AD ADUM7442 1 kv rms quad-channel digital isolator Datasheet

1 kV RMS Quad-Channel Digital Isolators
ADuM7440/ADuM7441/ADuM7442
FEATURES
GENERAL DESCRIPTION
Small, 16-lead QSOP
1000 V rms isolation rating
Safety and regulatory approvals
UL recognition
UL 1577: 1000 V rms for 1 minute
CSA Component Acceptance Notice #5A (pending)
Low power operation
5 V operation
2.25 mA per channel maximum @ 0 Mbps to 1 Mbps
11.5 mA per channel maximum @ 25 Mbps
3.3 V operation
1.5 mA per channel maximum @ 0 Mbps to 1 Mbps
8.25 mA per channel maximum @ 25 Mbps
Bidirectional communication
Up to 25 Mbps data rate (NRZ)
3 V/5 V level translation
High temperature operation: 105°C
High common-mode transient immunity: >15 kV/ μs
The ADuM744x1 are 4-channel digital isolators based on the
Analog Devices, Inc., iCoupler® technology. Combining high
speed CMOS and monolithic air core transformer technologies,
these isolation components provide outstanding performance
characteristics superior to the alternatives, such as optocoupler
devices and other integrated couplers.
The ADuM744x family of quad 1 kV digital isolation devices
is packaged in a small 16-lead QSOP. While most 4-channel
isolators come in 16-lead wide SOIC packages, the ADuM744x
frees almost 70% of board space and yet can still withstand high
isolation voltage and meet regulatory requirements such as UL
and CSA standards (pending). In addition to the space savings,
the ADuM744x offers a lower price than 2.5 kV or 5 kV
isolators where only functional isolation is needed.
This family, like many Analog Devices isolators, offers very
low power consumption, consuming one-tenth to one-sixth
the power of comparable isolators at comparable data rates up
to 25 Mbps. Despite the low power consumption, all models of
the ADuM744x provide low pulse width distortion (< 5 ns for
C grade). In addition, every model has an input glitch filter to
protect against extraneous noise disturbances.
APPLICATIONS
General-purpose, multichannel isolation
SPI interface/data converter isolation
RS-232/RS-422/RS-485 transceivers
Industrial field bus isolation
The ADuM744x isolators provide four independent isolation
channels in a variety of channel configurations and two data
rates (see the Ordering Guide) up to 25 Mbps. All models
operate with the supply voltage on either side ranging from
3.0 V to 5.5 V, providing compatibility with lower voltage
systems as well as enabling voltage translation functionality
across the isolation barrier. All products also have an output
default high logic state in the absence of the input power.
1
Protected by U.S. Patents 5,952,849, 6,873,065 and 7,075,329. Other patents
pending.
VDD1A 1
GND1 2
ADuM7440
16 VDD2A
VDD1A 1
15 GND2
GND1 2
ADuM7441
16
VDD2A
VDD1A 1
15
GND2
GND1 2
ADuM7442
16
VDD2A
15
GND2
DECODE
14 VOA
VIA 3
ENCODE
DECODE
14
VOA
VIA 3
ENCODE
DECODE
14
VOA
VIB 4
ENCODE
DECODE
13 VOB
VIB 4
ENCODE
DECODE
13
VOB
VIB 4
ENCODE
DECODE
13
VOB
VIC 5
ENCODE
DECODE
12 VOC
VIC 5
ENCODE
DECODE
12
VOC
VOC 5
DECODE
ENCODE
12
VIC
VID 6
ENCODE
DECODE
11 VOD
VOD 6
DECODE
ENCODE
11
VID
VOD 6
DECODE
ENCODE
11
VID
VDD1B 7
10
VDD2B
VDD1B 7
10
VDD2B
GND1 8
9
GND2
GND1 8
9
GND2
VDD1B 7
10 VDD2B
GND1 8
9 GND2
Figure 1. ADuM7440
Figure 2. ADuM7441
08340-002
ENCODE
08340-001
VIA 3
08340-003
FUNCTIONAL BLOCK DIAGRAMS
Figure 3. ADuM7442
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
www.analog.com
Tel: 781.329.4700
Fax: 781.461.3113 ©2009–2011 Analog Devices, Inc. All rights reserved.
