Murata ERB1885C2E2R4BDX1D Application spec ifi c capacitors high frequency ceramic capacitor Datasheet

A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Product Summary
ERB Series: Exhibiting a
capacitance range of 0.5 to 1,000pF,
the ERB series of capacitors comes
with higher Q and lower ESR which
is better than the standard products
of equivalent packages. For high
performance, medium power RF
designs, this series offers low ESR in
the 1MHz to 1GHz frequency range.
The temperature stability of the
C0G dielectrics ensures low power
dissipation. The ERB series is designed
with precious metal inner electrodes.
These surface mount capacitors are
available in voltages up to 500VDC in a
1210 EIA size.
Features:
ERB Series
Size: 0603, 0805, and 1210
 Voltage: 50, 100, 250, 300, 500VDC
 Cap Range: 0.5 to 1000pF
 Internal Electrode: Pd/Ag
 Termination: Pd/Ag + Ni/Sn plating
 ESR: Low
 Power: Medium Power (5-15W)
 Frequency Range: 1MHz –1GHz
 Tolerance: Tight Tolerance Available ([W]=+/-0.05pF for <=5pF, [ [B]=+/-0.1pF for
5 - 9.1pF, [C]=+/-0.25pF for 5 - 9.1pF, [F]=+/-1% for 10 - 20pF)
 Temp. Characteristics: C0G (-55ºC to 125ºC with 0 ±30ppm/ºC)

Applications: General purpose
high frequency circuits, wireless
equipment, high frequency radios,
broadcast satellites, terminals,
RF and base station power
amplifiers
44 – Innovator in Electronics
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
High Frequency ERB Series
ERB Data Sheet
Chip Structure
Chip Dimensions
Dielectric
(Ceramic)
e
L
Barrier
(Ni)
Land Pattern Dimensions
e
Series
EIA size
ERB18
ERB21
ERB32
0603
0805
1210
L
Unit: mm
T max. e max. g min.
W
1.6+/-0.1
0.8+/-0.1
0.9
2.0+/-0.3
1.25+/-0.3 1.35
3.2+0.5/-0.4 2.5+0.5/-0.4 1.7
0.2
0.25
0.3
0.5
0.7
1.0
Flow Soldering
Land
Solder
Resist
Chip Capacitor
c
g
Chip Dimensions
Termination
(Ag/Pd)
Inner Electrode
(Pd)
T
W
Plating
(Sn)
Series
a
b
c
ERB18
ERB21
0.6 ~ 1.0
1.0 ~ 1.2
0.8 ~ 0.9
0.9 ~ 1.0
0.6 ~ 0.8
0.8 ~ 1.1
Re-Flow Soldering
b
a
Series
a
b
c
ERB18
ERB21
ERB31
0.6 ~ 0.8
1.0 ~ 1.2
2.0 ~ 2.4
0.6 ~ 0.7
0.6 ~ 0.7
1.0 ~ 1.2
0.6 ~ 0.8
0.8 ~ 1.1
1.8 ~ 2.3
Capacitance Range
TC
WV
ERB18
C0G
ERB21
C0G
ERB32
C0G
250V
250V
100V
50V
500V
300V
250V
100V
50V
Capacitance Range
1pF
10pF
1000pF
100pF
pF
0.5 to 100 pF
0.5 to 100 pF
110 to 130 pF
150 to 160 pF
0.5 to 120 pF
130 to 150 pF
160 to 220 pF
240 to 470 pF
510 to 1000 pF
Global Part Numbering
ER B 18
8 5C 2D 100 J DX5 B
Code
TC
Cap.Change
5C
C0G
0+/-30ppm/C
Operating Temp. Range
25 to 125C
C-29-C
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Innovator in Electronics – 45
ERB Series
Series
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Product Offering
Product Offering
ERB18 Series
ERB series High Frequency ERB Series (0603 / C0G)
ERB Series
Size
TC
WV
Cap
Cap Tol
Murata Global P/N
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
0.5pF
0.5pF
0.75pF
0.75pF
1pF
1pF
1.1pF
1.2pF
1.3pF
1.5pF
1.5pF
1.6pF
1.8pF
2pF
2pF
2.2pF
2.4pF
2.7pF
3pF
3pF
3.3pF
3.6pF
3.9pF
4pF
4pF
4.3pF
4.7pF
5pF
5pF
5.1pF
5.6pF
6pF
6pF
6.2pF
6.8pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.5pF
+/-0.25pF
+/-0.25pF
ERB1885C2ER50BDX1D
ERB1885C2ER50CDX1D
ERB1885C2ER75BDX1D
ERB1885C2ER75CDX1D
ERB1885C2E1R0BDX1D
ERB1885C2E1R0CDX1D
ERB1885C2E1R1BDX1D
ERB1885C2E1R2BDX1D
ERB1885C2E1R3BDX1D
ERB1885C2E1R5BDX1D
ERB1885C2E1R5CDX1D
ERB1885C2E1R6BDX1D
ERB1885C2E1R8BDX1D
ERB1885C2E2R0BDX1D
ERB1885C2E2R0CDX1D
ERB1885C2E2R2BDX1D
ERB1885C2E2R4BDX1D
ERB1885C2E2R7BDX1D
ERB1885C2E3R0BDX1D
ERB1885C2E3R0CDX1D
ERB1885C2E3R3BDX1D
