TI1 BQ4285S-SB2 Real-time clock (rtc) with nvram control Datasheet

bq4285
Real-Time Clock (RTC) With NVRAM Control
Features
➤ Direct clock/calendar replacement for IBM ® AT-compatible
computers and other applications
➤ Functionally compatible with the
DS1285
-
Closely matches MC146818A
pin configuration
➤ Calendar in day of the week, day of
the month, months, and years, with
automatic leap-year adjustment
➤ Time of day in seconds, minutes,
and hours
-
12- or 24-hour format
Optional daylight saving
adjustment
➤ 114 bytes of general nonvolatile
storage
➤ BCD or binary format for clock
and calendar data
➤ Automatic backup and writeprotect control to external SRAM
➤ Programmable square wave output
➤ 160 ns cycle time allows fast bus
operation
➤ Three individually maskable interrupt event flags:
➤ Less than 0.5 µA load under battery operation
➤ 14 bytes for clock/calendar and
control
-
Periodic rates from 122 µs to
500 ms
-
Time-of-day alarm once per
second to once per day
-
End-of-clock update cycle
➤ 24-pin plastic DIP or SOIC
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
The CMOS bq4285 is a low-power
microprocessor peripheral providing
a time-of-day clock and 100-year calendar with alarm features and battery operation. Other features include
three maskable interrupt sources,
square wave output, and 114 bytes of
general nonvolatile storage.
The bq4285 write-protects the clock,
calendar, and storage registers during power failure. A backup battery
then maintains data and operates
the clock and calendar.
The bq4285 is a fully compatible realtime clock for IBM AT-compatible computers and other applications. The only
external components are a 32.768kHz
crystal and a backup battery.
The bq4285 integrates a batterybackup controller to make a standard
CMOS SRAM nonvolatile during
power-fail conditions. During powerfail, the bq4285 automatically writeprotects the external SRAM and provides a VCC output sourced from the
clock backup battery.
Pin Names
Pin Connections
VOUT
X1
X2
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
VSS
General Description
VCC
SQW
CEOUT
CEIN
BC
INT
RST
DS
VSS
R/W
AS
CS
24-Pin DIP or SOIC
28-Pin PLCC No longer available
PN428501.eps
SLUS002A JUNE 1991 - REVISED MAY 2004
1
AD0–AD7
Multiplexed address/data
input/output
MOT
Bus type select input
CS
AS
DS
R/W
INT
RST
SQW
BC
X1–X2
NC
CEIN
CEOUT
VOUT
VCC
VSS
Chip select input
Address strobe input
Data strobe input
Read/write input
Interrupt request output
Reset input
Square wave output
3V backup cell input
Crystal inputs
No connect
RAM chip enable input
RAM chip enable output
Supply output
+5V supply
Ground
bq4285
Block Diagram
CS
Pin Descriptions
AD0–AD7
Chip select input
CS should be driven low and held stable
during the data-transfer phase of a bus cycle accessing the bq4285.
Multiplexed address/data input/
output
The bq4285 bus cycle consists of two
phases: the address phase and the datatransfer phase. The address phase precedes the data-transfer phase. During the
address phase, an address placed on
AD0–AD7 is latched into the bq4285 on the
falling edge of the AS signal. During the
data-transfer phase of the bus cycle, the
AD0–AD7 pins serve as a bidirectional data
bus.
MOT
Table 1. Bus Setup
Connect to VSS for correct operation
Bus
Type
Intel
2
MOT
DS
R/W
AS
Level Equivalent Equivalent Equivalent
VSS
RD,
MEMR,
or I/OR
WR,
MEMW,
or I/OW
ALE
bq4285
AS
Reset may be disabled by connecting RST
to VCC. This allows the control bits to retain
their
states
through
powerdown/power-up cycles.
Address strobe input
AS serves to demultiplex the address/data
bus. The falling edge of AS latches the address on AD0–AD7. This demultiplexing
process is independent of the CS signal.
