5
-
65
-
70
-
81
-
68
-
98
-
105
ns
0
6
-
55
-
-
-
69
-
-
-
83
-
-
ns
-4.5
4.5
-
46
-
48
-
58
-
60
-
69
-
72
ns
0
2
-
220
-
-
-
275
-
-
-
330
-
-
ns
0
4.5
-
44
-
48
-
55
-
60
-
66
-
72
ns
0
6
-
37
-
-
-
47
-
-
-
56
-
-
ns
-4.5
4.5
-
31
-
34
-
39
-
43
-
47
-
51
ns
-
-
-
10
-
10
-
10
-
10
-
10
-
10
pF
MAX UNITS
Analog Channel Specifications Typical Values at TA = 25oC
PARAMETER
TEST CONDITIONS
Switch Input Capacitance, CI
Common Output Capacitance, CCOM
Minimum Switch Frequency Response at -3dB, fMAX
(Figures 12, 14, 16)
See Figure 3 (Notes 7, 8)
HC/HCT
TYPES
VEE
(V)
VCC
(V)
HC/
HCT
UNITS
All
-
-
5
pF
4051
-
-
25
pF
4052
-
-
12
pF
4053
-
-
8
pF
145
MHz
165
MHz
4053
200
MHz
4051
180
MHz
185
MHz
200
MHz
4051
4052
4052
4053
10
-2.25
-4.5
2.25
4.5
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Analog Channel Specifications Typical Values at TA = 25oC
PARAMETER
Crosstalk Between any Two Switches (Note 10)
TEST CONDITIONS
See Figure 4
(Notes 8, 9)
HC/
HCT
UNITS
N/A
dB
(TBE)
dB
4053
(TBE)
dB
4051
N/A
dB
(TBE)
dB
(TBE)
dB
HC/HCT
TYPES
VEE
(V)
VCC
(V)
4051
4052
4052
-2.25
-4.5
2.25
4.5
4053
Sinewave Distortion
E or S to Switch Feedthrough Noise
See Figure 5
See Figure 6
(Notes 8, 9)
All
-2.25
2.25
0.035
%
All
-4.5
4.5
0.018
%
4051
4052
mV
-2.25
2.25
(TBE)
4053
mV
4051
mV
4052
-4.5
4.5
(TBE)
4053
Switch “OFF” Signal Feedthrough (Figures 13, 15, 17)
See Figure 7
(Notes 8, 9)
-73
dB
-65
dB
4053
-64
dB
4051
-75
dB
-67
dB
-66
dB
4052
4053
7. Adjust input voltage to obtain 0dBm at VOS for fIN = 1MHz.
8. VIS is centered at (VCC - VEE)/2.
9. Adjust input for 0dBm.
10. Not applicable for HC/HCT4051.
11
mV
mV
4051
4052
NOTES:
mV
-2.25
-4.5
2.25
4.5
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Test Circuits and Waveforms
VIS
R
0.1μF
INPUT
VCC
SWITCH
ON
VOS1
C
R
fIS = 1MHz SINEWAVE
R = 50Ω
C = 10pF
VCC
VOS
SWITCH
ON
VIS
0.1μF
VCC /2
VCC
50Ω
dB
METER
10pF
R
VCC /2
SWITCH
OFF
VCC /2
VOS2
dB
METER
C
R
VCC /2
FIGURE 3. FREQUENCY RESPONSE TEST CIRCUIT
FIGURE 4. CROSSTALK BETWEEN TWO SWITCHES TEST
CIRCUIT
E
VCC
VCC
VI = VIH
SINEWAVE
VIS
10μF
VIS
SWITCH
ON
fIS = 1kHz TO 10kHz
SWITCH
ALTERNATING
ON AND OFF
600Ω
VOS
10kΩ
50pF
tr, tf ≤ 6ns
fCONT = 1MHz
50% DUTY
CYCLE
VCC /2
DISTORTION
METER
VCC /2
FIGURE 5. SINEWAVE DISTORTION TEST CIRCUIT
fIS ≥ 1MHz SINEWAVE
R = 50Ω
C = 10pF
VC = VIL
VOS
SWITCH
OFF
VIS
VOS
600Ω
50pF
SCOPE
VCC /2
FIGURE 6. CONTROL TO SWITCH FEEDTHROUGH NOISE
TEST CIRCUIT
VCC
0.1μF
VP-P
VOS
R
R
VCC /2
VCC /2
C
dB
METER
FIGURE 7. SWITCH OFF SIGNAL FEEDTHROUGH
12
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Test Circuits and Waveforms
(Continued)
tr = 6ns
tf = 6ns
VCC
90%
50%
10%
SWITCH INPUT
tPLH
tPHL
VEE
90%
50%
10%
SWITCH OUTPUT
FIGURE 8A.