ERB1885C2E3R6BDX1D
ERB1885C2E3R9BDX1D
ERB1885C2E4R0BDX1D
ERB1885C2E4R0CDX1D
ERB1885C2E4R3BDX1D
ERB1885C2E4R7BDX1D
ERB1885C2E5R0BDX1D
ERB1885C2E5R0CDX1D
ERB1885C2E5R1CDX1D
ERB1885C2E5R6CDX1D
ERB1885C2E6R0CDX1D
ERB1885C2E6R0DDX1D
ERB1885C2E6R2CDX1D
ERB1885C2E6R8CDX1D
46 – Innovator in Electronics
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Product Offering
Product Offering
ERB18 Series
C-29-C

Size
TC
WV
Cap
Cap Tol
Murata Global P/N
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
0603
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
7pF
7pF
7.5pF
8pF
8pF
8.2pF
9pF
9pF
9.1pF
10pF
10pF
12pF
12pF
15pF
15pF
18pF
18pF
22pF
22pF
27pF
27pF
33pF
33pF
39pF
39pF
47pF
47pF
56pF
56pF
68pF
68pF
82pF
82pF
100pF
100pF
+/-0.25pF
+/-0.5pF
+/-0.25pF
+/-0.25pF
+/-0.5pF
+/-0.25pF
+/-0.25pF
+/-0.5pF
+/-0.25pF
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
ERB1885C2E7R0CDX5D
ERB1885C2E7R0DDX5D
ERB1885C2E7R5CDX5D
ERB1885C2E8R0CDX5D
ERB1885C2E8R0DDX5D
ERB1885C2E8R2CDX5D
ERB1885C2E9R0CDX5D
ERB1885C2E9R0DDX5D
ERB1885C2E9R1CDX5D
ERB1885C2E100GDX5D
ERB1885C2E100JDX5D
ERB1885C2E120GDX5D
ERB1885C2E120JDX5D
ERB1885C2E150GDX5D
ERB1885C2E150JDX5D
ERB1885C2E180GDX5D
ERB1885C2E180JDX5D
ERB1885C2E220GDX5D
ERB1885C2E220JDX5D
ERB1885C2E270GDX5D
ERB1885C2E270JDX5D
ERB1885C2E330GDX5D
ERB1885C2E330JDX5D
ERB1885C2E390GDX5D
ERB1885C2E390JDX5D
ERB1885C2E470GDX5D
ERB1885C2E470JDX5D
ERB1885C2E560GDX5D
ERB1885C2E560JDX5D
ERB1885C2E680GDX5D
ERB1885C2E680JDX5D
ERB1885C2E820GDX5D
ERB1885C2E820JDX5D
ERB1885C2E101GDX5D
ERB1885C2E101JDX5D
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Innovator in Electronics – 47
ERB Series
ERB series High Frequency ERB Series (0603 / C0G)
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Product Offering
Product Offering
ERB21 Series
ERB series High Frequency ERB Series (0805 / C0G)
ERB Series
Size
TC
WV
Cap
Cap Tol
Murata Global P/N
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
0.5pF
0.5pF
0.75pF
0.75pF
1pF
1pF
1.1pF
1.2pF
1.3pF
1.5pF
1.5pF
1.6pF
1.8pF
2pF
2pF
2.2pF
2.4pF
2.7pF
3pF
3pF
3.3pF
3.6pF
3.9pF
4pF
4pF
4.3pF
4.7pF
5pF
5pF
5.1pF
5.6pF
6pF
6pF
6.2pF
6.8pF
7pF
7pF
7.5pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.5pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.5pF
+/-0.25pF
ERB21B5C2ER50BDX1L
ERB21B5C2ER50CDX1L
ERB21B5C2ER75BDX1L
ERB21B5C2ER75CDX1L
ERB21B5C2E1R0BDX1L
ERB21B5C2E1R0CDX1L
ERB21B5C2E1R1BDX1L
ERB21B5C2E1R2BDX1L
ERB21B5C2E1R3BDX1L
ERB21B5C2E1R5BDX1L
ERB21B5C2E1R5CDX1L
ERB21B5C2E1R6BDX1L
ERB21B5C2E1R8BDX1L
ERB21B5C2E2R0BDX1L
ERB21B5C2E2R0CDX1L
ERB21B5C2E2R2BDX1L
ERB21B5C2E2R4BDX1L
ERB21B5C2E2R7BDX1L
ERB21B5C2E3R0BDX1L
ERB21B5C2E3R0CDX1L
ERB21B5C2E3R3BDX1L
ERB21B5C2E3R6BDX1L
ERB21B5C2E3R9BDX1L
ERB21B5C2E4R0BDX1L
ERB21B5C2E4R0CDX1L
ERB21B5C2E4R3BDX1L
ERB21B5C2E4R7BDX1L
ERB21B5C2E5R0BDX1L
ERB21B5C2E5R0CDX1L
ERB21B5C2E5R1CDX1L
ERB21B5C2E5R6CDX1L
ERB21B5C2E6R0CDX1L
ERB21B5C2E6R0DDX1L
ERB21B5C2E6R2CDX1L
ERB21B5C2E6R8CDX1L
ERB21B5C2E7R0CDX1L
ERB21B5C2E7R0DDX1L
ERB21B5C2E7R5CDX1L
48 – Innovator in Electronics
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Product Offering
Product Offering
ERB21 Series
C-29-C

Size
TC
WV
Cap
Cap Tol
Murata Global P/N
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
0805
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
250V
100V
100V
50V
50V
8pF
8pF
8.2pF
9pF
9pF
10pF
10pF
12pF
12pF
15pF
15pF
18pF
18pF
22pF
22pF
27pF
27pF
33pF
33pF
39pF
39pF
47pF
47pF
56pF
56pF
68pF
68pF
82pF
82pF
100pF
100pF
120pF
120pF
150pF
150pF
+/-0.25pF
+/-0.5pF