DS
SQW
SQW may output a programmable frequency square-wave signal during normal
(VCC valid) system operation. Any one of
the 13 specific frequencies may be selected
through register A. This pin is held low
when the square-wave enable bit (SQWE)
in register B is 0 (see the Control/Status
Registers section).
Data strobe input
With MOT = VSS, the DS input is provided a signal similar to RD, MEMR, or I/OR in an
BC
Intel-based system. The falling edge on DS
is used to enable the outputs during a read
cycle.
R/W
3V backup cell input
BC should be connected to a 3V backup cell
for RTC operation and storage register nonvolatility in the absence of power. When
VCC slews down past VBC (3V typical), the
integral control circuitry switches the
power source to BC. When VCC returns
above VBC, the power source is switched to
VCC.
Upon power-up, a voltage within the VBC
range must be present on the BC pin for
the oscillator to start up.
Read/write input
With MOT = VSS, R/W is provided a signal similar to WR, MEMW, or I/OW in an Intelbased system. The rising edge on R/W
latches data into the bq4285.
X1–X2
CEIN
INT
Crystal inputs
The X1–X2 inputs are provided for an external 32.768Khz quartz crystal, Daiwa
DT-26 or equivalent, with 6pF load capacitance. A trimming capacitor may be necessary for extremely precise time-base generation.
External RAM chip enable input,
active low
Interrupt request output
CEIN should be driven low to enable the
controlled external RAM. CEIN is internally
pulled up with a 50KΩ resistor.
INT is an open-drain output. INT is asserted low when any event flag is set and
the corresponding event enable bit is also
set.
INT becomes high-impedance
whenever register C is read (see the Control/Status Registers section).
RST
Square-wave output
CEOUT
External RAM chip enable output,
active low
When power is valid, CEOUT reflects CEIN.
Reset input
VOUT
The bq4285 is reset when RST is pulled
low.
When reset, INT becomes highimpedance, and the bq4285 is not accessible. Table 4 in the Control/Status Registers
section lists the register bits that are
cleared by a reset.
Supply output
VOUT provides the higher of VCC or VBC,
switched internally, to supply external RAM.
3
VCC
+5V supply
VSS
Ground
bq4285
Functional Description
date period (see Figure 2). The alarm flag bit may also
be set during the update cycle.
Address Map
The bq4285 copies the local register updates into the
user buffer accessed by the host processor. When a 1 is
written to the update transfer inhibit bit (UTI) in register B, the user copy of the clock and calendar bytes remains unchanged, while the local copy of the same bytes
continues to be updated every second.
The bq4285 provides 14 bytes of clock and control/status
registers and 114 bytes of general nonvolatile storage.
Figure 1 illustrates the address map for the bq4285.
Update Period
The update-in-progress bit (UIP) in register A is set
tBUC time before the beginning of an update cycle (see
Figure 2). This bit is cleared and the update-complete
flag (UF) is set at the end of the update cycle.
The update period for the bq4285 is one second. The
bq4285 updates the contents of the clock and calendar
locations during the update cycle at the end of each up-
Figure 1. Address Map
Figure 2. Update Period Timing and UIP
4
bq4285
c.
Programming the RTC
Write the appropriate value to the hour
format (HF) bit.
The time-of-day, alarm, and calendar bytes can be written in either the BCD or binary format (see Table 2).
2.
Write new values to all the time, alarm, and
calendar locations.
These steps may be followed to program the time, alarm,
and calendar:
3.
Clear the UTI bit to allow update transfers.
1.
On the next update cycle, the RTC updates all 10 bytes
in the selected format.
Modify the contents of register B:
a.
Write a 1 to the UTI bit to prevent transfers between RTC bytes and user buffer.
b.
Write the appropriate value to the data
format (DF) bit to select BCD or binary
format for all time, alarm, and calendar
bytes.
