TB6549F/P Preliminary Toshiba Bi-CMOS Integrated Circuit Silicon Monolithic TB6549F,TB6549P Full-Bridge Driver IC for DC motor TB6549F/P is a full-bridge driver IC for DC motor which uses LDMOS for output transistors. High efficient drive is possible by MOS process with low ON-resistor and PWM drive system. Four modes such as CW, CCW, short brake, and stop can be chosen by IN1 and IN2. TB6549F Features • Power supply voltage: 30 V (max) • Output current: 3.5 A (max) • Low ON resistor: 0.5 Ω (typ.) • Capable of PWM controlling • Standby system • CW/CCW/short brake/stop function modes. • Built-in overcurrent protection • Built-in thermal shutdown circuit • Package: HSOP-20/DIP-16 TB6549P Pin Assigument Weight HSOP20-P-450-1.00: 0.79 g (typ.) DIP16-P-300-2.54A: 1.11 g (typ.) HSOP20-P-450-1.00 DIP16-P-300-2.54A N.C. VCC CcpA VCC CcpA N.C. CcpB Vreg CcpB Vreg CcpC SB CcpC SB N.C. S-GND (Fin) N.C. S-GND (Fin) N.C. N.C. IN1 PWM IN2 N.C. N.C. OUT1 S-GND S-GND S-GND S-GND IN1 PWM IN2 OUT2 OUT1 P-GND OUT2 P-GND Note: This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. 1 2002-08-30 TB6549F/P Block Diagram SB Vreg OUT2 PWM VCC OUT1 5V Control logic OSC Overcurrent detecting circuit TSD Charge pump circuit CcpA CcpB CcpC IN1 IN2 S-GND P-GND Pin Functions Pin No. Pin Name Functional Description Remarks F P 1 (NC) No Connection 2 1 CcpA Capacitor connection pin for charge pump A Connect a capacitor for charge pump 3 2 CcpB Capacitor connection pin for charge pump B Connect a capacitor for charge pump 4 3 CcpC Capacitor connection pin for charge pump C Connect a capacitor for charge pump 5 (NC) No Connection 6 (NC) No Connection 7 6 IN1 Control signal input 1 Input 0/5-V signal 8 7 IN2 Control signal input 2 Input 0/5-V signal 9 (NC) No Connection 10 8 OUT1 Output pin 1 Connect to motor coil pin 11 9 P-GND Power GND 12 10 OUT2 Output pin 2 Connect to motor coil pin 13 (NC) No Connection 14 11 PWM PWM control signal input pin 15 (NC) No Connection 16 (NC) No Connection 17 14 SB Standby pin H: Start, L: Standby 18 15 Vreg 5 V output pin Connect a capacitor to S-GND 19 (NC) No Connection 20 16 VCC FIN 4, 5, 12, 13 S-GND Input 0/5-V PWM signal VCC (ope) = 10 to 27 V Power supply input pin GND pin 2 2002-08-30 TB6549F/P Maximum Ratings (Ta = 25°C) Characteristics Supply voltage Output current Symbol Rating Unit VCC 30 V IO (Peak) 3.5 (Note 1) A IO (Ave) 2.0 2.5 (Note 2) F Power dissipation PD P W 2.5 (Note 3) Operating temperature Topr −20 to 85 °C Storage temperature Tstg −55 to 150 °C Note 1: The maximum ratings must be observed strictly. Make sure that all the characteristics listed above never exceed the maximum ratings. Note 2: This value is obtained by 115 × 75 × 1.6 mm PCB mounting occupied 30% of copper area. Note 3: This value is obtained by 50 × 50 × 1.6 mm PCB mounting occupied 50% of copper area. Operating Range (Ta = 25°C) Characteristics Symbol Rating Unit Supply voltage VCC 10 to 27 V PWM frequency fCLK 100 kHz 3 2002-08-30 TB6549F/P Electrical Characteristics (VCC = 24 V, Ta = 25°C) Characteristics Symbol Test Circuit Min Typ. Max Stop mode 4 8 CW/CCW mode 6 10 ICC3 Short break mode 4 8 ICC4 (Standby mode) 1 2 2 5.5 0.8 (Not tested) 0.2 VIN = 5 V 50 75 VIN = 0 V 5 2 5.5 0.8 (Not tested) 0.2 VPWM = 5 V 50 75 VPWM = 0 V 5 Duty = 50% 100 kHz 2 µs 2 5.5 0.8 0.2 ICC1 ICC2 Supply current Input voltage VINH 1 Test Condition 2 VINL Control circuit Hysteresis voltage