ADuM7440/ADuM7441/ADuM7442
TABLE OF CONTENTS
Features .............................................................................................. 1
Recommended Operating Conditions .......................................7
Applications ....................................................................................... 1
Absolute Maximum Ratings ............................................................8
General Description ......................................................................... 1
ESD Caution...................................................................................8
Functional Block Diagrams ............................................................. 1
Pin Configurations and Function Descriptions ............................9
Revision History ............................................................................... 2
Typical Performance Characteristics ........................................... 12
Specifications..................................................................................... 3
Applications Information .............................................................. 14
Electrical Characteristics—5 V Operation................................ 3
PC Board Layout ........................................................................ 14
Electrical Characteristics—3.3 V Operation ............................ 4
Propagation Delay-Related Parameters................................... 14
Electrical Characteristics—Mixed 5 V/3.3 V Operation ........ 5
DC Correctness and Magnetic Field Immunity........................... 14
Electrical Characteristics—Mixed 3.3 V/5 V Operation ........ 6
Power Consumption .................................................................. 15
Package Characteristics ............................................................... 7
Insulation Lifetime ..................................................................... 15
Regulatory Information ............................................................... 7
Outline Dimensions ....................................................................... 17
Insulation and Safety-Related Specifications ............................ 7
Ordering Guide .......................................................................... 17
REVISION HISTORY
2/11—Rev. A to Rev. B
Changes to Figure 7 ........................................................................ 11
8/10—Rev. 0 to Rev. A
Change Features ................................................................................ 1
Changes to Table 1 ............................................................................ 3
Added Note 1, Table 1 ...................................................................... 3
Changes to Table 4 ............................................................................ 4
Added Note 1, Table 4 ...................................................................... 4
Changes to Table 7 ............................................................................ 5
Added Note 1, Table 7 ...................................................................... 5
Changes to Table 10 .......................................................................... 6
Added Note 1, Table 10 .................................................................... 6
Changes to Table 14 .......................................................................... 7
10/09—Revision 0: Initial Version
Rev. B | Page 2 of 20
ADuM7440/ADuM7441/ADuM7442
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS—5 V OPERATION
All typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended
operation range of 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF, and CMOS signal levels, unless otherwise noted.
Table 1.
Parameter
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
Propagation Delay Skew 1
Channel Matching
Codirectional
Opposing-Direction
Jitter
1
Min
Symbol
tPHL, tPLH
PWD
A Grade
Typ
Max
1
75
25
50
10
5
PW
tPSK
Min
29
250
C Grade
Typ
Max
40
2
3
25
50
5
40
20
tPSKCD
tPSKOD
10
25
30
2
3
2
2
4
6
Unit
Test Conditions
Mbps
ns
ns
ps/°C
ns
ns
Within PWD limit
50% input to 50% output
|tPLH − tPHL|
Within PWD limit
ns
ns
ns
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load within the
recommended operating conditions.
Table 2.
Parameter
SUPPLY CURRENT
ADuM7440
ADuM7441
ADuM7442
Symbol
Min
1 Mbps—A Grade
Typ
Max
IDD1
IDD2
IDD1
IDD2
IDD1
IDD2
4.3
2.5
4.1
3.6
3.2
3.2
Min
5.4
3.6
4.9
4.7
4.0
4.0
25 Mbps—C Grade
Typ
Max
28
6.0
18
8.5
15
12
35
11
26
14
20
17
Unit
Test Conditions
mA
mA
mA
mA
mA
mA
Table 3. For All Models
Parameter
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
Logic Low Output Voltages
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
Output Rise/Fall Time
Common-Mode Transient Immunity1
Refresh Rate
1
Symbol
Min
VIH
VIL
VOH
0.7 VDDx
Max
0.3 VDDx
VDDx − 0.1
VDDx − 0.4
VOL
II
Typ
−10
5.0
4.8
0.0
0.2
+0.01
0.1
0.4
+10
Test Conditions
V
V
V
V
V
V
µA
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VI x ≤ VDDx
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
0.76
0.57
0.26
0.05
tR/tF
|CM|
2.0
25
ns
kV/µs
1.2
Mbps
fr
15
0.95
0.73
Unit
mA
mA
mA/Mbps
mA/Mbps
10% to 90%
VIx = VDDx, VCM = 1000 V,
transient magnitude = 800 V
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both rising and falling
common-mode voltage edges.
Rev. B | Page 3 of 20
ADuM7440/ADuM7441/ADuM7442
ELECTRICAL CHARACTERISTICS—3.3 V OPERATION
All typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended
operation range of 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V; and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications
are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 4.
Parameter
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
Propagation Delay Skew1
Channel Matching
Codirectional
Opposing-Direction
Jitter
1
Min
Symbol
tPHL, tPLH
PWD
A Grade
Typ
Max
1
85
25
60
10
5
PW
tPSK
Min
37
250
C Grade
Typ
Max
51
2
3
25
66
5
40
20
tPSKCD
tPSKOD
10
25
30
3
4
2
2
5
7
Unit
Test Conditions
Mbps
ns
ns
ps/°C
ns
ns
Within PWD limit
50% input to 50% output
|tPLH − tPHL|
Within PWD limit
ns
ns
ns
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
Table 5.
Parameter
SUPPLY CURRENT
ADuM7440
ADuM7441
ADuM7442
Symbol
Min
1 Mbps—A, C Grades
Typ
Max
IDD1
IDD2
IDD1
IDD2
IDD1
IDD2
3.0
1.8
2.8
2.5
2.2
2.2
Min
3.8
2.3
3.5
3.3
2.7
2.8
25 Mbps—C Grade
Typ
Max
20
4.0
14
5.5
10
8.4
28
5.0
20
7.5
13
11
Unit
Test Conditions
mA
mA
mA
mA
mA
mA
Table 6. For All Models
Parameter
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
Logic Low Output Voltages
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
Output Rise/Fall Time
Common-Mode Transient Immunity1
Refresh Rate
1
Symbol
Min
VIH
VIL
VOH
0.7 VDDx
−10
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
tR/tF
|CM|
fr
Max
0.3 VDDx
VDDx − 0.2
VDDx − 0.4
VOL
II
Typ
15
3.3
3.1
0.0
0.2
+0.01
0.1
0.4
+10
Unit
Test Conditions
V
V
V
V
V
V
µA
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VI x ≤ VDDx
0.50
0.41
0.18
0.02
mA
mA
mA/Mbps
mA/Mbps
2.8
20
ns
kV/µs
1.1
Mbps
10% to 90%
VIx = VDDx, VCM = 1000 V,
transient magnitude = 800 V
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. B | Page 4 of 20
ADuM7440/ADuM7441/ADuM7442
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3.3 V OPERATION
All typical specifications are at TA = 25°C, VDD1 = 5 V, VDD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended operation range of 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V; and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching
specifications are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 7.
