VISHAY VS-30CTH02-N3

VS-30CTH02PbF, VS-30CTH02-N3, VS-30CTH02FPPbF, VS-30CTH02FP-N3
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Vishay Semiconductors
Hyperfast Rectifier, 2 x 15 FRED Pt®
FEATURES
• Hyperfast recovery time
• Low forward voltage drop
• 175 °C operating junction temperature
TO-220AB
• Low leakage current
TO-220 FULL-PAK
• Fully isolated package (VINS = 2500 VRMS)
Base
common
cathode
2
• UL E78996 pending
• Compliant to RoHS Directive 2002/95/EC
• Designed and qualified according to JEDEC-JESD47
2
Common
cathode
1
Anode
• Halogen-free according to IEC 61249-2-21 definition
(-N3 only)
2
Common
cathode
3
Anode
3
Anode
1
Anode
VS-30CTH02PbF
VS-30CTH02-N3
DESCRIPTION/APPLICATIONS
200 V series are the state of the art hyperfast recovery
rectifiers specifically designed with optimized performance
of forward voltage drop and hyperfast recovery time.
VS-30CTH02FPPbF
VS-30CTH02FP-N3
The planar structure and the platinum doped life time
control, guarantee the best overall performance,
ruggedness and reliability characteristics.
PRODUCT SUMMARY
Package
TO-220AB, TO-220FP
IF(AV)
2 x 15 A
VR
200 V
These devices are intended for use in the output rectification
stage of SMPS, UPS, DC/DC converters as well as
freewheeling diode in low voltage inverters and chopper
motor drives.
VF at IF
1.05 V
trr typ.
See Recovery table
TJ max.
175 °C
Diode variation
Common cathode
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Peak repetitive reverse voltage
TEST CONDITIONS
VRRM
TC = 159 °C
per diode
(FULL-PAK) per diode
Average rectified forward current
IF(AV)
UNITS
200
V
15
TC = 125 °C
per device
A
30
Non-repetitive peak surge current
IFSM
Operating junction and storage temperatures
VALUES
TJ = 25 °C
200
TJ, TStg
- 65 to 175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
MIN.
TYP.
MAX.
200
-
-
IF = 15 A
-
0.92
1.05
IR = 100 μA
IF = 15 A, TJ = 125 °C
-
0.78
0.85
VR = VR rated
-
-
10
TJ = 125 °C, VR = VR rated
-
5
300
UNITS
V
μA
Reverse leakage current
IR
Junction capacitance
CT
VR = 200 V
-
57
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8
-
nH
Document Number: 94014
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 02-Jan-12
VS-30CTH02PbF, VS-30CTH02-N3, VS-30CTH02FPPbF, VS-30CTH02FP-N3
www.vishay.com
Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
TEST CONDITIONS
trr
MIN.
TYP.
MAX.
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V
-
-
35
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V
-
-
30
TJ = 25 °C
-
26
-
IF = 15 A
dIF/dt = 200 A/μs
VR = 160 V
TJ = 125 °C
Peak recovery current
IRRM
Reverse recovery charge
-
40
-
-
2.8
-
TJ = 125 °C
-
6.0
-
TJ = 25 °C
-
37
-
TJ = 125 °C
-
120
-
TJ = 25 °C
Qrr
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
Thermal resistance,
junction to case
TEST CONDITIONS
TJ, TStg
per diode
RthJC
(FULL-PAK) per diode
MIN.
TYP.
MAX.
UNITS
- 65
-
175
°C
-
-
1.1
-
-
3.5
Mounting surface, flat, smooth
and greased
Case style TO-220AB
Marking device
°C/W
30CTH02
Case style TO-220 FULL-PAK
30CTH02FP
100
100
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
10
1
0.4
IR - Reverse Current (µA)
IF - Instantaneous Forward
Current (A)
TJ = 175 °C
TJ = 150 °C
10
TJ = 125 °C
1
TJ = 100 °C
TJ = 75 °C
0.1
TJ = 50 °C
0.01
TJ = 25 °C
0.001
0.0001
0.6
0.8
1.0
1.2
1.4
1.6
0
50
100
150
200
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
Document Number: 94014
2
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 02-Jan-12
VS-30CTH02PbF, VS-30CTH02-N3, VS-30CTH02FPPbF, VS-30CTH02FP-N3
www.vishay.com
Vishay Semiconductors
CT - Junction Capacitance (pF)
1000
TJ = 25 °C
100
10
0
50
100
150
200
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
1
PDM
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
0.01
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.1
.
1
10
t1 - Rectangular Pulse Duration (s)
ZthJC - Thermal Impedance (°C/W)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
10
1
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
PDM
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.001
0.01
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.1
1
.
10
t1 - Rectangular Pulse Duration (s)
Fig. 5 - Maximum Thermal Impedance ZthJC Characteristics (FULL-PAK)
Document Number: 94014
3
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 02-Jan-12
VS-30CTH02PbF, VS-30CTH02-N3, VS-30CTH02FPPbF, VS-30CTH02FP-N3
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Vishay Semiconductors
25
Average Power Loss (W)
Allowable Case Temperature (°C)
180
170
DC
Square wave (D = 0.50)
Rated VR applied
160
150
15
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
10
5
DC
See note (1)
140
0
0
5
10
15
20
0
25
5
10
15
20
25
IF(AV) - Average Forward Current (A)
IF(AV) - Average Forward Current (A)
Fig. 6 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 8 - Forward Power Loss Characteristics
180
100
IF = 15 A
170
160
DC
150
trr (ns)
Allowable Case Temperature (°C)
RMS limit
20
140
130
120
Square wave (D = 0.50)
Rated VR applied
110
See note (1)
VR = 160 V
TJ = 125 °C
TJ = 25 °C
100
0
5
10
15
20
10
100
25
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 7 - Maximum Allowable Case Temperature vs.
