Rohm BA14741FJ-E2 Low noise operational amplifier Datasheet

Datasheet
Operational Amplifier series
Low Noise Operational Amplifiers
BA14741F, BA14741FJ
●General Description
General-purpose BA14741 integrates four
independent Op-Amps on a single chip. Especially, this
series is suitable for any audio applications due to low
noise and low distortion characteristics and is usable
for other many applications by wide operating supply
voltage range.
●Packages
SOP14
SOP-J14
W(Typ.) x D(Typ.) x H(Max.)
8.70mm x 6.20mm x 1.71mm
8.65mm x 6.00mm x 1.65mm
●Key Specification
 Wide Operating Supply Voltage
(split supply):
 High Slew Rate:
 Input Referred Noise Voltage:
 Total Harmonic Distortion:
●Features
 High voltage gain
 Low input referred noise voltage
 low distortion
 Wide operating supply voltage
±2.0V to ±18.0V
1V/µs(Typ.)
2.0μVrms(Typ.)
0.003%(Typ.)
●Application
 Audio application
 Consumer electronics
●Block Diagrams
VCC
－IN
OUT
＋IN
VEE
Figure 1. Simplified schematic
○Product structure：Silicon monolithic integrated circuit
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Datasheet
●Pin Configuration(TOP VIEW)
SOP14, SOP-J14
OUT1 1
-IN1 2
CH1
- +
CH4
+ -
Pin No.
Symbol
14 OUT4
1
OUT1
13 -IN4
2
-IN1
3
+IN1
+IN1 3
12 +IN4
4
VCC
VCC 4
11 VEE
5
+IN2
5
10 +IN3
6
-IN2
7
OUT2
9 -IN3
8
OUT3
8 OUT3
9
-IN3
10
+IN3
11
VEE
12
+IN4
+IN2
+ CH3
- +
CH2
-IN2 6
OUT2 7
Package
BA14741F
SOP14
BA14741FJ
SOP-J14
13
-IN4
14
OUT4
●Ordering Information
B
A
1
4
7
4
Part Number
BA14741
1
x
x
-
E2
Packaging and forming specification
E2: Embossed tape and reel
(SOP14/ SOP-J14)
Package
F :SOP14
FJ :SOP-J14
●Line-up
Topr
Operating
Supply Voltage
(split supply)
Supply
Current
(Typ.)
Slew Rate
(Typ.)
-40°C～+85°C
±2.0V～±18.0V
3mA
1V/µs
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Package
Orderable
Part Number
SOP14
Reel of 2500
BA14741F-E2
SOP-J14
Reel of 2500
BA14741FJ-E2
TSZ02201-0RAR1G200060-1-2
9.NOV.2012 Rev.001
BA14741xx
Datasheet
●Absolute Maximum Ratings (Ta=25℃)
○BA14741
Parameter
Supply Voltage
Power dissipation
Symbol
Ratings
VCC-VEE
+36
Pd
Differential Input Voltage
*4
Unit
V
*1*3
mW
*2*3
mW
SOP14
450
SOP-J14
820
Vid
VCC - VEE
V
Input Common-mode Voltage Range
Vicm
VEE - VCC
V
Operating Supply Voltage
Vopr
4 to 36 (±2 to ±18)
V
Operating Temperature
Topr
-40 to +85
℃
Storage Temperature
Tstg
-55 to +125
℃
Tjmax
+125
unlimited
(only 1CH short)
℃
Maximum Junction Temperature
Output Short Time
*5
Ts
Sec
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated
temperature environment may cause deterioration of characteristics.
*1 To use at temperature above Ta＝25℃ reduce 4.5mW/℃
*2 To use at temperature above Ta＝25℃ reduce 8.2mW/℃
*3 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*4 The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
*5 To short Output to VCC or VEE, Limited within Pd.