Parameter
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
Propagation Delay Skew1
Channel Matching
Codirectional
Opposing-Direction
Jitter
1
Min
Symbol
tPHL tPLH
PWD
A Grade
Typ
Max
1
80
25
55
10
5
PW
tPSK
Min
30
250
C Grade
Typ
Max
42
2
3
25
55
5
40
20
tPSKCD
tPSKOD
10
25
30
2
3
2
2
5
6
Unit
Test Conditions
Mbps
ns
ns
ps/°C
ns
ns
Within PWD limit
50% input to 50% output
|tPLH − tPHL|
Within PWD limit
ns
ns
ns
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
Table 8.
Parameter
SUPPLY CURRENT
ADuM7440
ADuM7441
ADuM7442
Symbol
Min
1 Mbps—A, C Grades
Typ
Max
IDD1
IDD2
IDD1
IDD2
IDD1
IDD2
4.4
1.6
3.7
2.2
3.2
2.0
Min
5.5
2.1
5.0
2.8
3.9
2.6
25 Mbps—C Grade
Typ
Max
28
3.5
19
5.2
15
7.8
35
4.5
27
7.0
20
12
Unit
Test Conditions
mA
mA
mA
mA
mA
mA
Table 9. For All Models
Parameter
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
Logic Low Output Voltages
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
Output Rise/Fall Time
Common-Mode Transient Immunity1
Refresh Rate
1
Symbol
Min
VIH
VIL
VOH
0.7 VDDx
VDDx − 0.1
VDDx− 0.4
−10
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
tR/tF
|CM|
fr
Max
0.3 VDDx
VOL
II
Typ
15
VDDx
VDDx − 0.2
0.0
0.2
+0.01
0.1
0.4
+10
Unit
Test Conditions
V
V
V
V
V
V
µA
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VIx ≤ VDDx
0.77
0.40
0.26
0.02
mA
mA
mA/Mbps
mA/Mbps
2.5
20
ns
kV/µs
1.2
Mbps
10% to 90%
VIx = VDDx, VCM = 1000 V,
transient magnitude = 800 V
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. B | Page 5 of 20
ADuM7440/ADuM7441/ADuM7442
ELECTRICAL CHARACTERISTICS—MIXED 3.3 V/5 V OPERATION
All typical specifications are at TA = 25°C, VDD1 = 3.3 V, VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended operation range of 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching
specifications are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.
Table 10.
Parameter
SWITCHING SPECIFICATIONS
Data Rate
Propagation Delay
Pulse Width Distortion
Change vs. Temperature
Pulse Width
Propagation Delay Skew1
Channel Matching
Codirectional
Opposing-Direction
Jitter
1
Symbol
Min
tPHL, tPLH
PWD
A Grade
Typ
Max
1
80
25
55
10
5
PW
tPSK
Min
31
250
C Grade
Typ
Max
46
2
3
25
60
5
40
20
tPSKCD
tPSKOD
10
25
30
2
3
2
2
5
7
Unit
Test Conditions
Mbps
ns
ns
ps/°C
ns
ns
Within PWD limit
50% input to 50% output
|tPLH − tPHL|
Within PWD limit
ns
ns
ns
tPSK is the magnitude of the worst-case difference in tPHL or tPLH that is measured between units at the same operating temperature, supply voltages, and output load
within the recommended operating conditions.
Table 11.
Parameter
SUPPLY CURRENT
ADuM7440
ADuM7441
ADuM7442
Symbol
Min
1 Mbps—A, C Grades
Typ
Max
2.7
2.5
2.5
3.6
2.0
3.2
IDD1
IDD2
IDD1
IDD2
IDD1
IDD2
25 Mbps—C Grade
Min
Typ
Max
3.3
3.3
3.3
4.6
2.4
4.0
18
5.7
12
8.0
8.9
12
24
8.0
20
11
13
15
Unit
Test Conditions
mA
mA
mA
mA
mA
mA
Table 12. For All Models
Parameter
DC SPECIFICATIONS
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages
Logic Low Output Voltages
Input Current per Channel
Supply Current per Channel
Quiescent Input Supply Current
Quiescent Output Supply Current
Dynamic Input Supply Current
Dynamic Output Supply Current
AC SPECIFICATIONS
Output Rise/Fall Time
Common-Mode Transient Immunity1
Refresh Rate
1
Symbol
Min
VIH
VIL
VOH
0.7 VDDx
VDDx − 0.1
VDDx − 0.4
−10
IDDI(Q)
IDDO(Q)
IDDI(D)
IDDO(D)
tR/tF
|CM|
fr
Max
0.3 VDDx
VOL
II
Typ
VDDx
VDDx − 0.2
0.0
0.2
+0.01
0.50
0.61
0.17
0.03
15
0.1
0.4
+10
0.60
0.73
Unit
Test Conditions
V
V
V
V
V
V
µA
IOx = −20 µA, VIx = VIxH
IOx = −4 mA, VIx = VIxH
IOx = 20 µA, VIx = VIxL
IOx = 4 mA, VIx = VIxL
0 V ≤ VI x ≤ VDDx
mA
mA
mA/Mbps
mA/Mbps
2.5
20
ns
kV/µs
1.1
Mbps
10% to 90%
VIx = VDDx, VCM = 1000 V,
transient magnitude = 800 V
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. B | Page 6 of 20
ADuM7440/ADuM7441/ADuM7442
PACKAGE CHARACTERISTICS
Table 13.
