ON CM1220-08CP 4 and 8-channel esd protection arrays in csp Datasheet

4 and 8-Channel ESD Protection
Arrays in CSP
CM1220
Features
•
•
•
•
•
•
•
•
Four and eight channels of ESD protection
TM
OptiGuard coated for improved reliability
±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
Chip Scale Package (CSP) features extremely low
lead inductance for optimum ESD protection
5 bump, 0.960mm X 1.330mm CSP footprint
for CM1220-04
10 bump, 1.960mm X 1.330mm CSP footprint
for CM1220-08
RoHS-compliant, lead-free version packaging
Functional Description
The CM1220 ESD protection arrays are available in four
and eight channel configurations. Each ESD channel
features a nominal capacitance of 14pF making the devices
ideal for protecting high speed I/O ports and LCD and
camera data lines without significantly affecting signal
integrity. The CM1220 integrates avalanche-type ESD
diodes on every channel, providing a very high level of
protection for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). These diodes
safely dissipate ESD strikes of ±15kV, exceeding the
maximum requirement of the IEC61000-4-2 international
Applications
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
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•
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LCD and camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
Keypads and buttons
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
CM1220 protect against contact discharges at greater than
±30kV.
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-touse pin assignments. In particular, the CM1220 is ideal for
protecting high speed I/O ports and data and control lines
for the LCD display and camera interface in mobile
handsets.
The CM1220 incorporates CMD’s OptiGuard
TM
coating for
improved reliability at assembly in a space-saving, lowprofile Chip Scale Package.
Block Diagram
©2010 SCILLC. All rights reserved.
March 2010 – Rev.2
Publication Order Number:
CM1220/D
CM1220
Pin Configurations
Top View
(Bumps Down)
Bottom View
(Bumps Up)
CM1220-04
5-Bump CSP Package
With OptiGuardTM
Top View
(Bumps Down)
Bottom View
(Bumps Up)
CM1220-08
10-Bump CSP Package
With OptiGuardTM
Note:
1). These drawings are not to scale.
Rev.2 | Page 2 of 10 | www.onsemi.com
CM1220
Pin Descriptions
CM1220-08
CM1220-04
PINS
NAME
PINS
NAME
A1
ESD1
A1
ESD1
A3
ESD2
A3
A5
ESD3
A7
B2
CM1220-08
DESCRIPTION
CM1220-04
DESCRIPTION
PINS
NAME
PINS
NAME
ESD Channel
C1
ESD5
C1
ESD3
ESD Channel
ESD2
ESD Channel
C3
ESD6
C3
ESD4
ESD Channel
−
−
ESD Channel
C5
ESD7
−
−
ESD Channel
ESD4
−
−
ESD Channel
C7
ESD8
−
−
ESD Channel
GND
B2
GND
Device Ground
B6
GND
−
−
Device Ground
Ordering Information
1
Bumps
Package
Ordering Part Number
Part Marking
5
CSP
CM1220-04CP
J
10
CSP
CM1220-08CP
L208
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Absolute Maximum Ratings
PARAMETER
Storage Temperature Range
RATING
UNITS
-65 to +150
°C
RATING
UNITS
-40 to +85
°C
Standard Operating Conditions
PARAMETER
Operating Temperature Range
Rev. 2 | Page 3 of 10 | www.onsemi.com
CM1220
Electrical Operating Characteristics (see Note 1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
11
14
17
pF
CDIODE
Diode (Channel) Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
VDIODE
Diode Standoff Voltage
IDIODE = 10µA
6.0
ILEAK
Diode Leakage Current
VIN = +3.3V
(reverse bias voltage)
0.1
1
µA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
IDIODE = 10mA
6.8
-0.8
9.0
-0.4
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method 3015
b) Contact Discharge per IEC 61000-4-2
Note 2
VESD
RDYN
5.6
-1.5
Dynamic Resistance
Positive
Negative
kV
kV
±30
±15
2.3
0.9
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open.
Performance Information
Capacitance (Normalized)
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 1. Insertion Loss Vs. Frequency (0V Bias)
Rev.2 | Page 4 of 10 | www.onsemi.com
V
Ω
Ω
CM1220
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous (183ûC)
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 2. Recommended Non-Solder Mask Defined Pad Illustration
Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 5 of 10 | www.onsemi.com
60 seconds
260°C
CM1220
Mechanical Specifications
The CM1220 is supplied in custom Chip Scale Packages (CSP) depending on the channel count. Dimensions for these
packages are presented in the following pages.
CM1220-04CP Mechanical Specifications
Package Specifications
Package
Custom CSP
Bumps
5
Dim
Millimeters
Min
Nom
Max
Inches
Min
Nom
Max
A1
0.915 0.960 1.005 0.0360 0.0378 0.0396
A2
1.285 1.330 1.375 0.0506 0.0524 0.0541
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for CM1220-04CP Chip Scale
3500 pieces
Controlling dimension: millimeters
Rev.2 | Page 6 of 10 | www.onsemi.com
Package
CM1220
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1220-04
1.33 X 0.96 X 0.644
1.42 X 1.07 X 0.740
8mm
178mm (7")
3500
4mm
4mm
Rev. 2 | Page 7 of 10 | www.onsemi.com
CM1220
CM1220-08CP Mechanical Specifications
Package Specifications
Package
Custom CSP
Bumps
10
Dim
Millimeters
Min
Nom
Max
Inches
Min
Nom
Max
A1
1.915 1.960 2.005 0.0754 0.0772 0.0789
A2
1.285 1.330 1.375 0.0506 0.0524 0.0541
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
0.091
0.0110
Package Dimensions for CM1220-08CP Chip Scale
3500 pieces
Controlling dimension: millimeters
Rev.2 | Page 8 of 10 | www.onsemi.com
Package
CM1220
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
CM1220-08
1.96 X 1.33 X 0.644
POCKET SIZE (mm)
B0 X A0 X K0
2.08 X 1.45 X 0.740
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
8mm
178mm (7")
3500
4mm
4mm
Rev. 2 | Page 9 of 10 | www.onsemi.com
CM1220
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
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