Type BSC100N06LS3 G OptiMOSTM3 Power-Transistor Product Summary Features • Ideal for high frequency switching and sync. rec. • Optimized technology for DC/DC converters • Excellent gate charge x R DS(on) product (FOM) V DS 60 V R DS(on),max 10 mΩ ID 50 A • Superior thermal resistance • N-channel, logic level • 100% avalanche tested • Pb-free plating; RoHS compliant • Qualified according to JEDEC1) for target applications • Halogen-free according to IEC61249-2-21 Type BSC100N06LS3 G Package PG-TDSON-8 Marking 100N06LS Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value V GS=10 V, T C=25 °C 50 V GS=10 V, T C=100 °C 36 V GS=4.5 V, T C=25 °C 41 V GS=4.5 V, T C=100 °C 26 V GS=10 V, T A=25 °C, R thJA=50 K/W 2) Unit A 12 Pulsed drain current3) I D,pulse T C=25 °C 200 Avalanche energy, single pulse4) E AS I D=50 A, R GS=25 Ω 22 mJ Gate source voltage V GS ±20 V 1) J-STD20 and JESD22 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 for more detailed information 4) See figure 13 for more detailed information 2) Rev. 2.2 page 1 2010-08-31 BSC100N06LS3 G Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Power dissipation P tot Value T C=25 °C 50 T A=25 °C, T j, T stg -55 ... 150 IEC climatic category; DIN IEC 68-1 Parameter W 2.5 R thJA=50 K/W 2) Operating and storage temperature Unit °C 55/150/56 Values Symbol Conditions Unit min. typ. max. - - 2.5 minimal footprint - - 62 6 cm2 cooling area2) - - 50 60 - - Thermal characteristics Thermal resistance, junction - case R thJC Device on PCB R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA Gate threshold voltage V GS(th) V DS=V GS, I D=23 µA 1.2 1.7 2.2 Zero gate voltage drain current I DSS V DS=60 V, V GS=0 V, T j=25 °C - 0.1 1 V DS=60 V, V GS=0 V, T j=125 °C - 10 100 V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=25 A - 11.8 17.9 mΩ V GS=10 V, I D=50 A - 7.8 10 - 1.3 - Ω 32 63 - S Gate resistance RG Transconductance g fs Rev. 2.2 |V DS|>2|I D|R DS(on)max, I D=50 A page 2 2010-08-31 BSC100N06LS3 G Parameter Values Symbol Conditions Unit min. typ. max. - 2600 3500 - 500 660 Dynamic characteristics Input capacitance C iss V GS=0 V, V DS=30 V, f =1 MHz pF Output capacitance C oss Reverse transfer capacitance Crss - 24 - Turn-on delay time t d(on) - 8 - Rise time tr - 58 - Turn-off delay time t d(off) - 19 - Fall time tf - 8 - Gate to source charge Q gs - 10 - Gate charge at threshold Q g(th) - 4 - Gate to drain charge Q gd - 3 - Switching charge Q sw - 9 - Gate charge total Qg - 15 20 Gate plateau voltage V plateau - 4.0 - Gate charge total Qg V DD=30 V, I D=50 A, V GS=0 to 10 V - 34 45 Output charge Q oss V DD=30 V, V GS=0 V - 25 33 - - 50 - - 200 - 0.9 1.2 V - 35 - ns - 36 - nC V DD=30 V, V GS=10 V, I D=50 A, R G=3 Ω ns Gate Charge Characteristics 5) V DD=30 V, I D=50 A, V GS=0 to 4.5 V nC V nC Reverse Diode Diode continuous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD Reverse recovery time t rr Reverse recovery charge Q rr 5) Rev. 2.2 T C=25 °C V GS=0 V, I F=50 A, T j=25 °C V R=30 V, I F=50A, di F/dt =100 A/µs A See figure 16 for gate charge parameter definition page 3 2010-08-31 BSC100N06LS3 G 2 Drain current P tot=f(T C) I D=f(T C); V GS≥10 V 60 60 50 50 40 40 I D [A] P tot [W] 1 Power dissipation 30 30 20 20 10 10 0 0 0 50 100 150 200 0 50 100 T C [°C] 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T C=25 °C; D =0 Z thJC=f(t p) parameter: t p parameter: D =t p/T 103 101 limited by on-state resistance 1 µs 102 10 µs 100 0.5 10 1 Z thJC [K/W] I D [A] 100 µs 1 ms 10 ms 0.2 0.1 0.05 DC 10-1 100 0.02 0.01 single pulse 10-1 10 10-2 -1 10 0 10 1 10 2 10-5 10-4 10-3 10-2 10-1 100 t p [s] V DS [V] Rev. 2.2 10-6 page 4 2010-08-31 BSC100N06LS3 G 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 24 200 3.2 V 3.5 V 180 5V 20 160 5V 140 16 100 R DS(on) [mΩ] 120 I D [A] 4.5 V 4V 10 V 4.5 V 80 12 6V 8 60 10 V 4V 40 4 3.5 V 20 3.2 V 3V 2.8 V 0 0 1 2 0 3 0 40 80 V DS [V] 120 160 200 I D [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 100 120 100 80 80 I D [A] g fs [S] 60 60 40 40 20 20 150 °C 25 °C 0 0 0 1 2 3 4 5 Rev. 2.2 0 40 80 120 160 I D [A] V GS [V] page 5 2010-08-31 BSC100N06LS3 G 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=50 A; V GS=10 V V GS(th)=f(T j); V GS=V DS; I D=100 µA 20 2.5 18 16 2 230 µA 12 max 10 8 1.5 V GS(th) [V] R DS(on) [mΩ] 14 23 µA 1 typ 6 4 0.5 2 0 0 -60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j 104 1000 Ciss 103 Coss 150 °C, max I F [A] C [pF] 100 102 25 °C Crss 150 °C 10 101 25 °C, max 1 0 20 40 60 Rev. 2.2 0.0 0.5 1.0 1.5 2.0 V SD [V] V DS [V] page 6 2010-08-31 BSC100N06LS3 G 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 Ω V GS=f(Q gate); I D=50 A pulsed parameter: T j(start) parameter: V DD 100 12 30 V 10 48 V 12 V 125 °C 10 V GS [V] I AV [A] 8 25 °C 100 °C 6 4 2 1 0 0.1 1 10 100 1000 0 10 20 30 40 Q gate [nC] t AV [µs] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=1 mA 70 V GS Qg V BR(DSS) [V] 60 V g s(th) 50 Q g(th) Q sw Q gs 40 -60 -20 20 60 100 140 Q g ate Q gd 180 T j [°C] Rev. 2.2 page 7 2010-08-31 BSC100N06LS3 G Package Outline Rev. 2.2 PG-TDSON-8 page 8 2010-08-31 BSC100N06LS3 G Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. 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Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.2 page 9 2010-08-31