+/-0.25pF
+/-0.25pF
+/-0.5pF
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
+/-2%
+/-5%
ERB21B5C2E8R0CDX1L
ERB21B5C2E8R0DDX1L
ERB21B5C2E8R2CDX1L
ERB21B5C2E9R0CDX1L
ERB21B5C2E9R0DDX1L
ERB21B5C2E100GDX1L
ERB21B5C2E100JDX1L
ERB21B5C2E120GDX1L
ERB21B5C2E120JDX1L
ERB21B5C2E150GDX1L
ERB21B5C2E150JDX1L
ERB21B5C2E180GDX1L
ERB21B5C2E180JDX1L
ERB21B5C2E220GDX1L
ERB21B5C2E220JDX1L
ERB21B5C2E270GDX1L
ERB21B5C2E270JDX1L
ERB21B5C2E330GDX1L
ERB21B5C2E330JDX1L
ERB21B5C2E390GDX1L
ERB21B5C2E390JDX1L
ERB21B5C2E470GDX1L
ERB21B5C2E470JDX1L
ERB21B5C2E560GDX1L
ERB21B5C2E560JDX1L
ERB21B5C2E680GDX1L
ERB21B5C2E680JDX1L
ERB21B5C2E820GDX1L
ERB21B5C2E820JDX1L
ERB21B5C2E101GDX1L
ERB21B5C2E101JDX1L
ERB21B5C2A121GDX1L
ERB21B5C2A121JDX1L
ERB21B5C1H151GDX1L
ERB21B5C1H151JDX1L
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Innovator in Electronics – 49
ERB Series
ERB series High Frequency ERB Series (0805 / C0G)
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Product Offering
Product Offering
ERB32 Series
ERB series High Frequency ERB Series (01210 / C0G)
ERB Series
Size
TC
WV
Cap
Cap Tol
Murata Global P/N
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
0.5pF
0.75pF
1pF
1.1pF
1.2pF
1.3pF
1.5pF
1.6pF
1.8pF
2pF
2.2pF
2.4pF
2.7pF
3pF
3.3pF
3.6pF
3.9pF
4pF
4.3pF
4.7pF
5pF
5.1pF
5.6pF
6pF
6.2pF
6.8pF
7pF
7.5pF
8pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.1pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
ERB32Q5C2HR50BDX1L
ERB32Q5C2HR75BDX1L
ERB32Q5C2H1R0BDX1L
ERB32Q5C2H1R1BDX1L
ERB32Q5C2H1R2BDX1L
ERB32Q5C2H1R3BDX1L
ERB32Q5C2H1R5BDX1L
ERB32Q5C2H1R6BDX1L
ERB32Q5C2H1R8BDX1L
ERB32Q5C2H2R0BDX1L
ERB32Q5C2H2R2BDX1L
ERB32Q5C2H2R4BDX1L
ERB32Q5C2H2R7BDX1L
ERB32Q5C2H3R0BDX1L
ERB32Q5C2H3R3BDX1L
ERB32Q5C2H3R6BDX1L
ERB32Q5C2H3R9BDX1L
ERB32Q5C2H4R0BDX1L
ERB32Q5C2H4R3BDX1L
ERB32Q5C2H4R7BDX1L
ERB32Q5C2H5R0BDX1L
ERB32Q5C2H5R1CDX1L
ERB32Q5C2H5R6CDX1L
ERB32Q5C2H6R0CDX1L
ERB32Q5C2H6R2CDX1L
ERB32Q5C2H6R8CDX1L
ERB32Q5C2H7R0CDX1L
ERB32Q5C2H7R5CDX1L
ERB32Q5C2H8R0CDX1L
50 – Innovator in Electronics
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Product Offering
Product Offering
ERB32 Series
C-29-C

Size
TC
WV
Cap
Cap Tol
Murata Global P/N
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
500V
300V
250V
250V
100V
100V
100V
100V
50V
50V
50V
50V
8.2pF
9pF
9.1pF
10pF
12pF
15pF
18pF
20pF
22pF
27pF
33pF
39pF
47pF
56pF
68pF
82pF
100pF
120pF
150pF
180pF
220pF
270pF
330pF
390pF
470pF
560pF
680pF
820pF
1000pF
+/-0.25pF
+/-0.25pF
+/-0.25pF
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
+/-5%
ERB32Q5C2H8R2CDX1L
ERB32Q5C2H9R0CDX1L
ERB32Q5C2H9R1CDX1L
ERB32Q5C2H100JDX1L
ERB32Q5C2H120JDX1L
ERB32Q5C2H150JDX1L
ERB32Q5C2H180JDX1L
ERB32Q5C2H200JDX1L
ERB32Q5C2H220JDX1L
ERB32Q5C2H270JDX1L
ERB32Q5C2H330JDX1L
ERB32Q5C2H390JDX1L
ERB32Q5C2H470JDX1L
ERB32Q5C2H560JDX1L
ERB32Q5C2H680JDX1L
ERB32Q5C2H820JDX1L
ERB32Q5C2H101JDX1L
ERB32Q5C2H121JDX1L
ERB32Q5CYD151JDX1L
ERB32Q5C2E181JDX1L
ERB32Q5C2E221JDX1L
ERB32Q5C2A271JDX1L
ERB32Q5C2A331JDX1L
ERB32Q5C2A391JDX1L
ERB32Q5C2A471JDX1L
ERB32Q5C1H561JDX1L
ERB32Q5C1H681JDX1L
ERB32Q5C1H821JDX1L
ERB32Q5C1H102JDX1L
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Innovator in Electronics – 51
ERB Series
ERB series High Frequency ERB Series (1210 / C0G)
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Specifications and Test Methods
Specifications and Test Methods
Item
Specifications
and Test Methods
ERB Series
Specifications
Test Method
Operating Temperature
᧩55°C to 125°C
Reference Temperature: 25ഒ
Appearance
No defects or abnormalities.