6ns
6ns
E OR Sn
90%
50%
tr
6ns
VCC
E OR Sn
10%
tPLZ
OUTPUT LOW
TO OFF
tPLZ
OUTPUT LOW
TO OFF
10%
tPZH
90%
OUTPUT HIGH
TO OFF
SWITCH OFF
50%
OUTPUT HIGH
TO OFF
SWITCH ON
GND
tPZL
10%
tPHZ
50%
SWITCH ON
0.3
GND
50%
tPHZ
3V
2.7
1.3
tPZL
6ns
tf
tPZH
90%
50%
SWITCH OFF
SWITCH ON
FIGURE 8B. HC TYPES
SWITCH ON
FIGURE 8C. HCT TYPES
FIGURE 8. SWITCH PROPAGATION DELAY, TURN-ON, TURN-OFF TIMES
VEE FOR
tPLZ AND tPZL
VCC FOR
tPHZ AND tPZH
IN
TG
RL = 1kΩ
VCC FOR
tPLZ AND tPZL
CL
50pF
VEE FOR
tPHZ AND tPZH
OUT
IN
OUT
TG
50pF
FIGURE 9. SWITCH ON/OFF PROPAGATION DELAY TEST
CIRCUIT
FIGURE 10. SWITCH IN TO SWITCH OUT PROPAGATION
DELAY TEST CIRCUIT
13
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Typical Performance Curves
120
ON RESISTANCE (Ω)
100
80
VCC - VEE = 4.5V
60
VCC - VEE = 6V
40
VCC - VEE = 9V
20
1
2
3
4
5
6
INPUT SIGNAL VOLTAGE (V)
7
8
9
FIGURE 11. TYPICAL ON RESISTANCE vs INPUT SIGNAL VOLTAGE
0
0
VCC = 4.5V
GND = -4.5V
VEE = -4.5V
RL = 50Ω
PIN 12 TO 3
-2
-4
-20
-40
dB
dB
VCC = 2.25V
GND = -2.25V
VEE = -2.25V
RL = 50Ω
PIN 12 TO 3
-6
VCC = 2.25V
GND = -2.25V
VEE = -2.25V
RL = 50Ω
PIN 12 TO 3
-60
VCC = 4.5V
GND = -4.5V
VEE = -4.5V
RL = 50Ω
PIN 12 TO 3
-80
-8
-10
10K
100K
1M
FREQUENCY (Hz)
10M
-100
10K
100M
FIGURE 12. CHANNEL ON BANDWIDTH (HC/HCT4051)
100K
1M
FREQUENCY (Hz)
10M
100M
FIGURE 13. CHANNEL OFF FEEDTHROUGH (HC/HCT4051)
0
0
VCC = 4.5V
GND = -4.5V
VEE = -4.5V
RL = 50Ω
PIN 4 TO 3
-2
-4
-40
dB
dB
VCC = 2.25V
GND = -2.25V
VEE = -2.25V
RL = 50Ω
PIN 4 TO 3
-6
VCC = 2.25V
GND = -2.25V
VEE = -2.25V
RL = 50Ω
PIN 4 TO 3
-20
-60
VCC = 4.5V
GND = -4.5V
VEE = -4.5V
RL = 50Ω
PIN 4 TO 3
-80
-8
-10
10K
100K
1M
FREQUENCY (Hz)
10M
-100
10K
100M
FIGURE 14. CHANNEL ON BANDWIDTH (HC/HCT4052)
100K
1M
FREQUENCY (Hz)
10M
100M
FIGURE 15. CHANNEL OFF FEEDTHROUGH (HC/HCT4052)
14
’HC4051, ’HCT4051, ’HC4052, CD74HCT4052, ’HC4053, CD74HCT4053
Typical Performance Curves
(Continued)
0
0
VCC = 2.25V
GND = -2.25V
VEE = -2.25V
RL = 50Ω
PIN 5 TO 4
-20
VCC = 4.5V
GND = -4.5V
VEE = -4.5V
RL = 50Ω
PIN 5 TO 4
-2
-40
dB
dB
-1
VCC = 4.5V
GND = -4.5V
VEE = -4.5V
RL = 50Ω
PIN 5 TO 4
-60
VCC = 2.25V
GND = -2.25V
VEE = -2.25V
RL = 50Ω
PIN 5 TO 4
-3
-4
10K
100K
1M
FREQUENCY (Hz)
10M
-80
-100
10K
100M
FIGURE 16. CHANNEL ON BANDWIDTH (HC/HCT4053)
100K
1M
FREQUENCY (Hz)
10M
100M
FIGURE 17. CHANNEL OFF FEEDTHROUGH (HC/HCT4053)
15
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8775401EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
5962-8855601EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
5962-9065401MEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
CD54HC4051F
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
CD54HC4051F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
CD54HC4052F
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
CD54HC4052F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
CD54HC4053F
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
CD54HC4053F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
CD54HCT4051F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
CD74HC4051E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4051EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4051M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051M96G3
PREVIEW
SOIC
D
16
2500
CD74HC4051M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CD74HC4051ME4
ACTIVE
SOIC
D
16
40
CD74HC4051MG4
ACTIVE
SOIC
D
16
CD74HC4051MT
ACTIVE
SOIC
D
CD74HC4051MTE4
ACTIVE
SOIC
CD74HC4051MTG4
ACTIVE
CD74HC4051NSR
TBD
Call TI
Call TI
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051PWT
ACTIVE
TSSOP
PW
16
250
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Green (RoHS &
no Sb/Br)
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2010
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HC4051PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4051PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4052EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4052M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052M96G3