Parameter
Resistance (Input-to-Output)1
Capacitance (Input-to-Output)1
Input Capacitance2
IC Junction-to-Ambient Thermal
Resistance
1
2
Symbol
RI-O
CI-O
CI
θJA
Min
Typ
1013
2
4.0
76
Max
Unit
Ω
pF
pF
°C/W
Test Conditions
f = 1 MHz
Thermocouple located at center of package
underside
The device is considered a 2-terminal device: Pin 1 through Pin 8 are shorted together and Pin 9 through Pin 16 are shorted together.
Input capacitance is from any input data pin to ground.
REGULATORY INFORMATION
The ADuM744x is approved by the organizations listed in Table 14. See Table 18 and the Insulation Lifetime section for recommended
maximum working voltages for specific cross-isolation waveforms and insulation levels.
Table 14.
UL
Recognized under UL 1577 Component
Recognition Program1
Single Protection,
1000 V rms Isolation Voltage
File E274400
1
CSA (Pending)
Approved under CSA Component
Acceptance Notice #5A
Basic insulation per CSA 60950-1-03 and IEC 60950-1, 148 V rms (210 V peak)
maximum working voltage
File 205078
In accordance with UL 1577, each ADuM744x is proof tested by applying an insulation test voltage ≥1200 V rms for 1 sec (current leakage detection limit = 5 µA).
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 15.
L(I01)
Value
1000
3.8
Unit
V rms
mm min
Minimum External Tracking (Creepage)
L(I02)
2.8
mm min
Minimum Internal Gap (Internal Clearance)
Tracking Resistance (Comparative Tracking Index)
Isolation Group
CTI
2.6
>175
IIIa
μm min
V
Symbol
Conditions
1-minute duration
Measured from input terminals to output terminals,
shortest distance through air
Measured from input terminals to output terminals,
shortest distance path along body
Insulation distance through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
350
RECOMMENDED OPERATING CONDITIONS
300
Table 16.
Parameter
Operating Temperature
Supply Voltages1
Input Signal Rise and Fall Times
250
200
Symbol
TA
VDD1, VDD2
Min
−40
3.0
Max
+105
5.5
1.0
Unit
°C
V
ms
150
1
100
All voltages are relative to their respective ground. See the DC Correctness
and Magnetic Field Immunity section for information on immunity to external
magnetic fields.
50
0
0
50
100
150
CASE TEMPERATURE (°C)
200
08340-007
SAFETY-LIMITING CURRENT (mA)
Parameter
Rated Dielectric Insulation Voltage
Minimum External Air Gap (Clearance)
Figure 4. Thermal Derating Curve, Dependence of Safety-Limiting Values
with Case Temperature per DIN V VDE V 0884-10
Rev. B | Page 7 of 20
ADuM7440/ADuM7441/ADuM7442
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 17.
Parameter
Storage Temperature (TST) Range
Ambient Operating Temperature (TA)
Supply Voltages (VDD1, VDD2)
Input Voltages (VIA, VIB, VIC, VID)1, 2
Output Voltages (VOA, VOB, VOC, VOD) 1, 2
Average Output Current per Pin3
Side 1 (IO1)
Side 2 (IO2)
Common-Mode Transients3
Rating
−65°C to +150°C
−40°C to +105°C
−0.5 V to +7.0 V
−0.5 V to VDDI + 0.5 V
−0.5 V to VDDO + 0.5 V
ESD CAUTION
−10 mA to +10 mA
−10 mA to +10 mA
−100 kV/µs to +100 kV/µs
VDDI and VDDO refer to the supply voltages on the input and output sides of a
given channel, respectively. See the PC Board Layout section.
2
See Figure 4 for maximum rated current values for various temperatures.
3
Refers to common-mode transients across the insulation barrier. Commonmode transients exceeding the absolute maximum ratings may cause
latch-up or permanent damage.
1
Table 18. Maximum Continuous Working Voltage1
Parameter
AC Voltage, Bipolar Waveform
AC Voltage, Unipolar Waveform
Basic Insulation
DC Voltage
Basic Insulation
1
Max
420
Unit
V peak
Constraint
50-year minimum lifetime
420
V peak
50-year minimum lifetime
420
V peak
50-year minimum lifetime
Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details.
Table 19. Truth Table (Positive Logic)
VIx Input1
H
L
X
VDDI State2
Powered
Powered
Unpowered
VDDO State3
Powered
Powered
Powered
VOxOutput1
H
L
H
X
Powered
Unpowered
Z
Description
Normal operation; data is high.
Normal operation; data is low.