Visual inspection.
Dimension
Within the specified dimensions.
Using calipers.
Dielectric Strength
No defects or abnormalities.
300%* of the rated voltage
*250V/300V: 250%, 500V: 200%
1,000,000Mȍmin.(Cู470pF)
Insulation Resistance
Q
DC voltage not exceeding the rated voltage at 25°C
and 75%RH max. and within 2 minutes of charging.
100,000 Mȍmin. (C᧺470pF)
C: Nominal capacitance (pF)
Cู220pF: Qฺ10,000
Frequency 1±0.1MHz
220pF᧸Cู470pF: Qฺ5,000
Voltage 1±0.2Vrms
470pF᧸Cู1000pF: Qฺ3,000
Specifications and Test Methods
ERB Series
C: Nominal capacitance (pF)
Item
Capacitance
Adhesive
Strength of
Operating
Temperature
Temperature
Termination
Characteristics
Appearance
Dimension
Dielectric Strength
Vibration Resistance
ERB Series
Insulation Resistance
Deflection
Q
Solderability of Termination
Specifications
Capacitance
No
removal ofChange:
the terminations or other
᧩55°C
to 125°C
Within the
specified tolerance. (Table A-1)
defect should occur.
Temperature Coefficent:
No defects or abnormalities.
Within the specified tolerance. (Table A-1)
Capacitance
Drift:
Within
or
Within
the specified
dimensions.
Appearance:
No
defects
or±0.2%
abnormalities.
±0.5pF (Whichever
larger)
Capacitance:
Withinisthe
specified tolerance.
No
defectsQฺ10,000
or abnormalities.
Cู220pF:
220pF᧸Cู470pF: Qฺ5,000
1,000,000Mȍmin.(Cู470pF)
470pF᧸Cู1000pF: Qฺ3,000
100,000
Mȍmin.
(C᧺470pF)
C: Nominal
capacitance
(pF)
C: Nominal capacitance (pF)
No crack orQฺ10,000
marked defect should occur.
Cู220pF:
1
25±2
-55±3
3 1±0.2Vrms
25±2 for 5±0.5 seconds
Voltage
Immerse
in eutectic solder solution
4
125±3
at 245±5°C
or Sn-3.0Ag-0.5Cu
solder solution for
5±0.55 seconds at 245±5°C. 25±2
Flexure: 1mm
Frequency
1±0.1MHz
2
220pF᧸Cู470pF: Qฺ5,000
95% of the terminations are to be soldered
470pF᧸Cู1000pF: Qฺ3,000
evenly and continuously.
C: Nominal capacitance (pF)
Appearance:
defects
No
removal ofNo
themarking
terminations
or other
Capacitance
defect
shouldChange:
occur. Within ±2.5% or
±0.25 pF (Whichever is larger)
Resistance to Soldering Heat Cู220pF: Qฺ10,000
Appearance: No defects or abnormalities.
220pF᧸Cู470pF: Qฺ5,000
Capacitance: Within the specified tolerance.
470pF᧸Cู1000pF:
Cู220pF:
Qฺ10,000Qฺ3,000
Vibration Resistance
C: Nominal capacitance (pF)
220pF᧸Cู470pF: Qฺ5,000
Adhesive Strength of
Termination
470pF᧸Cู1000pF:
Qฺ3,000
Appearance: No marking
defects
C:
Nominal capacitance
(pF) ±5% or
Capacitance
Change: Within
Deflection
Temperature Cycle
Solderability of Termination
±0.5 pF (Whichever is larger)
No
crack orQฺ10,000
marked defect should occur.
Cู220pF:
Solder the capacitor to the test jig (glass epoxy
board) then apply 10N force in parallel with the test
jig
for 10±1sec.
Immerse
the capacitor in a eutectic solder solution or
Sn-3.0Ag-0.5Cu solder solution at 270±5°C for
10±0.5 seconds. Let sit at room temperature for
Frequency
24±2 hours.range, from 10 to 55Hz and return to
10Hz, should be traversed in approximately 1 minute.
This motion should be applied for a period of 2 hours
in each of 3 mutually perpendicular directions total of
6 hours).
Flexure: 1mm
᧩55ഒ to 125ഒ Five cycles
Immerse in eutectic solder solution for 5±0.5 seconds
at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for
5±0.5 seconds at 245±5°C.
220pF᧸Cู470pF: Qฺ5,000
95% of the terminations are to be soldered
470pF᧸Cู1000pF: Qฺ3,000
evenly and continuously.
C: Nominal capacitance (pF)
Appearance: No marking defects
Capacitance Change: Within ±2.5%
±5% oror
±0.25
(Whichever
larger)
±0.5pFpF
(Whichever
is is
larger)
Qฺ10,000
Cู30pF: Qฺ350
Resistance
to Soldering
Humidity Steady
State Heat Cู220pF:
220pF᧸Cู470pF:
Qฺ5,000
10pFูC<30pF: Qฺ275+
5°C/2°C᧸10pF:
470pF᧸Cู1000pF:
Qฺ3,000
Qฺ200+10C
C: Nominal capacitance (pF)
High Temperature
Temperature
CycleLoad
Test
Solder
the capacitor
to theMethod
test
jig (glass epoxy
The temperature
coefficient
is determined
using the
board)
thenTemperature:
apply
10N force
in3parallel
with the test
capacitance
measured
in 25ഒ
step
as a reference.
Reference
When
cycling the temperature sequentially from
jig
for 10±1sec.
