PHILIPS BT300X-800R Thyristor Datasheet

Philips Semiconductors
Product specification
Thyristors
GENERAL DESCRIPTION
Glass passivated thyristors in a full
pack, plastic envelope, intended for
use in applications requiring high
bidirectional
blocking
voltage
capability and high thermal cycling
performance. Typical applications
include motor control, industrial and
domestic lighting, heating and static
switching.
PINNING - SOT186A
PIN
BT300X series
QUICK REFERENCE DATA
SYMBOL
VDRM,
VRRM
IT(AV)
IT(RMS)
ITSM
PARAMETER
MAX. MAX. MAX. UNIT
BT300XRepetitive peak off-state
voltages
Average on-state current
RMS on-state current
Non-repetitive peak on-state
current
500R
500
600R
600
800R
800
V
5
8
65
5
8
65
5
8
65
A
A
A
PIN CONFIGURATION
SYMBOL
DESCRIPTION
case
1
cathode
2
anode
3
gate
a
k
g
1 2 3
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VDRM, VRRM Repetitive peak off-state
voltages
IT(AV)
IT(RMS)
ITSM
I2t
dIT/dt
IGM
VGM
VRGM
PGM
PG(AV)
Tstg
Tj
Average on-state current
RMS on-state current
Non-repetitive peak
on-state current
half sine wave; Ths ≤ 79 ˚C
all conduction angles
half sine wave; Tj = 25 ˚C prior to
surge
t = 10 ms
t = 8.3 ms
t = 10 ms
ITM = 10 A; IG = 50 mA;
dIG/dt = 50 mA/µs
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
Peak gate current
Peak gate voltage
Peak reverse gate voltage
Peak gate power
Average gate power
over any 20 ms period
Storage temperature
Operating junction
temperature
MIN.
MAX.
UNIT
-
-500R -600R -800R
5001
6001
800
V
-
5
8
A
A
-
65
71
21
50
A
A
A2s
A/µs
-40
-
2
5
5
5
0.5
150
125
A
V
V
W
W
˚C
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
September 1997
1
Rev 1.100
Philips Semiconductors
Product specification
Thyristors
BT300X series
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
Visol
R.M.S. isolation voltage from all
three terminals to external
heatsink
f = 50-60 Hz; sinusoidal
waveform;
R.H. ≤ 65% ; clean and dustfree
Cisol
Capacitance from T2 to external f = 1 MHz
heatsink
MIN.
TYP.
-
MAX.
UNIT
2500
V
-
10
-
pF
MIN.
TYP.
MAX.
UNIT
-
55
5.7
9.3
-
K/W
K/W
K/W
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
Rth j-hs
Thermal resistance
junction to heatsink
Thermal resistance
junction to ambient
with heatsink compound
without heat sink compound
in free air
Rth j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IGT
IL
IH
VT
VGT
Gate trigger current
Latching current
Holding current
On-state voltage
Gate trigger voltage
ID, IR
Off-state leakage current
VD = 12 V; IT = 0.1 A
VD = 12 V; IGT = 0.1 A
VD = 12 V; IGT = 0.1 A
IT = 12 A
VD = 12 V; IT = 0.1 A
VD = VDRM(max); IT = 0.1 A; Tj = 125 ˚C
VD = VDRM(max); VR = VRRM(max); Tj = 125 ˚C
0.25
-
2
10
10
1.35
0.6
0.4
0.1
15
40
20
1.6
1.5
0.5
mA
mA
mA
V
V
V
mA
MIN.
TYP.
MAX.
UNIT
50
200
-
100
1000
2
-
V/µs
V/µs
µs
-
70
-
µs
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
dVD/dt
Critical rate of rise of
off-state voltage
VDM = 67% VDRM(max); Tj = 125 ˚C;
exponential waveform.