Table 2. Time, Alarm, and Calendar Formats
Range
Address
RTC Bytes
Decimal
Binary
Binary-Coded
Decimal
0
Seconds
0–59
00H–3BH
00H–59H
1
Seconds alarm
0–59
00H–3BH
00H–59H
2
Minutes
0–59
00H–3BH
00H–59H
3
Minutes alarm
0–59
00H–3BH
00H–59H
4
Hours, 12-hour format
1–12
01H–OCH AM;
81H–8CH PM
01H–12H AM;
81H–92H PM
Hours, 24-hour format
0–23
00H–17H
00H–23H
Hours alarm, 12-hour format
1–12
01H–OCH AM;
81H–8CH PM
01H–12H AM;
81H–92H PM
Hours alarm, 24-hour format
0–23
00H–17H
00H–23H
6
Day of week (1=Sunday)
1–7
01H–07H
01H–07H
7
Day of month
1–31
01H–1FH
01H–31H
8
Month
1–12
01H–0CH
01H–12H
9
Year
0–99
00H–63H
00H–99H
5
5
bq4285
The update-ended interrupt, which occurs at the end
of each update cycle
Square-Wave Output
■
The bq4285 divides the 32.768kHz oscillator frequency
to produce the 1 Hz update frequency for the clock and
calendar. Thirteen taps from the frequency divider are
fed to a 16:1 multiplexer circuit. The output of this mux
is fed to the SQW output and periodic interrupt generation circuitry. The four least-significant bits of register
A, RS0–RS3, select among the 13 taps (see Table 3). The
square-wave output is enabled by writing a 1 to the
square-wave enable bit (SQWE) in register B.
Each of the three interrupt events is enabled by an individual interrupt-enable bit in register B. When an event
occurs, its event flag bit in register C is set. If the corresponding event enable bit is also set, then an interrupt
request is generated. The interrupt request flag bit
(INTF) of register C is set with every interrupt request.
Reading register C clears all flag bits, including INTF,
and makes INT high-impedance.
Interrupts
Two methods can be used to process bq4285 interrupt
events:
The bq4285 allows three individually selected interrupt
events to generate an interrupt request. These three interrupt events are:
■
Enable interrupt events and use the interrupt
request output to invoke an interrupt service routine.
■
The periodic interrupt, programmable to occur once
every 122 µs to 500 ms
■
■
The alarm interrupt, programmable to occur once per
second to once per day
Do not enable the interrupts and use a polling
routine to periodically check the status of the flag
bits.
The individual interrupt sources are described in detail
in the following sections.
Table 3. Square-Wave Frequency/Periodic Interrupt Rate
Register A Bits
Square Wave
RS3
RS2
RS1
RS0
Frequency
0
0
0
0
None
0
0
0
1
256
0
0
1
0
128
Hz
0
0
1
1
8.192
kHz
122.070
µs
0
1
0
0
4.096
kHz
244.141
µs
0
1
0
1
2.048
kHz
488.281
µs
0
1
1
0
1.024
kHz
976.5625
0
1
1
1
512
Hz
1.95315
ms
1
0
0
0
256
Hz
3.90625
ms
1
0
0
1
128
Hz
7.8125
ms
1
0
1
0
64
Hz
15.625
ms
1
0
1
1
32
Hz
31.25
ms
1
1
0
0
16
Hz
62.5
ms
1
1
0
1
8
Hz
125
ms
1
1
1
0
4
Hz
250
ms
1
1
1
1
2
Hz
500
ms
6
Units
Periodic Interrupt
Period
Units
None
Hz
3.90625
ms
7.8125
ms
µs
bq4285
Periodic Interrupt
Update Cycle Interrupt
The mux output used to drive the SQW output also drives
the interrupt-generation circuitry. If the periodic interrupt
event is enabled by writing a 1 to the periodic interrupt
enable bit (PIE) in register C, an interrupt request is generated once every 122µs to 500ms. The period between interrupts is selected by the same bits in register A that select the square wave frequency (see Table 3).
