Littelfuse E128662 Gas discharge tube (gdt) products cg/cg2 sery Datasheet

Gas Discharge Tube (GDT) Products
CG/CG2 Series
CG/CG2 Series
®
Description
Littelfuse highly reliable CG/CG2 Series GDTs provide
a high degree of surge protection in a small size ideal
for board level circuit protection.
GDTs function as switches which dissipate a
minimum amount of energy and therefore handle
currents that far surpass other types of transient
voltage protection. Their gas-filled, rugged ceramic
metal construction make them well suited to adverse
environments.
The CG/CG2 series comes in a variety of forms
including surface mount, core, straight and shaped
leads, to serve a variety of mounting methods.
Agency Approvals
AGENCY
The CG Series (75-110V) is ideal for protection of test
and communication equipment and other devices
in which low voltage limits and extremely low arc
voltages are required.
AGENCY FILE NUMBER
®
E128662
®
E320116
The CG2 Series (145V-1000V) is ideal for protecting
equipment where higher voltage limits and holdover
voltages are necessary.
2 Electrode GDT Graphical Symbol
Features
• Rugged Ceramic-Metal
construction
• Low Capacitance
(<1.5pf)
• Meets REA PE-80
• Available in surface
mount, and a variety of
lead options options
Applications
• Communication lines
and equipment
• CATV equipment
• Test equipment
• Data lines
• Power supplies
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
27
Revised: November 10, 2009
•
•
•
•
Instrumentation circuits
Medical electronics
ADSL equipment
Telecom SLIC
protection
CG/CG2 Series
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Electrical Characteristics
Device Specifications (at 25°C)
DC Breakdown
in Volts
(@100V/s)
Part
Number
MIN
TYP MAX
Impulse
Breakdown
in Volts
Impulse
Breakdown In
Volts
(@100V/μs)
(@1 Kv/μsec)
MAX
(@1MHz)
MIN
Life Ratings
Insulation CapaciArc
Resistance tance Voltage
MAX
(on state
Voltage)
@1Amp
Min
Surge
Life
(@500A
10/1000μs)
Nominal Nominal
AC
DC
Max
Impulse
AC
Dischage Holdover Impulse
Discharge Discharge Current Voltage2 Discharge
(9 cycle
Current
Current
Current
(8/20μs)
(10x1sec
@50-60Hz)
@50Hz)
TYP
(1 Application
@ 10/350μs)
TYP
NOTES:
1. Tested to UL1449 Third Edition
2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec.
3. Leaded devices = 5x[5(+) or 5 (-)] applications 20kA 8/20μSec. (75 to 600 volt devices.)
MS and Core devices = 10x[5(+) and 5(-)] applications 10kA 8/20μS (800 to 1000 volt devices.)
Product Characteristics
Materials
Product Marking
CG/CG2 Series
LS, Axial:
Device: Nickel Plated 2–5 Microns
Lead Wires: Tin Plated 17.5 ± 12.5 Microns
Construction: Ceramic Insulator
Core:
Device: Tin Plated 17.5 ± 12.5 Microns.
Construction: Ceramic Insulator
MS:
Device: Dull Tin Plated 7–9 Microns
Construction: Ceramic Insulator
Glow to arc
transition current
< 0.5Amps
Glow Voltage
60-160 Volts
Storage and
Operational
Temperature
-40 to +90
Maximum Follow
On Current1
230 Volts r.m.s, 200 Amps.
(800V and 1000V devices tested to UL1449 3rd edition)
LF Logo, Voltage and date code; Black in
positive print
28
Revised: November 10, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Device Dimensions
Leaded 'L' Type Straight Axial Devices
PROFILE VIEW
Leaded 'LS' Type Shaped Lead Devices
TOP VIEW
PROFILE VIEW
TOP VIEW
6.07 ± 0.3
[0.239 ± 0.012]
8.10 Max.
[0.319 DIA Max.]
0.81DIA. TYP.
[0.032]
8.10DIA. MAX.
[0.319]
8.40 ± 0.3
[0.331 ± 0.012]
6.07 ± 0.15
[0.239 ± 0.006]
0.004
62 ± 2
8.4 ± 0.3
[0.331 ± 0.012]
0.40 ± 0.03
[0.0157 ± 0.0012]
2 Surfaces
9.85 ± 0.30
[0.388 ± 0.012]
0.80
[0.032]
11.15 ± 0.30
[0.439 ± 0.012]
SOLDER PAD LAYOUT
Core Devices
9.85
[0.388]
TOP VIEW
PROFILE VIEW
8.10 Max.
[0.032 Max.]