Input unpowered. Outputs are in the default high state. Outputs return to
input state within 1 µs of VDDI power restoration. See the pin function
descriptions (Table 20 through Table 22) for more details.
Output unpowered. Output pins are in high impedance state. Outputs
return to input state within 1 µs of VDDO power restoration. See the pin function
descriptions (Table 20 through Table 22) for more details.
VIx and VOx refer to the input and output signals of a given channel (A, B, C, or D).
VDDI refers to the power supply on the input side of a given channel (A, B, C, or D).
3
VDDO refers to the power supply on the output side of a given channel (A, B, C, or D).
1
2
Rev. B | Page 8 of 20
ADuM7440/ADuM7441/ADuM7442
VDD1A 1
16
VDD2A
GND1* 2
15
GND2*
VIA 3
ADuM7440
14
VOA
VIB 4
TOP VIEW
(Not to Scale)
13
VOB
VIC 5
12
VOC
VID 6
11
VOD
VDD1B 7
10
VDD2B
GND1* 8
9
GND2*
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED. CONNECTING BOTH
TO GND1 IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY
CONNECTED. CONNECTING BOTH TO GND2 IS RECOMMENDED.
08340-004
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 5. ADuM7440 Pin Configuration
Table 20. ADuM7440 Pin Function Descriptions
Pin No.
1
Mnemonic
VDD1A
2
GND1
3
4
5
6
7
VIA
VIB
VIC
VID
VDD1B
8
GND1
9
GND2
10
VDD2B
11
12
13
14
15
VOD
VOC
VOB
VOA
GND2
16
VDD2A
Description
Supply Voltage A for Isolator Side 1 (3.0 V to 5.5 V). Pin 1 must be connected externally to Pin 7. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD1A (Pin 1) and GND1 (Pin 2).
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
Logic Input A.
Logic Input B.
Logic Input C.
Logic Input D.
Supply Voltage B for Isolator Side 1 (3.0 V to 5.5 V). Pin 7 must be connected externally to Pin 1. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD1B (Pin 7) and GND1 (Pin 8).
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
Supply Voltage B for Isolator Side 2 (3.0 V to 5.5 V). Pin 10 must be connected externally to Pin 16. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD2B (Pin 10) and GND2 (Pin 9).
Logic Output D.
Logic Output C.
Logic Output B.
Logic Output A.
Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
Supply Voltage A for Isolator Side 2 (3.0 V to 5.5 V). Pin 16 must be connected externally to Pin 10. Connect a
ceramic bypass capacitor of value 0.01 µF to 0.1 µF between VDD2A (Pin 16) and GND2 (Pin 15).
Rev. B | Page 9 of 20
VDD1A 1
16
VDD2A
GND1* 2
15
GND2*
VIA 3
ADuM7441
14
VOA
VIB 4
TOP VIEW
(Not to Scale)
13
VOB
12
VOC
VOD 6
VIC 5
11
VID
VDD1B 7
10
VDD2B
GND1* 8
9
GND2*
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED. CONNECTING BOTH
TO GND1 IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY
CONNECTED. CONNECTING BOTH TO GND2 IS RECOMMENDED.
08340-005
ADuM7440/ADuM7441/ADuM7442
Figure 6. ADuM7441 Pin Configuration
Table 21. ADuM7441 Pin Function Descriptions
Pin No.
1
Mnemonic
VDD1A
2
GND1
3
4
5
6
7
VIA
VIB
VIC
VOD
VDD1B
8
GND1
9
GND2
10
VDD2B
11
12
13
14
15
VID
VOC
VOB
VOA
GND2
16
VDD2A
Description
Supply Voltage A for Isolator Side 1 (3.0 V to 5.5 V). Pin 1 must be connected externally to Pin 7. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD1A (Pin 1) and GND1 (Pin 2).
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
Logic Input A.
Logic Input B.
Logic Input C.
Logic Output D.
Supply Voltage B for Isolator Side 1 (3.0 V to 5.5 V). Pin 7 must be connected externally to Pin 1. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD1B (Pin 7) and GND1 (Pin 8).
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
Supply Voltage B for Isolator Side 2 (3.0 V to 5.5 V). Pin 10 must be connected externally to Pin 16. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD2B (Pin 10) and GND2 (Pin 9).
Logic Input D.
Logic Output C.
Logic Output B.
Logic Output A.
Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
Supply Voltage A for Isolator Side 2 (3.0 V to 5.5 V). Pin 16 must be connected externally to Pin 10. Connect a
ceramic bypass capacitor of value 0.01 µF to 0.1 µF between VDD2A (Pin 16) and GND2 (Pin 15).
Rev. B | Page 10 of 20
ADuM7440/ADuM7441/ADuM7442
16 VDD2A
VDD1A 1
15 GND2*
VIA 3
ADuM7442
VIB 4
TOP VIEW
(Not to Scale)
VOC 5
VOD 6
14 VOA
13 VOB
12 VIC
11 VID
VDD1B 7
10 VDD2B
GND1* 8
9
GND2*
*PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED. CONNECTING BOTH
TO GND1 IS RECOMMENDED. PIN 9 AND PIN 15 ARE INTERNALLY
CONNECTED. CONNECTING BOTH TO GND2 IS RECOMMENDED.
08340-006
GND1* 2
Figure 7. ADuM7442Pin Configuration
Table 22. ADuM7442 Pin Function Descriptions
Pin No.