PREVIEW
SOIC
D
16
2500
CD74HC4052M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CD74HC4052ME4
ACTIVE
SOIC
D
16
40
CD74HC4052MG4
ACTIVE
SOIC
D
16
CD74HC4052MT
ACTIVE
SOIC
D
CD74HC4052MTE4
ACTIVE
SOIC
CD74HC4052MTG4
ACTIVE
CD74HC4052NSR
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4052PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2010
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HC4053E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4053EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4053M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053M96G3
PREVIEW
SOIC
D
16
2500
CD74HC4053M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CD74HC4053ME4
ACTIVE
SOIC
D
16
40
CD74HC4053MG4
ACTIVE
SOIC
D
16
CD74HC4053MT
ACTIVE
SOIC
D
CD74HC4053MTE4
ACTIVE
SOIC
CD74HC4053MTG4
ACTIVE
CD74HC4053NSR
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4053PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT4051EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT4051M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2010
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HCT4051M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4051MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT4052EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT4052M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4052MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT4053EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT4053M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053ME4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
40
Addendum-Page 4
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2010
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HCT4053MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4053PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54HC4051, CD54HC4052, CD54HC4053, CD54HCT4051, CD74HC4051, CD74HC4052, CD74HC4053,
CD74HCT4051 :
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2010
CD74HC4051-Q1, CD74HCT4051-Q1
• Automotive:
Enhanced
Product:
CD74HC4051-EP
•
NOTE: Qualified Version Definitions:
- Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Automotive
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74HC4051M96
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HC4051NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD74HC4051PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD74HC4052M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HC4052NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD74HC4052PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD74HC4053M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HC4053NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD74HC4053PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD74HCT4051M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HCT4052M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HCT4053M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HCT4053PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC4051M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HC4051NSR
SO
NS
16
2000
346.0
346.0
33.0
CD74HC4051PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
CD74HC4052M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HC4052NSR
SO
NS
16
2000
346.0
346.0
33.0
CD74HC4052PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
CD74HC4053M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HC4053NSR
SO
NS
16
2000
346.0
346.0
33.0
CD74HC4053PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
CD74HCT4051M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HCT4052M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HCT4053M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HCT4053PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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