8.60
[0.339]
SEMI–PROFILE VIEW
6.07 ± 0.15
[0.239 ± 0.0059]
1.80
[0.071]
5.89 [0.232]
8.10 Max.
11.65
[0.459]
'MS' Type Devices
0.47 ± 0.1
[0.019 ± 0.0039]
TOP VIEW
PROFILE VIEW
8.30 ± 0.1
[0.327 ± 0.0039]
4 ± 0.2
[0.157 ± 0.0079]
SEMI–PROFILE VIEW
5.58 [0.220]
6.05 ± 0.2
[0.238 ± 0.0079]
ø8.30±0.1
R5.29 [R0.208]
2 9]
0. 7
± .00
30 0
9. 6 ±
6
.3
[0
0.47 ± 0.1
[0.019 ± 0.0039]
SOLDER PAD LAYOUT
2.29 [0.090]
8.71 [0.343]
5.89 [0.232]
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
29
Revised: November 10, 2009
CG/CG2 Series
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Pre Heat
Pb – Free assembly
Critical Zone
TL to TP
Ramp-up
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (Min to Max) (ts)
60 – 180 secs
TL
TS(max)
Average ramp up rate (Liquidus Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
5°C/second max
Reflow
tP
TP
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Temperature
Reflow Condition
tL
Ramp-down
Preheat
TS(min)
tS
25
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
10 – 30 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
time to peak temperature
(t 25ºC to peak)
Time
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Recommended Process Parameters:
280
Wave Parameter
260
240
Lead-Free Recommendation
Preheat:
220
(Depends on Flux Activation Temperature)
200
180
160
140
(Typical Industry Recommendation)
Temperature Minimum:
100° C
Temperature Maximum:
Preheat Time:
150° C
60-180 seconds
120
100
Solder Pot Temperature:
280° C Maximum
Solder Dwell Time:
2-5 seconds
80
60
40
240
230
220
210
200
190
180
170
160
150
140
130
120
110
90
100
80
70
60
50
40
20
0
0
30
20
10
Temperature (°C) - Measured on bottom side of board
300
Time (Seconds)
Cooling Time
Preheat Time
Dwell Time
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
CG/CG2 Series
30
Revised: November 10, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Packaging Dimensions
For 'L' Type Axial Lead Items
<1.2 Max. Lead Bend
254.0 - 356.0
[10.0 - 14.0]
<0.8 Max
Direction of Feed
0.0
15]
52.4
[2.063]
22.8
[0.898]
6.4
[0.252]
5.0 Pitch
[0.197]
Core and 'MS' Type Items
275.0
[10.83]
10x4 ± 0.1 = 40 ± 0.2
[10 x 0.157 ± 0.004 = 1.575 ± 0.008]
1.75 ± 0.1
[0.069 ± 0.004]
0.4 ± 0.05
[0.016 ± 0.002]
100.0
[3.94]
4 ± 0.1
[0.157 ± 0.004]
1.5 DIA. MAX.
[0.059]
76.0
[2.99]
25.0
[0.98]
7.5 ± 0.1
[0.295 ± 0.004]
8.5 ± 0.1
[0.335 ± 0.004]
17.7
[0.697]
16 +0.3 / -0.1
[0.630 +0.012 / -0.004]
Direction of Feed
1.5 DIA. MAX.
[0.059]
8.6 ± 0.1
[0.339 ± 0.004]
12 ± 0.1
[0.472 ± 0.004]
For 'LS' Type Shaped Lead Items
275.0
[10.82]
10x4 ± 0.1 = 40 ± 0.2
[10x.157 ± 0.004 = 1.575 ± 0.008]
1.75 ± 0.1
[0.069 ± 0.004]
0.5 ± 0.05
[0.020 ± 0.002]
1.9
[0.075]
11.75 ± 0.1
[0.463 ± 0.004]
1.5 DIA. MAX.
[0.059]
100.0
[3.93]
4 ± 0.1
[0.157 ± 0.004]
76.0
[2.99]
25.0
[0.98]
11.5 ± 0.1
[0.453 ± 0.004]
8 ± 0.1
[0.315 ± 0.004]
24 +0.3 / -0.1
[0.945 +0.019 / -0.004]
25.7
[1.01]
Direction of Feed
0.5 ± 0.01
[0.020 ± 0.004]
9 ± 0.1
[0.354 ± 0.004]
1.5 DIA. MAX.
[0.059]
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
16 ± 0.1
[0.630 ± 0.004]
31
Revised: November 10, 2009
CG/CG2 Series
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Part Numbering System and Ordering Information
CG2 XXX XX * XX
Series
CG -- for 75, 90, or 110V
CG2 -- for 145V to 1000V
Breakdown Voltage
75
90
110
145
230
250
300
350
470
600
800
1000
Lead Option Code
Examples:
CG75 -- A non-leaded 75V device
CG2230L -- A leaded 230V device
CG2800LTR -- A leaded 800V device, tape-and-reel
(per EIA standard RS-296-D)
Notes:
CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request.
(Blank) = No Leads / Core
L = Straight Leads
LS = Shaped Leads
MS = Surface Mount
Option Code*
SN = denotes different DC Breakover
Voltage Limit. Please refer to Electrical
Characteristics table for additional
information.
Packaging Option Code
(Blank) = No Leads / Core, Bulk Bag - 400 pcs
L(Blank) = Straight Lead, Tray - 50 pcs
LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel
LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel
LSTR = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel
CG/CG2 Series
32
Revised: November 10, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
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