1
Mnemonic
VDD1A
2
GND1
3
4
5
6
7
VIA
VIB
VOC
VOD
VDD1B
8
GND1
9
GND2
10
VDD2B
11
12
13
14
15
VID
VIC
VOB
VOA
GND2
16
VDD2A
Description
Supply Voltage A for Isolator Side 1 (3.0 V to 5.5 V). Pin 1 must be connected externally to Pin 7. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD1A (Pin 1) and GND1 (Pin 2).
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
Logic Input A.
Logic Input B.
Logic Output C.
Logic Output D.
Supply Voltage B for Isolator Side 1 (3.0 V to 5.5 V). Pin 7 must be connected externally to Pin 1. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD1B (Pin 7) and GND1 (Pin 8).
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both to GND1 is
recommended.
Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
Supply Voltage B for Isolator Side 2 (3.0 V to 5.5 V). Pin 10 must be connected externally to Pin 16. Connect a ceramic
bypass capacitor of value 0.01 µF to 0.1 µF between VDD2B (Pin 10) and GND2 (Pin 9).
Logic Input D.
Logic Input C.
Logic Output B.
Logic Output A.
Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both to GND2 is
recommended.
Supply Voltage A for Isolator Side 2 (3.0 V to 5.5 V). Pin 16 must be connected externally to Pin 10. Connect a
ceramic bypass capacitor of value 0.01 µF to 0.1 µF between VDD2A (Pin 16) and GND2 (Pin 15).
Rev. B | Page 11 of 20
ADuM7440/ADuM7441/ADuM7442
TYPICAL PERFORMANCE CHARACTERISTICS
10
35
30
8
CURRENT (mA)
CURRENT (mA)
25
6
5V
4
3V
5V
20
15
3V
10
2
0
5
10
15
20
25
30
DATA RATE (Mbps)
0
08340-015
0
0
5
10
15
20
25
30
DATA RATE (Mbps)
Figure 8. Typical Supply Current per Input Channel vs. Data Rate
for 5 V and 3 V Operation
08340-018
5
Figure 11. Typical ADuM7440 VDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
4
10
8
CURRENT (mA)
2
5V
6
5V
4
3V
1
2
3V
0
5
10
15
20
25
30
DATA RATE (Mbps)
0
08340-016
0
0
5
10
15
20
25
30
08340-019
CURRENT (mA)
3
DATA RATE (Mbps)
Figure 9. Typical Supply Current per Output Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
Figure 12. Typical ADuM7440 VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
4
35
30
3
CURRENT (mA)
CURRENT (mA)
25
5V
2
3V
20
5V
15
3V
10
1
0
5
10
15
20
25
30
0
0
DATA RATE (Mbps)
5
10
15
20
25
30
DATA RATE (Mbps)
Figure 10. Typical Supply Current per Output Channel vs. Data Rate
for 5 V and 3 V Operation (15 pF Output Load)
Figure 13. Typical ADuM7441 VDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
Rev. B | Page 12 of 20
08340-020
0
08340-017
5
25
8
20
CURRENT (mA)
10
6
5V
4
3V
15
5V
10
3V
2
0
0
5
10
15
20
25
30
DATA RATE (Mbps)
Figure 14. Typical ADuM7441 VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
0
0
5
10
15
20
25
30
DATA RATE (Mbps)
Figure 15. Typical ADuM7442 VDD1 or VDD2 Supply Current vs.
Data Rate for 5 V and 3 V Operation
Rev. B | Page 13 of 20
08340-022
5
08340-021
CURRENT (mA)
ADuM7440/ADuM7441/ADuM7442
ADuM7440/ADuM7441/ADuM7442
APPLICATIONS INFORMATION
Channel-to-channel matching refers to the maximum amount
the propagation delay differs between channels within a single
ADuM744x component.
PC BOARD LAYOUT
The ADuM744x digital isolators require no external interface
circuitry for the logic interfaces. Power supply bypassing is
strongly recommended at the input and output supply pins
(see Figure 16). A total of four bypass capacitors should be
connected between Pin 1 and Pin 2 for VDD1A, between Pin 7
and Pin 8 for VDD1B, between Pin 9 and Pin 10 for VDD2B, and
between Pin 15 and Pin 16 for VDD2A. Supply VDD1A Pin 1 and
VDD1B Pin 7 should be connected together and supply VDD2B
Pin 10 and VDD2A Pin 16 should be connected together. The
capacitor values should be between 0.01 µF and 0.1 µF. The
total lead length between both ends of the capacitor and the
power supply pin should not exceed 20 mm.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Positive and negative logic transitions at the isolator input
cause narrow (~1 ns) pulses to be sent to the decoder using the
transformer. The decoder is bistable and is, therefore, either set
or reset by the pulses, indicating input logic transitions. In the
absence of logic transitions at the input for more than ~1 µs, a
periodic set of refresh pulses indicative of the correct input state
is sent to ensure dc correctness at the output. If the decoder
receives no internal pulses of more than approximately 5 µs,
the input side is assumed to be unpowered or nonfunctional,
in which case the isolator output is forced to a default high state
by the watchdog timer circuit.