The update cycle ended flag bit (UF) in register C is set
to a 1 at the end of an update cycle. If the update interrupt enable bit (UIE) of register B is 1, and the update
transfer inhibit bit (UTI) in register B is 0, then an interrupt request is generated at the end of each update
cycle.
Accessing RTC bytes
Alarm Interrupt
Time and calendar bytes read during an update cycle
may be in error. Three methods to access the time and
calendar bytes without ambiguity are:
During each update cycle, the RTC compares the hours,
minutes, and seconds bytes with the three corresponding
alarm bytes. If a match of all bytes is found, the alarm
interrupt event flag bit, AF in register C, is set to 1. If
the alarm event is enabled, an interrupt request is generated.
An alarm byte may be removed from the comparison by
setting it to a “don’t care” state. An alarm byte is set to a
“don’t care” state by writing a 1 to each of its two mostsignificant bits. A “don’t care” state may be used to select
the frequency of alarm interrupt events as follows:
■
If none of the three alarm bytes is “don’t care,” the
frequency is once per day, when hours, minutes, and
seconds match.
■
If only the hour alarm byte is “don’t care,” the frequency
is once per hour, when minutes and seconds match.
■
If only the hour and minute alarm bytes are “don’t care,”
the frequency is once per minute, when seconds match.
■
If the hour, minute, and second alarm bytes are
“don’t care,” the frequency is once per second.
■
Enable the update interrupt event to generate
interrupt requests at the end of the update cycle.
The interrupt handler has a maximum of 999ms to
access the clock bytes before the next update cycle
begins (see Figure 3).
■
Poll the update-in-progress bit (UIP) in register A. If
UIP = 0, the polling routine has a minimum of tBUC
time to access the clock bytes (see Figure 3).
■
Use the periodic interrupt event to generate
interrupt requests every tPI time, such that UIP = 1
always occurs between the periodic interrupts. The
interrupt handler will have a minimum of tPI/2 +
tBUC time to access the clock bytes (see Figure 3).
Oscillator Control
When power is first applied to the bq4285 and VCC is
above VPFD, the internal oscillator and frequency divider
are turned on by writing a 010 pattern to bits 4 through
6 of register A. A pattern of 11X turns the oscillator on
but keeps the frequency divider disabled. Any other
pattern to these bits keeps the oscillator off.
Figure 3. Update-Ended/Periodic Interrupt Relationship
7
bq4285
As the supply continues to fall past VPFD, an internal
switching device forces VOUT to the external backup energy source. CEOUT is held high by the VOUT energy
source.
Power-Down/Power-Up Cycle
The bq4285 continuously monitors V CC for out-oftolerance. During a power failure, when VCC falls below
VPFD (4.17V typical), the bq4285 write-protects the clock
and storage registers. When VCC is below VBC (3V typical), the power source is switched to BC. RTC operation
and storage data are sustained by a valid backup energy
source. When VCC is above VBC, the power source is
VCC. Write-protection continues for tCSR time after VCC
rises above VPFD.
During power-up, VOUT is switched back to the 5V supply as VCC rises above the backup cell input voltage
sourcing VOUT. CEOUT is held inactive for time tCER
(200ms maximum) after the power supply has reached
VPFD, independent of the CEIN input, to allow for processor stabilization.
An external CMOS static RAM is battery-backed using
the VOUT and chip enable output pins from the bq4285.
As the voltage input VCC slows down during a power
failure, the chip enable output, CEOUT, is forced inactive
independent of the chip enable input CEIN.
During power-valid operation, the CEIN input is passed
through to the CEOUT output with a propagation delay
of less than 10ns.
This activity unconditionally write-protects the external
SRAM as VCC falls below VPFD. If a memory access is in
process to the external SRAM during power-fail detection, that memory cycle continues to completion before
the memory is write-protected. If the memory cycle is
not terminated within time tWPT (30µs maximum), the
chip enable output is unconditionally driven high,
write-protecting the controlled SRAM.