Visual
step 1 inspection.
through 5 the capacitance should be within
the specified
tolerance for the temperature coefficient
Using
calipers.
and capacitance
Tableand
A-1.return
The to
Frequency
range,change
from 10astoin55Hz
300%*
of the drift
rated
capacitance
is voltage
calculated
by dividing the1 minute.
10Hz,
should
be traversed
in approximately
*250V/300V:
250%,be
500V:
200%
differences
the
maximum
minimum
This
motion between
should
applied
for aand
period
of 2 hours
measured
values
in
steps
1,
3 and 5 directions
by the cap.total of
in each of 3 mutually perpendicular
in stepnot
3. exceeding the rated voltage at 25°C
DC
voltage
6value
hours).
andStep
75%RH max. and Temperature
within 2 minutes
(°C) of charging.
Immerse the capacitor in a eutectic solder solution or
Sn-3.0Ag-0.5Cu
solution
at 270±5°C
for
Apply the 24-hoursolder
heat (-10
to +65ഒ)
and humidity
10±0.5
seconds.
Let sit 10
at room
temperature
(80 to 100%)
treatment,
consecutive
times.for
24±2 hours.
Appearance: No marking defects
±3% or
Capacitance Change: Within ±5%
±0.3pF
±0.5
pF(Whichever
(Whicheverisislarger)
larger)
Cู30pF: Qฺ350
Cู220pF:
Qฺ10,000
10pFูC<30pF: Qฺ275+5°C/2°C
220pF᧸Cู470pF:
Qฺ5,000
Apply 200% (500V only 150%) of the rated voltage
for 1000±12
hours
at the
maximum operating
᧩55ഒ
to 125ഒ
Five
cycles
temperature ±3°C.
᧸10pF: Qฺ200+10°C
470pF᧸Cู1000pF:
Qฺ3,000
C: Nominal capacitance (pF)
52 – Innovator in Electronics
Humidity Steady State
Appearance: No marking defects
Capacitance Change: Within ±5% or

w iswlarger)
w . m
±0.5pF (Whichever
Cู30pF: Qฺ350
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Apply the 24-hour heat (-10 to +65ഒ) and humidity
(80 to 100%) treatment, 10 consecutive times.
C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
Specifications and Test Methods
ERB Specifications and Test Methods
Item
ERB Series
Specification
Test Method
Appearance: No marking defects
Capacitance Change: Within ±5% or
±0.5 pF (Whichever is larger)
C30pF: Q > 350, 10pFC 30pF:
Humidity Steady State
Apply the 24-hour heat (-10 to +65°C) and humidity
(80 to 100%) treatment, 10 consecutive times.
Q>275+5°C/2C 10pF:Q > 200+10C
C: Nominal Capacitance (puff)
Appearance: No marking defects
Capacitance Change Within ±3% or
±0.3pF (Whichever is larger)
C30pFmin.:
>Q 350
10pFC 30pF: Q > 275+5C/2C
High Temperature Load
Apply 200% (500V only 150%) of the rated voltage
for 1000±12 hours at the maximum operating
temperature ±3°C.
10pF: Q > 200+10C
C: Nominal Capacitance (pF)
Table A-1
Char.
Nominal Values
(ppm/°C) Note
5C
0 ± 30
Max .
– 55C
0.58
Capacitance Change from 25°C(%)
−30C
Max.
Min.
Min.
-0.24
0.4C
-0.17
Max.
0.25
—10C
Min.
-0.11
ERB Series
Note: Nominal values denote the temperature coefficient within a range of 25°C to 125°C.
C-29-C
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Innovator in Electronics – 53
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High CERAMIC
Frequency Ceramic
Capacitors Technical Data (Typical)
HIQ CAPACITOR
ERB Technical Data (Typical)
High Frequency Type ERB Series
Capacitance - Temperature Characteristics
C0G Characteristics (ERB)
2.0
CAPACITANCE CHANGE (%)
1.5
1.0
0.5
Spec. (upper)
0.0
Spec. (lower)
-0.5
-1.0
-1.5
-75
-50
-25
0
25
50
75
100
125
150
TEMPERATURE (°C)
Self Resonant Frequency - Capacitance
Resonant Frequency Characteristics
ERB Series
Measurement
Equipment
HP8753D
10G
RESONANT FREQUENCY (Hz)
ERB Series
-2.0
1G
100M
1
10
100
CAPACITANCE (pF)
54 – Innovator in Electronics
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C-29-C
9
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
CERAMIC HIQ CAPACITOR Technical Data (Typical)
ERB Technical Data (Typical)
ERB ESR
Frequency
Characteristics
ESR - - Frequency
Characteristics
ERB18 Series
10
1pF
10pF
Measurement
Equipment
Boontoon Resonant
Coaxial Line 34A
100pF
ESR (ohm)
1
0 .1
0 .0 1
100M
1 01 00 0G0 M
1 0 010GM
F R E Q U E N C Y (H z )
ERB21 Series
ERB Series
10
1pF
10pF
100pF
ESR (ohm)
1
0 .1
0 .0 1
100M
1 01 00 0G0 M
10
GM
100
F R E Q U E N C Y (H z )
ERB32 Series
10
3 .3 p F
10pF
100pF
ESR (ohm)
1
0 .1
0 .0 1
100M
1 0 010GM
1 01 00 0G0 M
F R E Q U E N C Y (H z )
C-29-C
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Innovator in Electronics – 55
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Technical
Data (Typical)
CERAMIC
HIQ CAPACITOR Technical Data (Typical)
QQ- -Frequency
FrequencyCharacteristics
Characteristics
ERB18 Series
10000
Measurement
Equipment
Boonton Resonant
Coaxial-Line 34A
1pF
10pF
100pF
1000
Q
100
10
1
100M
1G
10G
FREQUENCY (Hz)
ERB21 Series
1pF
10pF
100pF
1000
Q
100
10
1
100M
1G
10G
FREQUENCY (Hz)
ERB32 Series
10000
3.3pF
10pF
100pF
1000
Q
ERB Series
10000
100
10
1
100M
1G
10G
FREQUENCY (Hz)
56 – Innovator in Electronics
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
CERAMIC HIQ CAPACITOR Technical Data (Typical)
ERB Technical Data (Typical)
ERB Temperature Rise - Current Characteristics
Temperature Rise - Current Characteristics
ERB18 Series (1GHz)
60
50
TEMP. RISE (°C)
40
2.4pF
10pF
82pF
30
20
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
ERB Series
10
0.8
CURRENT (Arms)
ERB21Series
Series (1GHz)
ERB21
(1GHz)
60
50
Temp.RISE
Rise ((°C)
)
TEMP.
