FCX558 400V PNP HIGH VOLTAGE TRANSISTOR IN SOT89 Features Mechanical Data BVCEO > -400V IC = -200mA High Continuous Current ICM = -500mA Peak Pulse Current Excellent hFE Characteristics up to -100mA Low Saturation Voltage VCE(sat) < -200mV @ -20mA Case: SOT89 Case Material: Molded Plastic. “Green” Molding Compound. Complementary NPN Type: FCX458 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads, Weight: 0.05 grams (Approximate) Solderable per MIL-STD-202, Method 208 SOT89 C E B C C B E Top View Device Symbol Top View Pin Out Ordering Information (Note 4) Product FCX558TA Notes: Compliance AEC-Q101 Marking P58 Reel Size (inches) 7 Tape Width (mm) 12 Quantity per Reel 1,000 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html. Marking Information P58 FCX558 Datasheet Number: DS33059 Rev. 7 - 2 P58 = Product Type Marking Code 1 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Pulse Current Symbol VCBO VCEO VEBO IC ICM Limit -400 -400 -7 -200 -500 Unit V V V mA mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol (Note 5) (Note 6) (Note 7) (Note 8) (Note 5) (Note 6) (Note 7) (Note 8) Power Dissipation Thermal Resistance, Junction to Ambient Air Thermal Resistance, Junction to Lead Value 0.7 1 1.5 2 178 125 83 60 PD RθJA (Note 9) Operating and Storage Temperature Range Unit W °C/W RθJL 22 TJ, TSTG -65 to +150 °C ESD Ratings (Note 10) Characteristic Electrostatic Discharge - Human Body Model Electrostatic Discharge - Machine Model Notes: Symbol Value Unit JEDEC Class ESD HBM ESD MM 4,000 400 V V 3A C 5. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper. 7. Same as Note 5, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 140.0 3 120.0 100.0 80.0 1oz copper 60.0 Maximum Power (W) Thermal Resistance (°C/W) Thermal Characteristics and Derating Information 2oz copper 40.0 0 500 1000 1500 2oz copper 2 1oz copper 1 0 2000 2500 Copper Area (sqmm) FCX558 Datasheet Number: DS33059 Rev. 7 - 2 T A=25°C 0 500 1000 1500 2000 2500 Copper Area (sqmm) 2 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 15mm x 15mm 1oz FR4 PCB 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 140 160 Max Power Dissipation (W) 1.2 1.0 MRP 1oz FR4 PCB 0.8 0.6 0.4 0.2 0.0 0 40 60 80 100 120 140 160 Temperature (°C) Derating Curve Derating Curve 130 120 15mm x 15mm 1oz FR4 PCB 110 100 90 80 70 D=0.5 60 50 40 D=0.2 Single Pulse 30 D=0.05 20 10 D=0.1 0 100µ 1m 10m 100m 1 10 100 1k 100 15mm x 15mm 1oz FR4 PCB Single Pulse T A=25°C 10 1 100µ 1m Pulse Width (s) 10m 100m 1 1k 100 160 MRP 1oz FR4 PCB Maximum Power (W) MRP 1oz FR4 PCB 140 120 100 D=0.5 80 40 100 Pulse Power Dissipation 180 60 10 Pulse Width (s) Transient Thermal Impedance Thermal Resistance (°C/W) 20 Temperature (°C) Maximum Power (W) Thermal Resistance (°C/W) Max Power Dissipation (W) Thermal Characteristics and Derating Information (cont.) Single Pulse D=0.2 D=0.05 20 0 100µ D=0.1 1m 10m 100m 1 10 100 Pulse Width (s) 1k Single Pulse T A=25°C 10 1 100µ 10m 100m 1 10 100 1k Pulse Width (s) Transient Thermal Impedance FCX558 Datasheet Number: DS33059 Rev. 7 - 2 1m Pulse Power Dissipation 3 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 11) Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current Emitter Cutoff Current DC Current Transfer Static Ratio (Note 11) Symbol BVCBO BVCEO BVCES BVEBO ICBO ICES IEBO Min -400 -400 -400 -7 - Typ. -540 -510 -540 -8.2 <-1 <-1 <-1 Max -100 -100 -20 hFE 100 100 15 - 300 - - - Unit V V V V nA nA nA - Collector-Emitter Saturation Voltage (Note 11) VCE(sat) Base-Emitter Saturation Voltage (Note 11) Base-Emitter Turn-on Voltage (Note 11) VBE(sat) VBE(on) - - -0.2 -0.5 -0.9 -0.9 fT 50 - - MHz Cobo ton toff - 95 1,600 5 pF - nS Transitional Frequency Output Capacitance Switching Times Note: - V V V Test Condition IC = -100µA IC = -1mA IC = -100µA IE = -100µA VCB = -320V VCE = -320V VEB = -6V IC = -1mA, VCE = -10V IC = -50mA, VCE = -10V IC = -100mA, VCE = -10V IC = -20mA, IB = -2mA IC = -50mA, IB = -6mA IC = -50mA, IB = -5mA IC = -50mA, VCE = -10V IE = -10mA, VCE = -20V f = 20MHz VCB = -20V, f = 1MHz, IC = -50mA, VC = -100V IB1 = -5mA, IB2 = -10mA 11. Measured under pulsed conditions. Pulse width ≤ 300μs. Duty cycle ≤ 2%. FCX558 Datasheet Number: DS33059 Rev. 7 - 2 4 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.) FCX558 Datasheet Number: DS33059 Rev. 7 - 2 5 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. D1 0 .20 R0 c SOT89 Dim Min Max Typ A 1.40 1.60 1.50 B 0.50 0.62 0.56 B1 0.42 0.54 0.48 c 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.62 1.83 1.733 D2 1.61 1.81 1.71 E 2.40 2.60 2.50 E2 2.05 2.35 2.20 e 1.50 H 3.95 4.25 4.10 H1 2.63 2.93 2.78 L 0.90 1.20 1.05 L1 0.327 0.527 0.427 z 0.20 0.40 0.30 All Dimensions in mm H E B1 L B e D2 8° (4 X) H1 E2 A L1 D z Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. X2 Dimensions Y3 Y1 Y4 X Y C G X X1 X2 Y Y1 Y2 Y3 Y4 G Y2 X1 Value (in mm) 1.500 0.244 0.580 0.760 1.933 1.730 3.030 1.500 0.770 4.530 C Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between device terminals and PCB tracking. FCX558 Datasheet Number: DS33059 Rev. 7 - 2 6 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2017, Diodes Incorporated www.diodes.com FCX558 Datasheet Number: DS33059 Rev. 7 - 2 7 of 7 www.diodes.com April 2017 © Diodes Incorporated