A primary backup energy source input is provided on
the bq4285. The BC input accepts a 3V primary battery,
typically some type of lithium chemistry. To prevent
battery drain when there is no valid data to retain,
VOUT and CEOUT are internally isolated from BC by the
initial connection of a battery. Following the first application of VCC above VPFD, this isolation is broken, and
the backup cell provides power to VOUT and CEOUT for
the external SRAM.
Figure 4 shows the hardware hookup for the external
RAM.
Figure 4. External RAM Hookup to the bq4285 RTC
8
bq4285
Control/Status Registers
the frequency divider disabled. When 010 is written,
the RTC begins its first update after 500ms.
The four control/status registers of the bq4285 are accessible regardless of the status of the update cycle (see Table 4).
UIP - Update Cycle Status
7
UIP
Register A
7
UIP
6
OS2
5
OS1
Register A Bits
4
3
2
OS0 RS3 RS2
1
RS1
Register A programs:
The frequency of the square-wave and the periodic
event rate.
■
Oscillator operation.
7
UTI
Status of the update cycle.
6
-
5
-
4
-
3
RS3
2
RS2
1
RS1
0
RS0
These bits select one of the 13 frequencies for the SQW output and the periodic interrupt rate, as shown in Table 3.
6
OS2
5
OS1
4
OS0
2
-
1
-
0
-
6
PIE
5
AIE
Register B Bits
4
3
2
UIE SQWE DF
1
HF
0
DSE
■
Update cycle transfer operation
■
Square-wave output
■
Interrupt events
■
Daylight saving adjustment
Register B selects:
OS0–OS2 - Oscillator Control
7
-
3
-
Register B enables:
RS0–RS3 - Frequency Select
7
-
4
-
Register B
Register A provides:
■
5
-
This read-only bit is set prior to the update cycle. When
UIP equals 1, an RTC update cycle may be in progress.
UIP is cleared at the end of each update cycle. This bit
is also cleared when the update transfer inhibit (UTI)
bit in register B is 1.
0
RS0
■
6
-
■
3
-
2
-
1
-
Clock and calendar data formats
All bits of register B are read/write.
0
-
These three bits control the state of the oscillator and divider stages. A pattern of 010 enables RTC operation by
turning on the oscillator and enabling the frequency divider. A pattern of 11X turns the oscillator on, but keeps
Table 4. Control/Status Registers
Bit Name and State on Reset
Reg.
Loc.
(Hex) Read Write
1
7 (MSB)
6
5
4
3
2
1
0 (LSB)
A
0A
Yes
Yes
UIP
na OS2 na OS1 na OS0 na
B
0B
Yes
Yes
UTI
na
PIE
0
AIE
0
UIE
0
SQWE
0
DF
na
HF
na
C
0C
Yes
No
INTF
0
PF
0
AF
0
UF
0
-
0
-
0
-
0
-
0
D
0D
Yes
No
VRT
na
-
0
-
0
-
0
-
0
-
0
-
0
-
0
Notes:
na = not affected.
1. Except bit 7.
9
RS3
na RS2 na RS1 na
RS0
na
DSE na
bq4285
UIE - Update Cycle Interrupt Enable
DSE - Daylight Saving Enable
7
-
6
-
5
-
4
-
3
-
2
-
1
-
7
-
0
DSE
This bit enables daylight-saving time adjustments when
written to 1:
■
■
4
-
3
-
2
-
1
HF
7
-
0
-
5
AIE
4
-
3
-
2
-
1
-
0
-
0 = Disabled
PIE - Periodic Interrupt Enable
4
-
3
-
2
DF
1
-
0
-
7
-
This bit selects the numeric format in which the time,
alarm, and calendar bytes are represented:
1 = Binary
6
PIE
5
-
4
-
3
-
2
-
1
-
0
-
This bit enables an interrupt request due to a periodic
interrupt event:
1 = Enabled
0 = BCD
0 = Disabled
SQWE - Square-Wave Enable
6
-
6
-
1 = Enabled
DF - Data Format
7
-
0
-
This bit enables an interrupt request due to an alarm
interrupt event:
0 = 12-hour format
5
-
1
-
AIE - Alarm Interrupt Enable
1 = 24-hour format
6
-
2
-
The UIE bit is automatically cleared when the UTI bit
equals 1.