Input current VIN (HYS) IINH 1 IINL Input voltage VPWMH 3 VPWML Hysteresis voltage PWM input circuit Input current VPWM(HYS) IPWMH 3 IPWML PWM frequency Minimum clock pulse width Input voltage fPWM 3 tw(PWM) VINSH 2 VINSL Standby circuit Hysteresis voltage Input current VIN (HYS) IINSH 1 IINSL Output ON resistance Output leakage current Ron (U + L) IL (U) 4 5 IL (L) Diode forward voltage VF (U) 6 VF (L) Internal reference voltage (Not tested) VIN = 5 V 50 75 VIN = 0 V 5 Io = 0.2 A 1.0 1.75 Io = 1.5 A 1.0 1.75 150 10 Io = 1.5 A 1.3 1.7 Io = 1.5 A 1.3 1.7 VCC = 30 V (Note 1) VCC = 30 V Unit mA V µA V µA V µA Ω µA V Vreg 4 No load 4.5 5 5.5 V ISD (OFF) (Not tested) 50 µs Charge pump rising time tONG 7 C1 = 0.22 µF, C2 = 0.01 µF (Note 2) 1 3 ms Thermal shutdown circuit operating temperature TSD (Not tested) 160 °C Overcurrent detection offset time Note 1: Include the current in the circuit. Note 2: C1 is a capacitor between CcpA and GND. C2 is a capacitor between CcpB and CcpC. 4 2002-08-30 TB6549F/P Component Description 1. Control Input/PWM Input Circuit VDD VDD IN1 (IN2, PWM) 100 kΩ • The input signals are shown below. Input at the CMOS and TTL levels can be provided. Note that the input signals have a hysteresis of 0.2 V (typ.). VINH: 2 to Vreg V VINL: GND to 0.8 V • The PWM input frequency should be 100 kHz or less. Input/Output Function Input Output IN1 IN2 SB H H H PWM OUT1 OUT2 Mode L L Short brake H L H CW/CCW L L L Short brake H H L CCW/CW L L L Short brake H L L H H L H H H L L H L H H/L H/L L L • OFF (high impedance) Stop OFF (high impedance) Standby PWM control function Motor speed can be controlled by inputting the 0/5-V PWM signal to the PWM pin. When PWM control is provided, normal operation and short brake operation are repeated. If the upper and lower power transistors in the output circuit were ON at the same time, a penetrating current would be produced. To prevent this current from being produced, a dead time of 300 ns (design target value) is provided in the IC when either of the transistors changes from ON to OFF, or vice versa. Therefore, PWM control by synchronous rectification is enabled without an OFF time being inserted by external input. Note that a dead time is also provided in the IC at the time of transition between CW and CCW or between CW (CCW) and short brake mode, thereby eliminating the need for an OFF time. 5 2002-08-30 TB6549F/P VCC OUT1 VCC OUT1 M VCC OUT1 M GND M GND GND PWM ON → OFF t2 = 300 ns (typ.) PWM ON t1 PWM OFF t3 VCC OUT1 VCC OUT1 M M GND GND PWM OFF → ON t4 = 300 ns (typ.) PWM ON t5 VCC t1 Output Voltage Waveform (OUT1) t5 t3 GND t2 t4 Note: Please set the pin PWM to High when PWM control function is not used. 2. Standby Circuit VDD VDD SB 100 kΩ • All circuits are turned off except the standby circuit and the charge pump circuit under the standby condition. • Input voltage range is shown below. Input at CMOS and TTL level is possible. Input signal has 0.2-V (typ.) hysteresis. VINSH: 2 to Vreg V VINSL: GND to 0.8 V • Please avoid controlling the output by inputting PWM signal to the standby pin. The output signal becomes unstable and it may cause the destruction of the IC. • The charge pump circuit is turned On/Off by the switch of the input signal from the standby pin. If the switching cycle is shorter than 50 ms, the charge pump circuit will not operate with precise timing. Therefore, switching cycle of the