TOSHIBA TC74HCT574AP

TC74HCT574AP/AF
TOSHIBA CMOS Digital Integrated Circuit
Silicon Monolithic
TC74HCT574AP,TC74HCT574AF
Octal D-Type Flip-Flop with 3-State Output
The TC74HCT574A is a high speed CMOS OCTAL FLIP-FLOP
with 3-STATE OUTPUT fabricated with silicon gate C2MOS
technology.
It achieves the high speed operation similar to equivalent
LSTTL while maintaining the CMOS low power dissipation.
Its inputs are compatible with TTL, NMOS, and CMOS output
voltage levels.
Its 8-bit D-type flip-flops is controlled by a clock input (CK)
and an output enable input ( OE ).
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
TC74HCT574AP
TC74HCT574AF
Features
•
High speed: fmax = 62 MHz (typ.) at VCC = 5 V
•
Low power dissipation: ICC = 4 μA (max) at Ta = 25°C
•
Compatible with TTL outputs: VIL = 0.8 V (min)
VIH = 2.0 V (max)
•
Output drive capability: 15 LSTTL loads
•
•
Symmetrical output impedance: |IOH| = IOL = 6 mA (min)
∼ tpHL
Balanced propagation delays: tpLH −
•
Pin and function compatible with 74LS574
Weight
DIP20-P-300-2.54A
SOP20-P-300-1.27A
: 1.30 g (typ.)
: 0.22 g (typ.)
Pin Assignment
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TC74HCT574AP/AF
IEC Logic Symbol
Truth Table
Inputs
Output
OE
CK
D
Q
H
X
X
Z
L
X
Qn
L
L
L
L
H
H
X: Don’t care
Z: High impedance
Qn: No change
System Diagram
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TC74HCT574AP/AF
Absolute Maximum Ratings (Note 1)
Characteristics
Supply voltage range
Symbol
Rating
Unit
VCC
−0.5~7
V
VIN
−0.5~VCC + 0.5
V
VOUT
−0.5~VCC + 0.5
V
Input diode current
IIK
±20
mA
Output diode current
IOK
±20
mA
DC output current
IOUT
±35
mA
DC VCC/ground current
ICC
±75
mA
Power dissipation
PD
500 (DIP) (Note 2)/180 (SOP)
mW
Storage temperature
Tstg
−65~150
°C
DC input voltage
DC output voltage
Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or
even destruction.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be
applied until 300 mW.
Operating Ranges (Note)
Characteristics
Supply voltage
Input voltage
Symbol
Rating
Unit
VCC
4.5~5.5
V
VIN
0~VCC
V
VOUT
0~VCC
V
Operating temperature
Topr
−40~85
°C
Input rise and fall time
tr, tf
0~500
ns
Output voltage
Note:
The operating ranges must be maintained to ensure the normal operation of the device.
Unused inputs must be tied to either VCC or GND.
Electrical Characteristics
DC Characteristics
Characteristics
Symbol
Ta = 25°C
Test Condition
Ta = −40~85°C
VCC (V)
Min
Typ.
Max
Min
Max
Unit
High-level input
voltage
VIH
⎯
4.5~5.5
2.0
⎯
⎯
2.0
⎯
V
Low-level input
voltage
VIL
⎯
4.5~5.5
⎯
⎯
0.8
⎯
0.8
V
High-level output
voltage
VOH
IOH = −20 μA
VIN
= VIH or VIL I
OH = −6 mA
4.5
4.4
4.5
⎯
4.4
⎯
4.5
4.18
4.31
⎯
4.13
⎯
Low-level output
voltage
VOL
IOL = 20 μA
VIN
= VIH or VIL I = 6 mA
OL
4.5
⎯
0.0
0.1
⎯
0.1
4.5
⎯
0.17
0.26
⎯
0.33
3-state output
off-state current
IOZ
VIN = VIH or VIL
VOUT = VCC or GND
5.5
⎯
⎯
±0.5
⎯
±5.0
μA
Input leakage
current
IIN
VIN = VCC or GND
5.5
⎯
⎯
±0.1
⎯
±1.0
μA
ICC
VIN = VCC or GND
5.5
⎯
⎯
4.0
⎯
40.0
μA
Per input: VIN = 0.5 V or 2.4 V
Other input: VCC or GND
5.5
⎯
⎯
2.0
⎯
2.9
mA
Quiescent supply
current
IC
3
V
V
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TC74HCT574AP/AF
Timing Requirements (input: tr = tf = 6 ns)
Characteristics
Symbol
Minimum pulse width
tW (H)
(CK)
tW (L)
Minimum set-up time
(Dn)
Minimum hold time
(Dn)
Clock frequency
Ta = 25°C
Test Condition
⎯
ts
⎯
th
⎯
f
⎯
Ta =
−40
~85°C
VCC (V)
Typ.
Limit
Limit
4.5
⎯
15
19
5.5
⎯
14
17
4.5
⎯
15
19
5.5
⎯
14
17
4.5
⎯
0
0
5.5
⎯
0
0
4.5
⎯
31
25
5.5
⎯
34
27
Unit
ns
ns
ns
MHz
AC Characteristics (input: tr = tf = 6 ns)
Characteristics
Output transition time
(CK-Q)
tpHL
Output disable time
⎯
tTHL
tpLH
Output enable time
CL (pF) VCC (V)
tTLH
Propagation delay
time
tpZL
tpZH
tpLZ
tpHZ
Ta = 25°C
Test Condition
Symbol
50
50
⎯
150
50
RL = 1 kΩ
150
RL = 1 kΩ
50
⎯
50
Ta = −40~85°C
Min
Typ.
Max
Min
Max
4.5
⎯
7
12
⎯
15
5.5
⎯
6
11
⎯
14
4.5
⎯
19
30
⎯
38
5.5
⎯
16
27
⎯
34
4.5
⎯
24
40
⎯
48
5.5
⎯
21
35
⎯
44
4.5
⎯
19
30
⎯
38
5.5
⎯
16
27
⎯
34
4.5
⎯
24
40
⎯
48
5.5
⎯
21
35
⎯
44
4.5
⎯
19
30
⎯
38
5.5
⎯
16
27
⎯
34
4.5
31
50
⎯
25
⎯
5.5
34
60
⎯
27
⎯
Unit
ns
ns
ns
ns
Maximum clock
frequency
fmax
Input capacitance
CIN
⎯
⎯
5
10
⎯
10
pF
COUT
⎯
⎯
10
⎯
⎯
⎯
pF
⎯
⎯
62
⎯
⎯
⎯
pF
Output capacitance
Power dissipation
capacitance
Note:
CPD
(Note)
MHz
CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating
current consumption without load.
Average operating current can be obtained by the equation:
ICC (opr) = CPD・VCC・fIN + ICC/8 (per bit)
And the total CPD when n pcs. of flip flop operate can be gained by the following equation:
CPD (total) = 47 + 15・n
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Package Dimensions
Weight: 1.30 g (typ.)
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TC74HCT574AP/AF
Package Dimensions
Weight: 0.22 g (typ.)
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TC74HCT574AP/AF
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
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document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
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that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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