08340-014
VDD2A
GND2
VOA
VOB
VOC/VIC
VOD/VID
VDD2B
GND2
VDD1A
GND1
VIA
VIB
VIC/VOC
VID/VOD
VDD1B
GND1
Propagation delay skew refers to the maximum amount the
propagation delay differs between multiple ADuM744x
components operating under the same conditions.
The magnetic field immunity of the ADuM744x is determined
by the changing magnetic field, which induces a voltage in the
transformer’s receiving coil large enough to either falsely set or
reset the decoder. The following analysis defines the conditions
under which this can occur. The 3 V operating condition of the
ADuM744x is examined because it represents the most susceptible mode of operation.
Figure 16. Recommended Printed Circuit Board Layout
In applications involving high common-mode transients, it
is important to minimize board coupling across the isolation
barrier. Furthermore, users should design the board layout
so that any coupling that does occur equally affects all pins
on a given component side. Failure to ensure this can cause
voltage differentials between pins exceeding the absolute
maximum ratings of the device, thereby leading to latch-up
or permanent damage.
The pulses at the transformer output have an amplitude greater
than 1.0 V. The decoder has a sensing threshold at about 0.5 V, thus
establishing a 0.5 V margin in which induced voltages can be
tolerated. The voltage induced across the receiving coil is given by
PROPAGATION DELAY-RELATED PARAMETERS
Propagation delay is a parameter that describes the time it takes
a logic signal to propagate through a component. The input-tooutput propagation delay time for a high-to-low transition may
differ from the propagation delay time of a low-to-high
transition.
INPUT (VIx)
50%
OUTPUT (VOx)
tPHL
08340-008
tPLH
50%
Figure 17. Propagation Delay Parameters
V = (−dβ / dt) ∑ π rn2; n = 1, 2, … , N
where:
β is magnetic flux density (gauss).
rn is the radius of the nth turn in the receiving coil (cm).
N is the number of turns in the receiving coil.
Given the geometry of the receiving coil in the ADuM744x and
an imposed requirement that the induced voltage be, at most,
50% of the 0.5 V margin at the decoder, a maximum allowable
magnetic field at a given frequency can be calculated. The result
is shown in Figure 18.
Pulse width distortion is the maximum difference between
these two propagation delay values and an indication of how
accurately the timing of the input signal is preserved.
Rev. B | Page 14 of 20
POWER CONSUMPTION
1000
The supply current at a given channel of the ADuM744x
isolator is a function of the supply voltage, the data rate of
the channel, and the output load of the channel.
100
10
For each input channel, the supply current is given by
1
0.1
f ≤ 0.5 fr
IDDI = IDDI (D) × (2f − fr) + IDDI (Q)
f > 0.5 fr
IDDO = IDDO (Q)
0.001
1k
10M
10k
100k
1M
MAGNETIC FIELD FREQUENCY (Hz)
100M
Figure 18. Maximum Allowable External Magnetic Flux Density
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.5 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurred during a transmitted pulse
(and was of the worst-case polarity), it would reduce the
received pulse from >1.0 V to 0.75 V, still well above the 0.5 V
sensing threshold of the decoder.
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances from the
ADuM744x transformers. Figure 19 shows these allowable
current magnitudes as a function of frequency for selected
distances. As shown, the ADuM744x is extremely immune and
can be affected only by extremely large currents operated at
high frequency very close to the component. For the 1 MHz
example noted previously, a 1.2 kA current would have to be
placed 5 mm away from the ADuM744x to affect the operation
of the component.
IDDO = (IDDO (D) + (0.5 × 10 ) × CL × VDDO) × (2f − fr) + IDDO (Q)
f > 0.5 fr
where:
IDDI (D), IDDO (D) are the input and output dynamic supply currents
per channel (mA/Mbps).
CL is the output load capacitance (pF).
VDDO is the output supply voltage (V).
f is the input logic signal frequency (MHz); it is half the input
data rate, expressed in units of Mbps.
fr is the input stage refresh rate (Mbps).
IDDI (Q), IDDO (Q) are the specified input and output quiescent
supply currents (mA).
To calculate the total VDD1 and VDD2 supply current, the supply
currents for each input and output channel corresponding to
VDD1 and VDD2 are calculated and totaled. Figure 8 and Figure 9
show per-channel supply currents as a function of data rate for
an unloaded output condition. Figure 10 shows the per-channel
supply current as a function of data rate for a 15 pF output
condition. Figure 11 through Figure 15 show the total VDD1 and
VDD2 supply current as a function of data rate for ADuM7440/
ADuM7441/ADuM7442 channel configurations.
All insulation structures eventually break down when subjected
to voltage stress over a sufficiently long period. The rate of
insulation degradation is dependent on the characteristics of
the voltage waveform applied across the insulation. In addition
to the testing performed by the regulatory agencies, Analog
Devices carries out an extensive set of evaluations to determine
the lifetime of the insulation structure within the ADuM744x.
100
10
1
0.1
DISTANCE = 5mm
DISTANCE = 100mm
1k
10k
10M
100k
1M
MAGNETIC FIELD FREQUENCY (Hz)
100M
08340-010
DISTANCE = 1m
0.01
f ≤ 0.5 fr
−3
INSULATION LIFETIME
1000
MAXIMUM ALLOWABLE CURRENT (kA)
IDDI = IDDI (Q)
For each output channel, the supply current is given by
0.01
08340-009
MAXIMUM ALLOWABLE MAGNETIC FLUX (kgauss)
ADuM7440/ADuM7441/ADuM7442
Figure 19. Maximum Allowable Current for Various
Current-to-ADuM744x Spacings
Note that at combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board traces can
induce error voltages sufficiently large enough to trigger the
thresholds of succeeding circuitry. Care should be taken in the
layout of such traces to avoid this possibility.