Gate open circuit
RGK = 100 Ω
ITM = 10 A; VD = VDRM(max); IG = 0.1 A;
dIG/dt = 5 A/µs
VD = 67% VDRM(max); Tj = 125 ˚C;
ITM = 12 A; VR = 25 V; dITM/dt = 30 A/µs;
dVD/dt = 50 V/µs; RGK = 100 Ω
tgt
tq
Gate controlled turn-on
time
Circuit commutated
turn-off time
September 1997
2
Rev 1.100
Philips Semiconductors
Product specification
Thyristors
BT300X series
BT300X
Ptot / W
conduction form
angle
factor
degrees
a
30
4
60
2.8
90
2.2
120
1.9
180
1.57
8
6
Tmb(max) / C
a = 1.57
BT300
ITSM
IT
60
79
1.9
ITSM / A
70
time
T
50
2.2
Tj initial = 25 C max
90.5
2.8
40
4
4
102
2
113.5
30
20
10
0
0
1
2
3
IF(AV) / A
4
5
6
125
0
Fig.1. Maximum on-state dissipation, Ptot, versus
average on-state current, IT(AV), where
a = form factor = IT(RMS)/ IT(AV).
1000
1
1000
Fig.4. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
BT300
ITSM / A
10
100
Number of half cycles at 50Hz
24
BT150
IT(RMS) / A
20
16
dI T /dt limit
100
12
I TSM
IT
8
time
T
4
Tj initial = 25 C max
10
10us
100us
0
0.01
10ms
1ms
0.1
1
surge duration / s
T/s
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 10ms.
9
IT(RMS) / A
10
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Ths ≤ 79˚C.
BT258
1.6
79 C
VGT(Tj)
VGT(25 C)
BT151
8
1.4
7
6
1.2
5
4
1
3
0.8
2
0.6
1
0
-50
0
50
Tmb / C
100
0.4
-50
150
Fig.3. Maximum permissible rms current IT(RMS) ,
versus mounting base temperature Ths.
September 1997
0
50
Tj / C
100
150
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
3
Rev 1.100
Philips Semiconductors
Product specification
Thyristors
3
BT300X series
IGT(Tj)
IGT(25 C)
BT150
BT300
IT / A
30
Tj = 125 C
Tj = 25 C
25
2.5
Vo = 1.21 V
Rs = 0.0313 ohms
2
20
1.5
15
1
10
0.5
5
typ
max
0
-50
0
50
Tj / C
100
0
150
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
3
IL(Tj)
IL(25 C)
0
0.5
1
VT / V
1.5
2
Fig.10. Typical and maximum on-state characteristic.
10
BT150
BT150
Zth j-mb (K/W)
without heatsink compound
2.5
with heatsink compound
1
2
1.5
0.1
1
P
D
tp
0.5
t
0
-50
0
50
Tj / C
100
0.01
10us
150
IH(Tj)
IH(25 C)
1ms
10ms
0.1s
1s
10s
tp / s
Fig.11. Transient thermal impedance Zth j-hs, versus
pulse width tp.
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
3
0.1ms
10000
BT150
dVD/dt (V/us)
2.5
1000
2
RGK = 100 Ohms
1.5
100
1
gate open circuit
0.5
0
-50
0
50
Tj / C
100
10
150
50
100
150
Tj / C
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
September 1997
0
4
Rev 1.100
Philips Semiconductors
Product specification
Thyristors
BT300X series
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
10.3
max
4.6
max
3.2
3.0
2.9 max
2.8
Recesses (2x)
2.5
0.8 max. depth
6.4
15.8
19
max. max.
15.8
max
seating
plane
3 max.
not tinned
3
2.5
13.5
min.
1
0.4
2
3
M
1.0 (2x)
0.6
2.54
0.9
0.7
0.5
2.5
5.08
1.3
Fig.13. SOT186A; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
September 1997
5
Rev 1.100
Philips Semiconductors
Product specification
Thyristors
BT300X series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1997
6
Rev 1.100
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