This bit selects the time-of-day and alarm hour format:
7
-
3
-
0 = Disabled
HF - Hour Format
5
-
4
UIE
1 = Enabled
On the first Sunday in April, the time springs
forward from 2:00:00 AM to 3:00:00 AM.
6
-
5
-
This bit enables an interrupt request due to an update
ended interrupt event:
On the last Sunday in October, the first time the
bq4285 increments past 1:59:59 AM, the time falls
back to 1:00:00 AM.
7
-
6
-
5
-
4
-
3
SQWE
UTI - Update Transfer Inhibit
2
-
1
-
0
-
7
UTI
This bit enables the square-wave output:
6
-
5
-
4
-
3
-
2
-
1
-
0
-
This bit inhibits the transfer of RTC bytes to the user
buffer:
1 = Enabled
1 = Inhibits transfer and clears UIE
0 = Disabled and held low
0 = Allows transfer
10
bq4285
INTF - Interrupt Request Flag
Register C
7
INTF
6
PF
Register C Bits
5
4
3
AF
UF
0
7
INTF
2
0
1
0
6
-
5
-
4
-
3
-
2
-
1
-
0
-
0
0
This flag is set to a 1 when any of the following is true:
Register C is the read-only event status register.
AIE = 1 and AF = 1
Bits 0–3 - Unused Bits
7
-
6
-
PIE = 1 and PF = 1
5
-
4
-
3
0
2
0
1
0
0
0
UIE = 1 and UF = 1
Reading register C clears this bit.
These bits are always set to 0.
Register D
UF - Update-Event Flag
7
-
6
-
5
-
4
UF
3
-
2
-
1
-
0
-
7
VRT
6
0
5
0
Register D Bits
4
3
0
0
2
0
1
0
0
0
This bit is set to a 1 at the end of the update cycle.
Reading register C clears this bit.
Register D is the read-only data integrity status register.
AF - Alarm Event Flag
Bits 0–6 - Unused Bits
7
-
6
-
5
AF
4
-
3
-
2
-
1
-
0
-
7
-
This bit is set to a 1 when an alarm event occurs. Reading register C clears this bit.
6
0
5
0
4
0
3
0
2
0
1
0
0
0
3
-
2
-
1
-
0
-
These bits are always set to 0.
VRT - Valid RAM and Time
7
-
6
PF
5
-
4
-
3
-
2
-
1
-
0
-
7
VRT
6
-
5
-
4
-
PF - Periodic Event Flag
1 = Valid backup energy source
This bit is set to a 1 every tPI time, where tPI is the time
period selected by the settings of RS0–RS3 in register A.
Reading register C clears this bit.
0 = Backup energy source is depleted
When the backup energy source is depleted (VRT = 0),
data integrity of the RTC and storage registers is not
guaranteed.
11
bq4285
Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
Conditions
VCC
DC voltage applied on VCC relative to VSS
-0.3 to 7.0
V
VT
DC voltage applied on any pin excluding VCC
relative to VSS
-0.3 to 7.0
V
VT ≤ VCC + 0.3
TOPR
Operating temperature
0 to +70
°C
Commercial
TSTG
Storage temperature
-55 to +125
°C
TBIAS
Temperature under bias
-40 to +85
°C
TSOLDER
Soldering temperature
260
°C
Note:
For 10 seconds
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability.
Recommended DC Operating Conditions (TA = TOPR)
Minimum
Typical
Maximum
Unit
VCC
Symbol
Supply voltage
4.5
5.0
5.5
V
VSS
Supply voltage
0
0
0
V
VIL
Input low voltage
-0.3
-
0.8
V
VIH
Input high voltage
2.2
-
VCC + 0.3
V
VBC
Backup cell voltage
2.5
-
4.0
V
Note:
Parameter
Typical values indicate operation at TA = 25°C.