standby pin should be longer than 50 ms. • When the Standby condition is changed to the Operation Mode, set IN1 and IN2 to Low level (Stop Mode) at first. Then switch IN1 and IN2 to High level when the charge pump circuit reaches the stable condition, VcpA is about VCC + 5 V. 6 2002-08-30 TB6549F/P 3. Internal Constant-Voltage (5 V) Circuit VCC VCC Vreg • This IC includes a 5-V power supply for control circuit. • A capacitor for prevention of oscillation should be connected to S-GND associated with the pin Vreg. No other loads should be connected to pin Vreg. • This IC has a power monitoring function and turns the output OFF when Vreg goes down to 3.0 V (design target value) or less. With a hysteresis of 0.3 V (design target value), the output are turned ON when Vreg reaches 3.3 V (design target value) again . 4. Charge Pump Circuit VCC CcpA CcpB CcpC • This IC has a charge pump circuit for driving the gate for the upper power transistor in the output circuit. A voltage of VCC + 5 V (typ.) is generated by connecting an external capacitor to this IC. It takes about 2 ms to boost VCPA up VCC + 5 V (typ.) after the switch of the input signal from the standby pin. (while CcpA = 0.22 µF, and CcpB and CcpC are connected through 0.01 µF). • The proper capacitance of the external capacitor varies depending on the VCC value. Thus, determine the constant by referring to the following data. The value of the capacitor between CcpB and CcpC should be such that, while the motor is being driven, the voltage on the CcpA pin will be kept constant, typically at VCC + 5 V. (If a reduced VCC level causes the voltage on CcpA to start to fall, please adjust this capacitance value accordingly.) <External capacitor> • VCC Between CcpB and CcpC Between CcpA and GND 10 V~15 V 0.01 µF~0.047 µF 0.22 µF 15 V~27 V 0.01 µF 0.22 µF Reference oscillation is performed by using the internal capacitor. 7 2002-08-30 TB6549F/P 5. Output Circuit VCC OUT1 (OUT2) P-GND • This IC uses Nch MOS transistors as the upper and lower transistors in the output circuit. • As output Ron is 1 Ω (sum for the upper and lower parts/typ.), this IC is a device of the low Ron type. • The switching characteristics of the output transistors are shown below. PWM Input tpLH Output Voltage (OUT1/OUT2) tpHL 90％ 90％ 50％ 50％ 10％ 10％ tr tf <Typical Value> Item Typical Value tpLH 350 tpHL 800 tr 60 tf 100 Unit ns <Actural Measured Waveform> tpLH (350 ns) tpLH (800 ns) PWM input Output voltage tr (60 ns) tf (100 ns) *: OUT 1, OUT 2; open 8 2002-08-30 TB6549F/P 6. VCC Power Supply Section • The VCC power supply delivers a voltage to the output circuit, charge pump circuit, and internal 5-V circuit. • The operating voltage range is shown below. VCC (opr.) = 10 to 27 V • This IC has a power monitoring function for preventing an output malfunction on power-up. However, Toshiba recommends that IN1, IN2, and SB be set to the Low level at power-on. 7. GND Sections • This IC includes two separate GND sections: S-GND for controlling and P-GND for outputting. Be sure to short- circuit these two GNDs as close to TB6549 as possible. 8. Power Monitoring Circuit • This circuit turns the output OFF when Vreg becomes 3.0 V (design target value) or less. At this time, VCC = 4.6 V (typ.) • With a hysteresis of 0.3 V (design target value), the output turns back ON when Vreg exceeds 3.3 V (design target value) after this circuit starts operating. 