●Electrical Characteristics
○BA14741 (Unless otherwise specified VCC=+15V, VEE=-15V, Ta=25℃)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Input Offset Voltage *6
Vio
*6
Input Offset Current
-
1.0
5.0
mV
Condition
RS≦10kΩ
Iio
-
10
50
nA
-
Input Bias Current *7
Ib
-
60
300
nA
-
Large Signal Voltage Gain
Av
20
100
-
Common-mode Rejection Ratio
V/mV RL≧2kΩ, OUT=±10V
CMRR
80
100
-
dB
-
Input Common-mode Voltage Range
Vicm
±12
±13.5
-
V
-
Power Supply Rejection Ratio
PSRR
80
100
-
dB
Supply Current
ICC
-
3.0
7.0
mA
Maximum Output Voltage
VOM
±10
±12.5
-
V
Isource
10
20
-
mA
Vin+=1V, Vin-=0V, OUT=0V
Isink
5
10
-
mA
Vin+=0V, Vin-=1V, OUT=0V
SR
-
1.0
-
V/μs Av=1, RL=2kΩ
MHz f=100kHz
Output Source Current
Output Sink Current
Slew Rate
Gain Bandwidth Product
GBW
-
2.2
-
Unity Gain Frequency
fT
-
2.2
-
-
2.0
4.0
Input Referred Noise Voltage
Vn
-
10
-
THD+N
-
0.003
-
CS
-
100
-
Total Harmonic Distortion + Noise
Channel Separation
RL=∞,All Op-Amps
RL=2kΩ
MHz 0dB cross frequency
RIAA, RS=2.2kΩ, 10Hz to
μVrms
30kHz
RIAA,RS=2.2kΩ,
nV/ Hz
f=1kHz
Av=20dB,RL=2kΩ,OUT=1Vrms
%
f=1kHz,DIN-AUDIO
dB f=1kHz, input referred
*6 Absolute value.
*7 Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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Datasheet
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document.
1. Absolute maximum ratings
Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of
absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of
characteristics.
1.1 Power supply voltage (VCC-VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without
deterioration and destruction of characteristics of IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without
deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures
normal operation of IC. When normal operation of IC is desired, the input common-mode voltage of characteristics
item must be followed.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature).
As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package
(maximum junction temperature)and thermal resistance of the package.
2. Electrical characteristics item
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the
input voltage difference required for setting the output voltage at 0 V .
2.2 Input offset current (Iio)
Indicates the difference of input bias current between non-inverting terminal and inverting terminal.
2.3 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at
non-inverting terminal and input bias current at inverting terminal.
2.4 Large signal voltage gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and Inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage fluctuation) / (Input offset fluctuation)
2.5 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the
fluctuation of DC.
CMRR = (Change of Input common-mode voltage) / (Input offset fluctuation)
2.6 Input common-mode voltage range(Vicm)
Indicates the input voltage range where IC operates normally.
2.7 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC. PSRR = (Change of power supply voltage) / (Input offset fluctuation)
2.8 Circuit current (ICC)
Indicates the IC current that flows under specified conditions and no-load steady status.
2.9 Maximum Output Voltage(VOM)
Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into
maximum output voltage high and maximum output voltage low. maximum output voltage high indicates the upper
limit of output voltage. maximum output voltage low indicates the lower limit.
2.10 Output source current/ output sink current (Isource/Isink)
The maximum current that can be output under specific output conditions, it is divided into output source current and
output sink current. The output source current indicates the current flowing out of the IC, and the output sink current
the current flowing into the IC.
2.11 Slew Rate (SR)
SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage
as unit time.
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2.12 Gain Band Width (GBW)
Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.
2.13 Unity gain frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
2.14 Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.15 Input referred noise voltage (Vn)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
2.16 Channel separation (CS)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
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Datasheet
●Typical Performance Curves
○BA14741
.
8.0
800
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW] .
1000
BA14741FJ
600
BA14741F
400
200
6.0
25℃
-40℃
4.0
2.0
85℃
0
0.0
0
25
50
75
100
125
±0
AMBIENT TEMPERATURE [℃] .
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
8.0
SUPPLY CURRENT [mA]
±18V
6.0
±15 V
4.0
2.0
±2 V
0.0
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
±20
Figure 3.
Supply Current - Supply Voltage
Figure 2.
Derating Curve
-50
±5
±10
±15
SUPPLY VOLTAGE [V]
100
30
25
20
15
10
5
0
0.1
1
10
LOAD RESISTANCE [kΩ]
Figure 5.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+15V/-15V,Ta=25℃)
Figure 4.
Supply Current - Ambient Temperature
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
20
20
15
15
10
10
VOH
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
○BA14741
VOH
5
0
-5
VOL
-10
5
0
-5
-10
VOL
-15
-15
-20
-20
0
1
SUPPLY VOLTAGE [V]
10
±0
20
15
15
10
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
20
VOH
5
0
VOL
-10
-15
-20
-50
±4
±6 ±8 ±10 ±12 ±14 ±16 ±18
SUPPLY VOLTAGE [V]
Figure 7.
Maximum Output Voltage
- Supply Voltage
(RL=2kΩ,Ta=25℃)
Figure 6.