12
bq4285
DC Electrical Characteristics (TA = TOPR, VCC = 5V ± 10%)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
Conditions/Notes
ILI
Input leakage current
-
-
±1
µA
VIN = VSS to VCC
ILO
Output leakage current
-
-
±1
µA
AD0–AD7, INT, and
SQW in high impedance,
VOUT = VSS to VCC
VOH
Output high voltage
2.4
-
-
V
IOH = -2.0 mA
VOL
Output low voltage
-
-
0.4
V
IOL = 4.0 mA
ICC
Operating supply current
-
7
15
mA
VSO
Supply switch-over voltage
-
VBC
-
V
ICCB
Battery operation current
-
0.3
0.5
µA
VPFD
Power-fail-detect voltage
4.0
4.17
4.35
V
-
-
V
VOUT1
VOUT voltage
VCC - 0.3V
VOUT2
VOUT voltage
VBC - 0.3V
ICE
Chip enable input current
Note:
Min. cycle, duty = 100%,
IOH = 0mA, IOL = 0mA
VBC = 3V, TA = 25°C, no
load on VOUT or CEOUT
IOUT = 100mA, VCC >VBC
IOUT = 100µA, VCC < VBC
-
-
µA
100
Internal 50K pull-up
Typical values indicate operation at TA = 25°C, VCC = 5V or VBC = 3V.
Crystal Specifications (DT-26 or Equivalent)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
fO
Oscillation frequency
-
32.768
-
kHz
CL
Load capacitance
-
6
-
pF
TP
Temperature turnover point
20
25
30
°C
k
Parabolic curvature constant
-
-
-0.042
ppm/°C
Q
Quality factor
40,000
70,000
-
R1
Series resistance
-
-
45
KΩ
C0
Shunt capacitance
-
1.1
1.8
pF
C0/C1
Capacitance ratio
-
430
600
DL
Drive level
-
-
1
µW
∆f/fO
Aging (first year at 25°C)
-
1
-
ppm
13
bq4285
Capacitance (TA = 25°C, F = 1MHz, VCC = 5.0V)
Parameter
Minimum
Typical
Maximum
Unit
CI/O
Symbol
Input/output capacitance
-
-
7
pF
VOUT = 0V
CIN
Input capacitance
-
-
5
pF
VIN = 0V
Note:
Conditions
This parameter is sampled and not 100% tested.
AC Test Conditions
Parameter
Test Conditions
Input pulse levels
0 to 3.0 V
Input rise and fall times
5 ns
Input and output timing reference levels
1.5 V (unless otherwise specified)
Output load (including scope and jig)
See Figures 5 and 6
Figure 5. Output Load A
Figure 6. Output Load B
14
bq4285
Read/Write Timing (TA = TOPR, VCC = 5V ± 10%)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
tCYC
Cycle time
160
-
-
ns
tDSL
DS low or RD/WR high time
80
-
-
ns
tDSH
DS high or RD/WR low time
55
-
-
ns
tRWH
R/W hold time
0
-
-
ns
tRWS
R/W setup time
10
-
-
ns
tCS
Chip select setup time
5
-
-
ns
tCH
Chip select hold time
0
-
-
ns
tDHR
Read data hold time
0
-
25
ns
tDHW
Write data hold time
0
-
-
ns
tAS
Address setup time
20
-
-
ns
tAH
Address hold time
5
-
-
ns
tDAS
Delay time, DS to AS rise
10
-
-
ns
tASW
Pulse width, AS high
30
-
-
ns
tASD
Delay time, AS to DS rise
(RD/WR fall)
35
-
-
ns
tOD
Output data delay time from
DS rise (RD fall)
-
-
50
ns
tDW
Write data setup time
30
-
-
ns
tBUC
Delay time before update
-
244
-
µs
tPI
Periodic interrupt time interval
-
-
-
-
tUC
Time of update cycle
-
1
-
µs
15
Notes
See Table 3
bq4285
Motorola Bus Read/Write Timing (PLCC Package Only) Note: OBSOLETE
16
bq4285
Intel Bus Read Timing
Intel Bus Write Timing
17
bq4285
Power-Down/Power-Up Timing (TA = TOPR)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
Conditions
tF
VCC slew from 4.5V to 0V
300
-
-
µs
tR
VCC slew from 0V to 4.5V
100
-
-
µs
tCSR
CS at VIH after power-up
20
-
200
ms
Internal write-protection
period after VCC passes VPFD
on power-up.