9. Thermal Shutdown (TSD) Circuit This IC includes a thermal shutdown circuit which turns the output OFF when the junction temperature (Tj) exceeds 160°C (typ.). The output turns back ON automatically. The thermal hysteresis is 20°C. TSD = 160°C (design target value) ∆TSD = 20°C (design target value) 10. Overcurrent Detection (ISD) Circuit This IC includes a circuit which detects a current flowing through the output power transistors. The current limit is set to 5 A (typ.). The circuit detects a current flowing through each of the four output power transistors. If the current in any one output power transistor exceeds the set limit, this circuit turns all the outputs OFF. This circuit includes a timer which causes the outputs to be OFF for 50 µs (typ.) after detection of an overcurrent and then turn back ON automatically. If the overcurrent continues to flow, this ON-OFF operation is repeated. Note that to prevent a malfunction due to a glitch, an insensitive period of 10 µs (typ.) is provided. ILIM Output Current 0 50 µs (typ.) 50 µs (typ.) 10 µs (typ.) 10 µs (typ.) Insensitive period The set limit is 5 A (typ.) as a design target value. The distributions shown below exist because of the variations in thermal characteristics of different ICs. These distributions should be fully considered in the motor torque design. Also, output peak current should be less than 3 A because of the variations below, Detected current: Approximately from 3.5 to 6.5 A 9 2002-08-30 TB6549F/P Test Circuit 1. Icc1, Icc2, Icc3, Icc4, IINH, IINL, IINSH, IINSL A ICC CcpA CcpB CcpC 5V Vreg 24V VCC PWM OUT1 5V/0V A IIN IN1 5V/0V A IIN IN2 5V/0V A IINS SB • • • • • • • • 2. TB6549F/P OUT2 S-GND P-GND Icc1: IN1 = 0 V, IN2 = 0 V, SB = 5 V Icc2: IN1 = 5 V, IN2 = 5 V, SB = 5 V or IN1 = 0 V, IN2 = 5 V, SB = 5 V Icc3: IN1 = 5 V, IN2 = 5 V, SB = 5 V Icc4: IN1 = 5 V/0 V, IN2 = 5 V/0 V, SB = 0 V IINH: IN1 = 5 V, and IN2 = 5 V IINL: IN2 = 0 V, and IN2 = 0 V IINSH: SB = 5 V IINSL: SB = 0 V VINH, VINL, VINSH, VINSL 24V CcpA CcpB CcpC 5V Vreg VCC PWM OUT1 2V/0.8V IN1 TB6549F/P 0.8V/2V OUT2 IN2 V 2V/0.8V SB S-GND • • • V P-GND VINH, VINSH: IN1 = IN2 = SB = 2 V, Verify that OUT1 = OUT2 = L. VINL: IN1 = 0.8 V, IN2 = SB = 2 V, Verify that OUT1 = L, OUT2 = H. IN1 = SB = 2 V, IN2 = 0.8 V, Verify that OUT1 = OUT2 = L. VINSL: IN1 = IN2 = 2 V, SB = 0.8 V, Verify that output function is high impedance. 10 2002-08-30 TB6549F/P 3. VPWMH, VPWML, IPWMH, IPWML, fPWM, tw (PWM) 24V CcpA CcpB CcpC VCC Vreg 5V/0V 2V/0.8V 100kHz 5V A IPWM PWM OUT1 IN1 TB6549F/P 0V IN2 5V SB OUT2 V S-GND • • • 4. V P-GND VPWMH, VPWML, fPWM: PWM = 2 V/0.8 V, 100 kHz, dury: 50 % (rectangle wave), Verify out1 VPWMH, VPWML: PWM = 5 V or PWM = 0 V. tw(PWM): PWM = 2 V/0.8 V, 100 kHz、dury: 20 % (2 µs) (2 µs/rectangle wave), Verify out1 Ron (H + L), Vreg 24V V → IO V CcpA CcpB CcpC 5V Vreg VCC PWM OUT1 5V/0V IN1 TB6549F/P 0V/5V OUT2 IN2 V 5V SB S-GND • • ↓ IO P-GND Ron (H + L): Measure Vds (Sum of upper and lower side) at IO = 0.2 A, and change it to resistor. Same as at IO = 1.5 A. Vreg: Vreg pin Voltage. 