40
2.4pF
10pF
82pF
30
20
10
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CURRENT (Arms)
CURRENT (Arms)
12
C-29-C
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Innovator in Electronics – 57
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
itís specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note ï This
!Note
C02E.pdf
07.2.6
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ERB Soldering and Mounting
!Caution
■ !Caution (Soldering and Mounting)
1. Mounting Position
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
Component Direction
Locate chip
horizontal to the
direction in
which stress
acts
Chip Mounting Close to Board Separation Point
Perforation
C
Chip arrangement
Worst A-C-(B~D) Best
B
D
A
Slit
2. Chip Placing
ERB Series
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction nozzle's bottom dead point must be
set on the upper surface of the board. Nozzle pressure
for chip mounting must be a 1 to 3N static load.
Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
Incorrect
Suction Nozzle
Deflection
Board
Correct
Board Guide
13
Support Pin
Continued on the following page.
83
58 – Innovator in Electronics
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
is downloaded
from the
website (for
of Murata
Manufacturing
co., ltd.
Therefore,
it’s specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
CAUTION
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
Note • This PDF
Notecatalog
C02E.pdf
07.2.6
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ERBCaution
Soldering and Mounting
Continued from the preceding page.
3. Reflow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in Table 1. It is required to
keep temperature differential between the soldering and
the components surface ($T) as small as possible.
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile where
peak solder temperature is below the Tin melting point is
used. Please confirm the solderability of Tin plating
termination chip before use.
When components are immersed in solvent after mounting,
be sure to maintain the temperature difference ($T)
between the component and solvent within the range
shown in the Table 1.
Standard Conditions for Reflow Soldering
Infrared Reflow
Temperature (%)
Gradual
Cooling
200oC
170oC
150oC
130oC
$T
Preheating
60-120 seconds 30-60 seconds
Time
Vapor Reflow
Temperature (%)
Soldering
Peak Temperature
Temperature Differential
Gradual
Cooling
$T
Preheating
GRM02/03/15/18/21/31
GJM03/15
ERB18/21
LLL15/18/21/31
$T-190%
60-120 seconds
ERB18/21
Time
20 seconds max.
GQM18/21
GRM32/43/55
Allowable Soldering Temperature and Time
13
ERB32
LLM21/31
Soldering Temperature (%)
LLA18/21/31
$T-130%
GNM
ERB32
Recommended Conditions
Pb-Sn Solder
Infrared Reflow Vapor Reflow
Lead Free Solder
Peak Temperature
230-250oC
230-240oC
240-260oC
Atmosphere
Air
Air
Air or N2
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time (sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive fillet height solder.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
cracked chips.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
Optimum Solder Amount for Reflow Soldering
0.2mm min.
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Continued on the following page.
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Innovator in Electronics – 59
ERB Series
170oC
150oC
130oC
Table 1
Part Number
Soldering
Peak Temperature
Continued from the preceding page.
4. Leaded
A
p p lComponent
i c atInsertion
i o n S p e c i f i c Ca pa c i t o rs
If the PCB is flexed when leaded components (such as
High
Frequency
Ceramic
Capacitors
transformers
and ICs) are being
mounted, chips
may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
ERB Soldering and Mounting
5. Flow Soldering
When sudden heat is applied to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity inside components. And an excessively long
soldering time or high soldering temperature results in
leaching of the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage in the
components, preheating shoud be required for the both
components and the PCB board. Preheating conditions
are shown in Table 2. It is required to keep temperature
differential between the soldering and the components
surface ($T) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
Standard Conditions for Flow Soldering
Temperature (%)
Preheating
60-120 seconds
Time
5 seconds max.
Soldering Temperature (%)
Allowable Soldering Temperature and Time
280
270
260
250
240
230
220
0
10
20
ERB Series
GRM18/21/31
13
30
40
Soldering Time (sec.)
Temperature Differential
LLL21/31
ERB18/21
ERB18/21
Gradual
Cooling
$T
170oC
150oC
130oC
Table 2
Part Number
Soldering
Peak Temperature
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
$T-150%
GQM18/21
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Peak Temperature
240-250oC
250-260oC
Atmosphere
Air
N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Optimum Solder Amount for Flow Soldering
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
Up to Chip Thickness
Adhesive
Continued on the following page.
85
60 – Innovator in Electronics
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
itís specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note ï This
!Note
C02E.pdf
07.2.6
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ERB Soldering and Mounting
!Caution
PDF catalog
is downloaded
from!CAUTION
the website (for
of Murata
Manufacturing
co., ltd.