tWPT
Write-protect time for
external RAM
10
6
30
µs
Delay after VCC slews down
past VPFD before SRAM is
write-protected.
tCER
Chip enable recovery
time
tCSR
-
tCSR
ms
Time during which external
SRAM is write-protected after
VCC passes VPFD on power-up.
tCED
Chip enable propagation
delay to external SRAM
-
7
10
ns
Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode
may affect data integrity.
Power-Down/Power-Up Timing
18
bq4285
Interrupt Delay Timing (TA = TOPR)
Symbol
Parameter
Minimum
Typical
Maximum
Unit
tRSW
Reset pulse width
5
-
-
µs
tIRR
INT release from RST
-
-
2
µs
tIRD
INT release from DS (RD)
-
-
2
µs
Interrupt Delay Timing (PLCC Package Only) Note: Package OBSOLETE
Interrupt Delay Timing
19
bq4285
24-Pin DIP (P)
24-Pin DIP (P)
Dimension
A
A1
B
B1
C
D
E
E1
e
G
L
S
Minimum
0.160
0.015
0.015
0.045
0.008
1.240
0.600
0.530
0.600
0.090
0.115
0.070
Maximum
0.190
0.040
0.022
0.065
0.013
1.280
0.625
0.570
0.670
0.110
0.150
0.090
All dimensions are in inches.
24-Pin SOIC (S)
24-Pin SOIC (S)
Dimension
A
A1
B
C
D
E
e
H
L
Minimum
0.095
0.004
0.013
0.008
0.600
0.290
0.045
0.395
0.020
All dimensions are in inches.
20
Maximum
0.105
0.012
0.020
0.013
0.615
0.305
0.055
0.415
0.040
bq4285
Data Sheet Revision History
Change
No.
Page No.
Description
Natur of Change
1
3
Address strobe input
Clarification
1
12
Was 2.0 min; is 2.5 min
1
13
Backup cell voltage VBC
Power-fail detect voltage VPFD
1
13
Chip enable input current
Additional specifiction
2
3, 13
Crystal type Daiwas DT-26 (not DT-26S)
Clarification
Was 4.1 min, 4.25 max; is 4.0 min, 4.35 max
3
1, 20, 22
Package option change
PLCC last time buy
4
1, 2, 3, 13, 16,
19, 21, 23
Package option removal
PLCC Last Time Buy Complete
Note:
Change 1 = Nov. 1992 B changes from June 1991 A.
Change 2 = Nov. 1993 C changes from Nov. 1992 B
Change 3 = Jan. 1999 D changes from Nov. 1993 C
Change 4 = May 2004 (SLUS002A) changes from Jan. 1999 D
23
bq4285
Ordering Information
bq4285
Temperature:
blank = Commercial (0 to +70°C)
Package Option:
P = 24-pin plastic DIP (0.600)
S = 24-pin SOIC (0.300)
Device:
bq4285 Real-Time Clock With NVRAM Control
24
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ4285P-SB2
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
A42 SN
N / A for Pkg Type
0 to 70
4285P
-SB2
BQ4285S-SB2
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
4285S
-SB2
BQ4285S-SB2G4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
4285S
-SB2
BQ4285S-SB2TR
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
4285S
-SB2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BQ4285S-SB2TR
Package Package Pins
Type Drawing
SOIC
DW
24
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.7
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ4285S-SB2TR
SOIC
DW
24
2000
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
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• DALLAS, TEXAS 75265
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