CMF02 TOSHIBA Fast Recovery Diode Silicon Diffused Type CMF02 Switching Mode Power Supply Applications DC/DC Converter Applications Unit: mm • • • • Repetitive peak reverse voltage: VRRM = 600 V Average forward current: IF (AV) = 1.0 A Forward voltage: VFM = 2.0 V (max) Very fast reverse-recovery time: trr = 100 ns (max.) • Suitable for compact assembly due to small surface-mount package “M−FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Repetitive peak reverse voltage VRRM 600 V Average forward current IF (AV) 1.0 (Note 1) A IFSM 10 (50 Hz) (Note 3) A Tj −40~150 °C Tstg −40~150 °C Peak one-cycle surge forward current (non-repetitive) Junction temperature Storage temperature range Note 1: Tℓ = 108°C Rectangular waveform (α = 180°) JEDEC ⎯ JEITA ⎯ TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 3: This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180°. Therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device. 1 2007-04-16 CMF02 Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Peak forward voltage VFM IFM = 1.0 A (pulse test) ⎯ ⎯ 2.0 V Repetitive peak reverse current IRRM VRRM = 600 V (pulse test) ⎯ ⎯ 50 μA Reverse recovery time trr IF = 1 A, di/dt ＝-30 A/μs ⎯ ⎯ 100 ns Forward recovery time tfr IF = 1 A ⎯ 270 ⎯ ns Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.64 t) ⎯ ⎯ 60 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 6 mm × 6 mm) (board thickness: 1.6 t) ⎯ ⎯ 135 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ ⎯ 210 ⎯ ⎯ 16 Thermal resistance Rth (j-a) Thermal resistance (junction to lead) ⎯ Rth (j-ℓ) Marking °C/W °C/W Standard Soldering Pad Part No. F2 CMF02 Unit: mm 2.1 Abbreviation Code 1.4 3.0 1.4 Handling Precautions Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information. 2 2007-04-16 CMF02 iF – vF PF (AV) – IF (AV) 3.0 Pulse test Average forward power dissipation PF (AV) (W) Instantaneous forward current iF (A) 10 Tj = 150°C 1 75°C 25°C 0.1 180° 120° 2.0 α = 60° Rectangular waveform 1.0 0° α 360° Conduction angle α 0.01 0 1.0 2.0 3.0 4.0 Instantaneous forward voltage VF 0 0 5.0 0.2 0.4 0.6 Average forward current (V) 0.8 1.0 IF (AV) (A) 1.2 Ta max – IF (AV) 140 120 100 80 Rectangular waveform 60 120° 40 0° α 360° 20 0 0 α = 60° 0.4 0.2 Conduction angle: α 180° 0.6 Average forward current 0.8 1.0 IF (AV) (A) Tℓ max – IF (AV) 160 Maximum allowable lead temperature Tℓ max (°C) Maximum allowable ambient temperature Ta max (°C) 160 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 6 mm × 6 mm) 140 120 100 80 40 0° α 360° 20 0 1.2 Rectangular waveform 60 α = 60° Conduction angle: α 0 0.2 0.4 0.6 Average forward current 120° 180° 0.8 1.0 IF (AV) (A) 1.2 Surge forward current rth (j-a) – t (non-repetitive) 1000 Ta = 25°C f = 50 Hz 10 Transient thermal impedance rth (j-a) (°C/W) Peak surge forward current IFSM (A) 12 8 6 4 2 0 1 3 5 10 30 50 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 2.1 mm × 1.4 mm, board thickness: 1.6 t) 100 10 Device mounted on a ceramic board (board size: 50 mm × 50 mm, land size: 2 mm × 2 mm, board thickness: 0.64 t) 1 0.001 100 Number of cycles Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size: 6 mm × 6 mm, board thickness: 1.6 t) 0.01 0.1 1 10 100 1000 Time t (s) 3 2007-04-16 CMF02 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 2007-04-16