Therefore,
itís specifications
areinsubject
to change
or oursmoking
productsand/or
in it may
be discontinued
without advance notice. Please check with our
• Please
read rating and
storage,
operating, rating,
soldering,
mounting
and handling)
this catalog
to prevent
burning,
etc.
!Note ï This
!Note
C02E.pdf
07.2.6
sales representatives
or product
engineers
before ordering.
• This catalog
has only
typical specifications
because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
6.!Caution
Correction with a Soldering Iron
(1) For Chip Type Capacitors
When sudden heat is applied to the components by
6. soldering
Correction
with
Soldering
Iron of the
iron,
the a
mechanical
strength
(1)components
For Chip Type
Capacitors
should
go down because remarkable
When
suddenchange
heat iscauses
applieddeformity
to the components
by
temperature
inside components.
soldering
the mechanical
In order toiron,
prevent
mechanical strength
damage of
in the
the
components
go down
because
remarkable
components,should
preheating
should
be required
for both of
temperature
change
inside components.
the components
and causes
the PCBdeformity
board. Preheating
In
order to are
prevent
mechanical
damage
in the to keep
conditions
shown
in Table 3.
It is required
components,
preheatingbetween
should be
forand
boththe
of
temperature differential
therequired
soldering
the
components
and (∆T)
the PCB
board.
components
surface
as small
asPreheating
possible. After
conditions
shown
in Table
2. Ititisdown
required
to keep
soldering, itare
is not
allowed
to cool
rapidly.
temperature differential between the soldering and the
components surface (∆T) as small as possible. After
soldering, it is not allowed to cool it down rapidly.
Table 3
Part Number
Temperature
Differential
Peak
Temperature
Atmosphere
Temperature
Differential
∆TV190D
Peak
300°C
max.
3Temperature
seconds max.
/ termination
Atmosphere
Air
Table
2
GRM15/18/21/31
GJM15
Part Number
ERB18/21
LLL15/18/21/31
GRM15/18/21/31
GQM18/21
GJM15
ERB18/21
LLL15/18/21/31
GRM32/43/55
∆TV190D
GQM18/21
GNM
ERB18/21
ERB32
LLA18/21/31
∆TV130D
GRM32/43/55
LLM21/31
300°C max.
3 seconds max.
/ termination
270°C max.
3 seconds max.
/ termination
Air
Air
GNM
ERB32
270°C max.
LLA18/21/31
∆TV130D
3 seconds max.
*Applicable for both Pb-Sn and
Lead Free Solder.
/ termination
Pb-Sn
Solder: Sn-37Pb
LLM21/31
Air
Lead Free Solder: Sn-3.0Ag-0.5Cu
ERB32
13
Up to Chip Thickness
Up to Chip Thickness
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
86
C-29-C
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Innovator in Electronics – 61
ERB Series
13
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Optimum Solder Amount when Corrections Are Made
Using a Soldering lron
The top of the solder fillet should be lower than the
Optimum
Amount when
AreisMade
thickness Solder
of components.
If theCorrections
solder amount
Using
a Soldering
lron
excessively
big, the
risk of cracking is higher during
The
top
of the solder
fillet
should
lower than
the
board
bending
or under
any
otherbe
stressful
conditions.
thickness
components.
If the solder
is
Soldering of
iron
ø3mm or smaller
shouldamount
be required.
And
excessively
big,tothe
riska of
cracking
is higher
during
it is necessary
keep
distance
between
the
soldering
board
bending
or under any
otherdirect
stressful
conditions.
iron and
the components
without
touch.
Thread
Soldering
ø3mmororsmaller
smallerisshould
be for
required.
And
required
soldering.
solder withiron
ø0.5mm
it is necessary to keep a distance between the soldering
iron and the components without direct touch. Thread
with ø0.5mm or smaller is required for soldering.
7. solder
Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
7. broken
Washing
solder. Take note not to vibrate PCBs.
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken TO
solder.
Take note
to vibrate
PCBs. MAY
FAILURE
FOLLOW
THEnot
ABOVE
CAUTIONS
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
DESIGN
ENGINEERING
ERB Design
EngineeringKITS
Kits
CERAMIC CHIP CAPACITORS
ASCAP Hi-Frequency
N Miniature sizes & stable C0G temperature coefficient
N Very high Q at high frequencies
N 0603, 0805 and 1210 sizes
N Low Power Consumption for Mobile Telecommunication