Maximum Output Voltage
- Load Resistance
(VCC/VEE=+15V/-15V,Ta=25℃)
-5
±2
10
VOH
5
0
-5
VOL
-10
-15
-20
-25
0
25
50
75
100
0
AMBIENT TEMPERATURE [℃]
5
10
15
20
OUTPUT CURRENT [mA]
Figure 9.
Maximum Output Voltage
- Output Current
(VCC/VEE=+15V/-15V,Ta=25℃)
Figure 8.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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○BA14741
6
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
6
4
-40℃
2
0
25℃
-2
85℃
-4
±2V
2
±15V
0
±18V
-2
-4
-6
-6
±0
±4
±8
±12
±16
-50
±20
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 10.
Input Offset Voltage - Supply Voltage
(Vicm=0V, OUT=0V)
Figure 11.
Input Offset Voltage - Ambient Temperature
(Vicm=0V, OUT=0V)
200
200
180
180
.
160
INPUT BIAS CURRENT [nA]
INPUT BIAS CURRENT [nA]
4
-40℃
140
120
100
85℃
80
25℃
60
40
20
160
±2V
±15V
140
120
100
80
±18V
60
40
20
0
0
±0
±4
±8
±12
±16
±20
-50
SUPPLY VOLTAGE [V]
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
Figure 13.
Input Bias Current - Ambient Temperature
(Vicm=0V, OUT=0V)
Figure 12.
Input Bias Current - Supply Voltage
(Vicm=0V, OUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
20
30
10
INPUT OFFSET CURRENT [nA]
.
30
INPUT OFFSET CURRENT [nA]
○BA14741
-40℃
25℃
0
-10
85℃
-20
-30
20
10
0
-10
±2V
-20
-30
±0
±4
±8
±12
±16
SUPPLY VOLTAGE [V]
±20
-50
Figure 14.
Input Offset Current - Supply Voltage
(Vicm=0V, OUT=0V)
COMMON MODE REJECTION RATIO [dB]
4
85℃
3
2
25℃
1
-40℃
0
-1
-2
-3
-4
-5
-40
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
100
Figure 15.
Input Offset Current - Ambient Temperature
(Vicm=0V, OUT=0V)
5
INPUT OFFSET VOLTAGE [mV]
±15V
±18V
-22
04
26
48
COMMON MODE INPUT VOLTAGE [V]
150
125
100
75
50
25
0
-50
Figure 16.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+4V/-4V, OUT=0V)
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
100
Figure 17.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+15V/-15V, Vicm=-12V to +12V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
3.0
.
150
2.5
125
SLEW RATE [V/µs]
POWER SUPPLY REJECTION RATIO [dB]
○BA14741
100
75
50
25
2.0
1.5
1.0
0.5
0
0.0
-50
-25
0
25
50
75
100
±0
AMBIENT TEMPERATURE [℃]
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
Figure 19.
Slew Rate - Supply Voltage
(CL=100pF, RL=2kΩ, Ta=25℃)
Figure 18.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2V/-2V to +15V/-15V)
1
TOTAL HARMONIC DISTORTION [%]
80
EQUIVALENT INPUT NOISE VOLTAGE
[nV/√Hz] .
±2
60
40
20
10
100
1000
FREQUENCY [Hz]
1kHz
0.01
20Hz
0.001
0.0001
0.1
0
1
20kHz
0.1
10000
1
OUTPUT VOLTAGE [Vrms]
10
Figure 21.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=+15V/-15V, Av=20dB,
RL=2kΩ,80kHz-LPF,Ta=25℃)
Figure 20.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=+15V/-15V, RS=100Ω,Ta=25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
30
60
25
50
-30
40
-60
0
20
15
30
-90
GAIN
20
-120
5
10
-150
0
0
-180
10
1
10
100
FREQUENCY [kHz]
PHASE [deg]
PHASE
VOLTAGE GAIN [dB]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
○BA14741
1.E+00 1.E+01 1.E+02
2 1.E+03
3 1.E+04
4 1.E+05
5 1.E+06
6 1.E+07
7
1000
1
Figure 22.
Maximum Output Voltage Swing - Frequency
(VCC/VEE=+15V/-15V, RL=2kΩ,Ta=25℃)
10
10 10
10
10
FREQUENCY [Hz]
10
10
Figure 23.