Analog Devices performs accelerated life testing using voltage
levels higher than the rated continuous working voltage.
Acceleration factors for several operating conditions are
determined. These factors allow calculation of the time to
failure at the actual working voltage. The values shown in
Table 18 summarize the peak voltage for 50 years of service life
for a bipolar ac operating condition and the maximum CSA
approved working voltages. In many cases, the approved
working voltage is higher than 50-year service life voltage.
Operation at these high working voltages can lead to shortened
insulation life in some cases.
Rev. B | Page 15 of 20
ADuM7440/ADuM7441/ADuM7442
Note that the voltage presented in Figure 21 is shown as sinusoidal
for illustration purposes only. It is meant to represent any voltage
waveform varying between 0 V and some limiting value. The
limiting value can be positive or negative, but the voltage cannot
cross 0 V.
The insulation lifetime of the ADuM744x depends on the
voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates
depending on whether the waveform is bipolar ac, unipolar
ac, or dc. Figure 20, Figure 21, and Figure 22 illustrate these
different isolation voltage waveforms.
Rev. B | Page 16 of 20
Figure 20. Bipolar AC Waveform
RATED PEAK VOLTAGE
08340-012
In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower. This allows operation at higher
working voltages while still achieving a 50-year service life.
The working voltages listed in Table 18 can be applied while
maintaining the 50-year minimum lifetime provided the voltage
conforms to either the unipolar ac or dc voltage case. Any crossinsulation voltage waveform that does not conform to Figure 21
or Figure 22 should be treated as a bipolar ac waveform, and its
peak voltage should be limited to the 50-year lifetime voltage
value listed in Table 18.
0V
0V
Figure 21. Unipolar AC Waveform
RATED PEAK VOLTAGE
08340-013
Bipolar ac voltage is the most stringent environment. The goal
of a 50-year operating lifetime under the ac bipolar condition
determines the Analog Devices recommended maximum
working voltage.
08340-011
RATED PEAK VOLTAGE
0V
Figure 22. DC Waveform
ADuM7440/ADuM7441/ADuM7442
OUTLINE DIMENSIONS
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
9
1
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
8
0.010 (0.25)
0.006 (0.15)
0.069 (1.75)
0.053 (1.35)
0.065 (1.65)
0.049 (1.25)
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
0.025 (0.64)
BSC
SEATING
PLANE
8°
0°
0.012 (0.30)
0.008 (0.20)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
0.041 (1.04)
REF
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
01-28-2008-A
16
Figure 23. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
(Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Number
of Inputs,
Model1
VDD1 Side
ADuM7440ARQZ
4
ADuM7440ARQZ-RL7 4
Number
of Inputs,
VDD2 Side
0
0
Maximum
Data Rate
1 Mbps
1 Mbps
Maximum
Propagation
Delay, 5 V
75 ns
75 ns
Maximum
Pulse Width
Distortion (ns)
25
25
Temperature
Range
−40°C to +105°C
−40°C to +105°C
ADuM7440CRQZ
ADuM7440CRQZ-RL7
4
4
0
0
25 Mbps
25 Mbps
50 ns
50 ns
5
5
−40°C to +105°C
−40°C to +105°C
ADuM7441ARQZ
ADuM7441ARQZ-RL7
3
3
1
1
1 Mbps
1 Mbps
75 ns
75 ns
25
25
−40°C to +105°C
−40°C to +105°C
ADuM7441CRQZ
ADuM7441CRQZ-RL7
3
3
1
1
25 Mbps
25 Mbps
50 ns
50 ns
5
5
−40°C to +105°C
−40°C to +105°C
ADuM7442ARQZ
ADuM7442ARQZ-RL7
2
2
2
2
1 Mbps
1 Mbps
75 ns
75 ns
25
25
−40°C to +105°C
−40°C to +105°C
ADuM7442CRQZ
ADuM7442CRQZ-RL7
2
2
2
2
25 Mbps
25 Mbps
50 ns
50 ns
5
5
−40°C to +105°C
−40°C to +105°C
1
Z = RoHS Compliant Part.
Rev. B | Page 17 of 20
Package Description
16-Lead QSOP
16-Lead QSOP,
7” Tape and Reel
16-Lead QSOP
16-Lead QSOP,
7” Tape and Reel
16-Lead QSOP
16-Lead QSOP,
7” Tape and Reel
16-Lead QSOP
16-Lead QSOP,
7” Tape and Reel
16-Lead QSOP
16-Lead QSOP,
7” Tape and Reel
16-Lead QSOP
16-Lead QSOP,
7” Tape and Reel
Package
Option
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
ADuM7440/ADuM7441/ADuM7442
NOTES
Rev. B | Page 18 of 20
ADuM7440/ADuM7441/ADuM7442
NOTES
Rev. B | Page 19 of 20
ADuM7440/ADuM7441/ADuM7442
NOTES
©2009–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08340-0-2/11(B)
Rev. B | Page 20 of 20
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