N Base Station, Terminal applications, Wireless equipment and
High frequency radio
N Miniature sizes & stable C0G temperature coefficient
N Very high Q at high frequencies
N 0603, 0805 and 1210 sizes
N Low Power Consumption for Mobile Telecommunication
N Base Station, Terminal applications, Wireless equipment and
High frequency radio
ERB18-HIQ0603KIT-E 0603 - (250 VDC)
ERB21-HIQ0805KIT-E 0805 - (250VDC)
ERB Series
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Description
0603/COG/1.0pF/250V
0603/COG/1.1pF/250V
0603/COG/1.2pF/250V
0603/COG/1.3pF/250V
0603/COG/1.5pF/250V
0603/COG/1.6pF/250V
0603/COG/1.8pF/250V
0603/COG/2.0pF/250V
0603/COG/2.4pF/250V
0603/COG/2.7pF/250V
0603/COG/3.0pF/250V
0603/COG/3.3pF/250V
0603/COG/3.6pF/250V
0603/COG/3.9pF/250V
0603/COG/4.3pF/250V
0603/COG/4.7pF/250V
0603/COG/5.1pF/250V
0603/COG/5.6pF/250V
0603/COG/6.2pF/250V
0603/COG/6.8pF/250V
0603/COG/7.5pF/250V
0603/COG/8.2pF/250V
0603/COG/9.1pF/250V
0603/COG/10pF/250V
0603/COG/12pF/250V
0603/COG/15pF/250V
0603/COG/18pF/250V
0603/COG/22pF/250V
0603/COG/27pF/250V
0603/COG/33pF/250V
0603/COG/39pF/250V
0603/COG/47pF/250V
0603/COG/56pF/250V
0603/COG/68pF/250V
0603/COG/82pF/250V
0603/COG/100pF/250V
62 – Innovator in Electronics
Murata Global P/N
ERB1885C2E1R0BDX1
ERB1885C2E1R1BDX1
ERB1885C2E1R2BDX1
ERB1885C2E1R3BDX1
ERB1885C2E1R5BDX1
ERB1885C2E1R6BDX1
ERB1885C2E1R8BDX1
ERB1885C2E2R0BDX1
ERB1885C2E2R4BDX1
ERB1885C2E2R7BDX1
ERB1885C2E3R0CDX1
ERB1885C2E3R3CDX1
ERB1885C2E3R6CDX1
ERB1885C2E3R9CDX1
ERB1885C2E4R3CDX1
ERB1885C2E4R7CDX1
ERB1885C2E5R1CDX1
ERB1885C2E5R6CDX1
ERB1885C2E6R2CDX1
ERB1885C2E6R8CDX1
ERB1885C2E7R5CDX5
ERB1885C2E8R2CDX5
ERB1885C2E9R1CDX5
ERB1885C2E100JDX5
ERB1885C2E120JDX5
ERB1885C2E150JDX5
ERB1885C2E180JDX5
ERB1885C2E220JDX5
ERB1885C2E270JDX5
ERB 1885C2E330JDX5
ERB1885C2E390JDX5
ERB1885C2E470JDX5
ERB1885C2E560JDX5
ERB1885C2E680JDX5
ERB1885C2E820JDX5
ERB1885C2E101JDX5
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No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Description
0805/COG/1.2pF/250V
0805/COG/1.5pF/250V
0805/COG/1.8pF/250V
0805/COG/2.2pF/250V
0805/COG/2.7pF/250V
0805/COG/3.3pF/250V
0805/COG/3.9pF/250V
0805/COG/4.7pF/250V
0805/COG/5.6pF/250V
0805/COG/6.8pF/250V
0805/COG/8.2pF/250V
0805/COG/10pF/250V
0805/COG/12pF/250V
0805/COG/15pF/250V
0805/COG/18pF/250V
0805/COG/22pF/250V
0805/COG/27pF/250V
0805/COG/33pF/250V
0805/COG/39pF/250V
0805/COG/47pF/250V
0805/COG/56pF/250V
0805/COG/68pF/250V
0805/COG/82pF/250V
0805/COG/100pF/250V
Murata Global P/N
ERB21 B5C2E1R2CDX1
ERB21 B5C2E1R5CDX1
ERB21 B5C2E1R8CDX1
ERB21B5C2E2R2CDX1
ERB21B5C2E2R7CDX1
ERB21B5C2E3R3CDX1
ERB21B5C2E3R9CDX1
ERB21B5C2E4R7CDX1
ERB21B5C2E5R6DDX1
ERB21B5C2E6R8DDX1
ERB82185C2E8R2DDX1
ERB21B5C2E100JDX1
ERB21B5C2E120JDX1
ERB21B5C2E150JDX1
ERB21B5C2E180JDX1
ERB21B5C2E220JDX1
ERB21B5C2E270JDX1
ERB21B5C2E330JDX1
ERB21B5C2E390JDX1
ERB21B5C2E470JDX1
ERB21B5C2E560JDX1
ERB21B5C2E680JDX1
ERB21B5C2E820JDX1
ERB21B5C2E101JDX1
Qty.
10
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10
10
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10
ERB32-HIQ1210KIT-E 1210 - (500VDC)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
.
m
u
Description
1210/C0G/3.3pF/500V
1210/C0G/3.9pF/500V
1210/C0G/4.7pF/500V
1210/C0G/5.6pF/500V
1210/C0G/6.8pF/500V
1210/C0G/8.2pF/500V
1210/C0G/10pF/500V
1210/C0G/12pF/500V
1210/C0G/15pF/500V
1210/C0G/18pF/500V
1210/C0G/22pF/500V
1210/C0G/27pF/500V
1210/C0G/33pF/500V
1210/C0G/39pF/500V
1210/C0G/47pF/500V
1210/C0G/56pF/500V
1210/C0G/68pF/500V
1210/C0G/82pF/500V
1210/C0G/100pF/500V
r
a
t
a
.
c
Murata Global P/N
ERB32Q5C2H3R3CDX1
ERB32Q5C2H3R9CDX1
ERB32Q5C2H4R7CDX1
ERB32Q5C2H5R6DDX1
ERB32Q5C2H6R8DDX1
ERB32Q5C2H8R2DDX1
ERB32Q5C2H100JDX1
ERB32Q5C2H120JDX1
ERB32Q5C2H150JDX1
ERB32Q5C2H180JDX1
ERB32Q5C2H220JDX1
ERB32Q5C2H270JDX1
ERB32Q5C2H330JDX1
ERB32Q5C2H390JDX1
ERB32Q5C2H470JDX1
ERB32Q5C2H560JDX1
ERB32Q5C2H680JDX1
ERB32Q5C2H820JDX1
ERB32Q5C2H101JDX1
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Qty.
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C-29-C
A p p l i c at i o n S p e c i f i c Ca pa c i t o rs
High Frequency Ceramic Capacitors
ERB Series
ERB Notes
C-29-C
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Innovator in Electronics – 63
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