11 2002-08-30 TB6549F/P 5. IL (U), IL (L) 30V A IL(L) CcpA CcpB CcpC 5V PWM 0V IN1 Vreg VCC OUT1 TB6549F/P 0V IN2 5V SB OUT2 A S-GND 6. IL(H) P-GND VF (U), VF (L) 24V V → CcpA CcpB CcpC 5V Vreg VCC IO VF(H) V PWM OUT1 0V IN1 TB6549F/P 0V IN2 5V SB OUT2 S-GND • ↓ IO V VF(L) P-GND VF (U), VF (L): IO = 1.5 A. 12 2002-08-30 TB6549F/P 7. tONG 24V V CcpA CcpB CcpC 5V VCC Vreg PWM OUT1 0V IN1 TB6549F/P 0V IN2 0V → 5V SB OUT2 S-GND • P-GND tONG: SB = 0 V → 5 V. Measure the time to boost CcpA voltage up about 29 V (24 V + 5 V) 13 2002-08-30 TB6549F/P PD – Ta (TB6549P) PD – Ta (TB6549F) (1) When mounted on PCB (50 × 50 × 1.6mm glass-epoxy PCB mounting occupied 50% of copper area.) (2) IC only 2.4 Maximum power dissipation PD MAX Power dissipation PD (W) (1) (W) 3.0 1.8 (2) 1.2 0.6 0 0 40 80 120 160 200 240 Thermal resistance Rth (j-c) = 13°C/W Rth (j-a) = 130°C/W 6 Note: 50 × 50 × 1 mm3 Fe heat sink 4 Infinite heat sink (Note) 2 No heat sink 0 0 50 100 150 200 Ambient temperature Ta (°C) Ambient temperature Ta (°C) External Attachments Symbol Use Recommended Value Remarks 0.22 µF C1 Charge pump C2 Charge pump C3 Prevention of Vreg oscillation 0.1 µF to 1.0 µF C4 Absorption of power noise 0.001 µF to 1 µF C5 Absorption of power noise 50 µF to 100 µF 0.01 µF VCC = 24 V (Note) 0.033 µF VCC = 12 V (Note) Note: The recommended values for charge pumps depend on the VCC value. Please refer to the Component Description 4, Charge Pump Circuit. 14 2002-08-30 TB6549F/P Typical Application Diagram C3 C1 5V 2/1 VDD 3/2 CcpA CcpB CcpC 14/11 PORT1 7/6 IN1 PORT2 8/7 IN2 PORT3 17/14 SB C5 C4 24V 18/15 20/16 4/3 Vreg VCC PWM PWM Note 1 Note 4 C2 OUT1 10/8 TB6549F/P M OUT2 12/10 Note 2 S-GND GND P-GND FIN/4,5,12,13 Note 5 Microcontroller 11/9 TB6549F/TB6549P Note 3 TB6549F: Pins 1, 5, 6, 9, 13, 15, 16, and 19 are not connected. Note 1: Connect VCC and P-GND through the power supply capacitor. This capacitor should be as close as possible to the IC. Note 2: When connecting the motor pins through the capacitor for reducing noise, connect a resistor to the capacitor for limiting the charge current. The switching loss increases for PWM control. Therefore, whenever practicable, avoid connecting the capacitor if PWM control is required. Note 3: Short-circuit S-GND and P-GND as close to TB6549 as possible. Note 4: Connect the capacitor C3 to S-GND. Note 5: Connect the capacitors C1 and C2 as close to TB6549 as possible, and the capacitor C1 as close to S-GND. Note 6: Pins 4, 5, 12, and 13 of the P type are connected to the chip’s bed. Therefore, expanding their round area produces a better heat radiation effect. Usage Precautions • This IC includes an overcurrent detection circuit. However, if a short circuit takes place between output pins or if an output pin is connected to the voltage source or ground, a heavy current temporarily flows through the IC. It might destroy the IC. This possibility should be fully considered in the design of the output line, VCC line, and GND line. If the IC is destroyed, a heavy current might continuously flow through it as a secondary effect. Therefore, Toshiba recommends that a fuse be connected to the power supply line. • Install this IC properly. If not, (e.g., installing it in the wrong position), the IC might be destroyed. 15 2002-08-30 TB6549F/P Package Dimensions Weight: 0.79 g (typ.) 16 2002-08-30 TB6549F/P Package Dimensions Weight: 1.11 g (typ.) 17 2002-08-30 TB6549F/P RESTRICTIONS ON PRODUCT USE 000707EBA • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • The products described in this document are subject to the foreign exchange and foreign trade laws. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. • The information contained herein is subject to change without notice. 18 2002-08-30