Voltage Gain・Phase - Frequency
(VCC/VEE=+15V/-15V,
Av=40dB,RL=2kΩ,Ta=25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
●Application Information
Test circuit1 NULL method
VCC, VEE, EK, Vicm Unit: V
Parameter
VF
S1
S2
BA14741
S3
calculation
VCC
VEE
EK
Vicm
Input Offset Voltage
VF1
ON
ON
OFF
15
-15
0
0
1
Input Offset Current
VF2
OFF
OFF
OFF
15
-15
0
0
2
VF3
OFF
ON
VF4
ON
OFF
OFF
15
-15
0
0
3
ON
ON
ON
15
-15
-10
0
15
-15
10
0
ON
ON
OFF
3
-27
12
0
27
-3
-12
0
ON
ON
OFF
2
-2
0
0
15
-15
0
0
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF7
Power Supply
Rejection Ratio
VF9
VF8
VF10
-Calculation1. Input Offset Voltage (Vio)
VF1
Vio 
[V]
1 + RF / RS
4
5
6
0.1μF
RF=50kΩ
2. Input Offset Current (Iio)
VF2 - VF1
Iio 
[A]
Ri × (1 + RF / RS)
SW1
500kΩ
VCC
EK
RS＝50Ω
0.1μF
15V
Ri=10kΩ
500kΩ
3. Input Bias Current (Ib)
VF4 - VF3
Ib 
[A]
2 × Ri × (1 + RF / RS)
DUT
SW3
RS＝50Ω
Ri=10kΩ
NULL
1000pF
V
RL
Vicm
VF
SW2
50kΩ
4. Large Signal Voltage Gain (Av)
ΔEK × (1+ RF/RS)
Av  20 × Log
[dB]
VF5 - VF6
-15V
VEE
Figure 24. Test circuit1 (one channel only)
5. Common-mode Rejection Ration (CMRR)
ΔVicm × (1+ RF/RS)
CMRR  20 × Log
[dB]
VF8 - VF7
6. Power supply rejection ratio (PSRR)
ΔVcc × (1+ RF/RS)
PSRR  20 × Log
[dB]
VF10 - VF9
Test Circuit 2 Switch Condition
SW No.
Supply Current
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
OFF OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage High
OFF OFF
ON
OFF OFF
ON
OFF OFF
OFF OFF OFF
ON
OFF
Maximum Output Voltage Low
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
ON
OFF
Output Source Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF OFF OFF
ON
ON
ON
OFF OFF OFF OFF
Gain Bandwidth Product
OFF
ON
OFF OFF
ON
ON
OFF OFF
ON
ON
OFF OFF OFF OFF
Equivalent Input Noise Voltage
ON
OFF OFF OFF
ON
ON
OFF OFF OFF OFF
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Datasheet
Input voltage
VH
VL
t
Input wave
Output voltage
90% SR=ΔV/Δt
VH
C
ΔV
10%
VL
Δt
t
Output wave
Figure 26. Slew Rate Input Waveform
Figure 25. Test Circuit 2 (each Op-Amp)
VCC
VCC
R1//R2
R1//R2
OTHER
CH
VEE
R1
VIN
R2
VEE
OUT1
V VOUT1
R1
R2
V
=0.5Vrms
=0.5[Vrms]
CS＝
20
CS
20×log
log
OUT2
VOUT2
100
100×VOUT1
OUT1
VOUT2
OUT2
Figure 27. Test Circuit 3 (Channel Separation)
(VCC=+15V, VEE=-15V, R1=1kΩ, R2=100kΩ)
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●Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 28. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd
℃/W
・・・・・ (Ⅰ)
Derating curve in Figure 28. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate
at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 29. (c)
show a derating curve for an example of BA 14741.
Power dissipation of LSI [W]
LSIの 消 費 電 力 [W]
Pd (max)
θja=(Tjmax-Ta)/Pd ℃/W
θja2 < θja1
P2
Ta [℃] Ta [℃]
周囲温度
Ambient
temperature
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature Tj [℃]
チップ 表面温度 Tj [℃]
Power dissipation Pd [W]
0
25
50
θ ja1
75
100
125
150
] [℃]
囲 温 度 Ta [℃Ta
Ambient 周
temperature
消費電力 P [W]
(a) Thermal resistance
(b) Derating curve
Figure 28. Thermal resistance and derating
curve
1000
POWER DISSIPATION [mW]
820mW (*8)
800
BA14741FJ
600
BA14741F
490mW (*9)
400
200
0
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
(*8)
8.2
(*9)
4.5
Unit
mW/℃
(c)BA14741
When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 29. Derating curve
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Application examples
○Voltage follower
Voltage gain is 0 dB.
This circuit controls output voltage (OUT) equal input
voltage (Vin), and keeps OUT with stable because of
high input impedance and low output impedance.
OUT is shown next formula.