Average Forward Current (FULL-PAK)
Fig. 9 - Typical Reverse Recovery Time vs. dIF/dt
1000
Qrr (nC)
IF = 15 A
100
10
100
VR = 160 V
TJ = 125 °C
TJ = 25 °C
1000
dIF/dt (A/µs)
Fig. 10 - Typical Stored Charge vs. dIF/dt
Note
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 8); PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
(1)
Document Number: 94014
4
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 02-Jan-12
VS-30CTH02PbF, VS-30CTH02-N3, VS-30CTH02FPPbF, VS-30CTH02FP-N3
www.vishay.com
Vishay Semiconductors
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 11 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 12 - Reverse Recovery Waveform and Definitions
Document Number: 94014
5
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 02-Jan-12
VS-30CTH02PbF, VS-30CTH02-N3, VS-30CTH02FPPbF, VS-30CTH02FP-N3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
30
C
T
H
02
FP
PbF
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current rating (30 = 30 A)
3
-
C = Common cathode
4
-
T = TO-220
5
-
H = Hyperfast recovery
6
-
Voltage rating (02 = 200 V)
7
-
None = TO-220AB
8
-
Environmental digit:
FP = TO-220 FULL-PAK
PbF = Lead (Pb)-free and RoHS compliant
-N3 = Halogen-free, RoHS compliant and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
VS-20CTH03PbF
50
1000
PACKAGING DESCRIPTION
Antistatic plastic tube
VS-20CTH03-N3
50
1000
Antistatic plastic tube
VS-20CTH03FPPbF
50
1000
Antistatic plastic tube
VS-20CTH03FP-N3
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
TO-220AB
www.vishay.com/doc?95222
TO-220FP
www.vishay.com/doc?95072
TO-220ABPbF
www.vishay.com/doc?95225
TO-220AB-N3
www.vishay.com/doc?95028
TO-220FPPbF
www.vishay.com/doc?95069
TO-220FP-N3
www.vishay.com/doc?95456
Document Number: 94014
6
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 02-Jan-12
Outline Dimensions
www.vishay.com
Vishay Semiconductors
DIMENSIONS in millimeters
10.6
10.4
Hole Ø
3.4
3.1
2.8
2.6
3.7
3.2
7.31
6.91
16.0
15.8
16.4
15.4
10°
3.3
3.1
13.56
13.05
2.54 TYP.
0.61
0.38
0.9
0.7
2.54 TYP.
R 0.7
(2 places)
R 0.5
1.4
1.3
2.85
2.65
1.15
TYP.
1.05
Lead assignments
4.8
4.6
Diodes
1. - Anode/open
2. - Cathode
3. - Anode
5° ± 0.5°
Revision: 20-Jul-11
5° ± 0.5°
Conforms to JEDEC outline TO-220 FULL-PAK
Document Number: 95072
1
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Outline Dimensions
Vishay Semiconductors
TO-220AB
DIMENSIONS in millimeters and inches
A
(6)
E
E2
ØP
0.014 M B A M
(7)
A
B
Seating
plane
A
Thermal pad
(E)
A1
1
Q
(6)
D
(H1)
H1
(7)
C
D2 (6)
(6) D
2 3
D
L1 (2)
C
Detail B
D1
3xb
1
2
3
3 x b2
Detail B
C
E1 (6)
L
Base metal
View A - A
c
Plating
c1 (4)
c
A
2x e
A2
e1
(b, b2)
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead assignments
Lead tip
Diodes
Conforms to JEDEC outline TO-220AB
1. - Anode/open
2. - Cathode
3. - Anode
SYMBOL
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.56
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.25
8.38
9.02
11.68
12.88
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.101
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.600
0.330
0.355
0.460
0.507
NOTES
A
A1
A2
b
b1
4
b2
b3
4
c
c1
4
D
3
D1
D2
6
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1 and E do not include mold flash. Mold flash
shall not exceed 0.127 mm (0.005") per side. These dimensions
are measured at the outermost extremes of the plastic body
(4) Dimension b1, b3 and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2 and
E1
Document Number: 95222
Revision: 08-Mar-11
SYMBOL
E
E1
E2
e
e1
H1
L
L1
ØP
Q

(7)
(8)
MILLIMETERS
MIN.
MAX.
10.11
10.51
6.86
8.89
0.76
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.73
2.60
3.00
90° to 93°
INCHES
MIN.
MAX.
0.398
0.414
0.270
0.350
0.030
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.147
0.102
0.118
90° to 93°
NOTES
3, 6
6
7
6, 7
2
Dimensions E2 x H1 define a zone where stamping and
singulation irregularities are allowed
Outline conforms to JEDEC TO-220, except A2 (maximum) and
D2 (minimum) where dimensions are derived from the actual
package outline
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
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Revision: 12-Mar-12
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Document Number: 91000