MATERIAL DECLARATION SHEET Material Number CR1206 Product Line Chip Resistor Compliance Date 2010/08/16 RoHS Compliant YES No. 1 2 3 MSL 1 Construction Element(subpart) Homogeneous Material Material weight [g] Ceramic Substrate Ceramic 0.00859 Conductor Layer Resistive Element Conductor glass Resistor glass 0.000147 0.000095 Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth trioxide Subpart mass of total wt. (%) 1304-76-3 96% 4% 96% 1% Material Mass % of total unit wt. 87.04% 3.63% 1.62% 0.0225% 1344-28-1 14808-60-7 Barium oxide 1304-28-5 1% 0.0225% 2.31% Silicon dioxide 7631-86-9 1% 0.0225% Boron oxide Ruthenium dioxide Silver Palladium Lead oxide glass Epoxy Epoxy Nickel Chromium III 1303-86-2 1% 0.0225% 12036-10-1 25% 0.28% 7440-22-4 7440-05-3 40% 15% 0.44% 0.17% 1317-36-8 20% 0.22% 29690-82-2 25068-38-6 7440-02-0 7440-47-3 100% 100% 80% 20% 1.32% 0.15% 0.06% 0.02% 1.57% 0.16% 4.54% CASRN if applicable 7440-22-4 Materials Mass % 4 5 Over Coating Marking Epoxy Epoxy 0.00011 0.000013 6 End Terminal NI-CR 0.000007 7 Ni Plating Nickel 0.000232 Nickel 7440-02-0 100% 2.70% 8 Sn Plating Tin 0.00019 Tin 7440-31-5 100% 2.26% Total weight Headquarters Riverside CA 85.93% 1.32% 0.13% 4.04% 0.009384 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 05.18.2010 Important remarks: 1. 2. It is the responsibility of the user to verify they are accessing the latest version. RoHS exemption 5 – lead in glass of ... electronic components... Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2