OUT=Vin
VCC
OUT
Vin
VEE
Figure 30. Voltage follower circuit
○Inverting amplifier
R2
For inverting amplifier, Vin is amplified by voltage gain
decided R1 and R2, and phase reversed voltage is
outputted.
OUT is shown next formula.
OUT=-(R2/R1)・Vin
Input impedance is R1.
VCC
Vin
R1
OUT
R1//R2
VEE
Figure 31. Inverting amplifier circuit
○Non-inverting amplifier
R1
R2
VCC
OUT
For non-inverting amplifier, Vin is amplified by voltage
gain decided R1 and R2, and phase is same with Vin.
OUT is shown next formula.
OUT=(1 + R2/R1)・Vin
This circuit realizes high input impedance because
Input impedance is operational amplifier’s input
Impedance.
Vin
VEE
Figure 32. Non-inverting amplifier
circuit
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●Operational Notes
1) Processing of unused circuit
It is recommended to apply connection (see the Figure 33.) and set the
non-inverting input terminal at the potential within input common-mode
voltage range (Vicm), for any unused circuit.
VCC
+
-
Vicm
2) Input voltage
Applying VEE to VCC to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, irrespective of
the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the
input voltage is within the common mode input voltage range of the electric
characteristics.
Connect
to Vicm
VEE
Figure 33. The example of application
circuit for unused op-amp
3) Maximum output voltage
Because the output voltage range becomes narrow as the output current
Increases, design the application with margin by considering changes in
electrical characteristics and temperature characteristics.
VCC
protection
resistor
+
-
4) Short-circuit of output terminal
When output terminal and VCC or VEE terminal are shorted, excessive
Output current may flow under some conditions, and heating may
destroy IC. It is necessary to connect a resistor as shown in Figure 34,
thereby protecting against load shorting.
VEE
5) Power supply (split supply / single supply) in used
Op-amp operates when specified voltage is applied between VCC and
VEE. Therefore, the single supply Op-Amp can be used for double supply
Op-Amp as well.
Figure 34. The example of
output short protection
6) Power dissipation (Pd)
Use a thermal design that allows for a sufficient margin in light of the power
dissipation (Pd) in actual operating conditions.
7) Short-circuit between pins and wrong mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts
between terminals, GND, or other components on the circuits, can damage the IC.
8) Use in strong electromagnetic field
Using the ICs in strong electromagnetic field can cause operation malfunction.
9) Radiation
This IC is not designed to be radiation-resistant.
10) IC handling
When stress is applied to IC because of deflection or bend of board, the characteristics may
fluctuate due to piezo resistance effects.
11) Inspection on set board
During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not
power up the board without waiting for the output capacitors to discharge. The capacitors in the low output
impedance terminal can stress the device. Pay attention to the electro static voltages during IC handling,
transportation, and storage.
12) Output capacitor
When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the
external capacitor, connected to output terminal, accumulated charge may be discharged VCC terminal via
the parasitic element within the circuit or terminal protection element. The element in the circuit may be
damaged (thermal destruction). When using this IC for an application circuit where there is oscillation, output
capacitor load does not occur, as when using this IC as a voltage comparator. Set the capacitor connected to
output terminal below 0.1μF in order to prevent damage to IC.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation
version only for a reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
●Physical Dimensions Tape and Reel Information
SOP14
<Tape and Reel information>
8.7 ± 0.2
(MAX 9.05 include BURR)
8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3MIN
4.4±0.2
6.2±0.3
14
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
1.5±0.1
0.15 ± 0.1
0.4 ± 0.1
0.11
1.27
0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SOP-J14
<Tape and Reel information>
8.65 ± 0.1
(Max 9.0 include BURR)
0.65±0.15
1
1PIN MARK
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
S
+ 0.05
0.22 −0.03
0.175±0.075
1.65MAX
1.375±0.075
0.515
1.05±0.2
8
6.0±0.2
3.9±0.1
14
4° +6°
−4°
1.27
+0.05
0.42 −0.04
0.08 S
0.08 M
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagrams
SOP14, SOP-J14 (TOP)
Part Number Marking
LOT Number
1PIN MARK
Product Name
BA14741
F
FJ
Package Type
SOP14
SOP-J14
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BA14741xx
Datasheet
●Land pattern data
all dimensions in mm
Land length
Land width
≧ℓ 2
b2
Land pitch
e
Land space
MIE
SOP14
1.27
4.60
1.10
0.76
SOP-J14
1.27
3.90
1.35
0.35
PKG
b2
e
MIE
ℓ2
●Revision History
Date
2012.11.9
Revision
001
Changes
New Release
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.