Rohm BD2062FJ 2ch high side switch ics for usb devices and memory card Datasheet

Power Management Switch ICs for PCs and Digital Consumer Products
2ch High Side Switch ICs
for USB Devices and Memory Cards
BD2062FJ,BD2066FJ
No.11029EBT15
●Description
High side switch for USB is a high side switch having over-current protection used in power supply line of universal serial
bus (USB). Its switch unit has two channels of N-channel power MOSFET. And, over-current detection circuit, thermal
shutdown circuit, under-voltage lockout and soft-start circuit are built in.
●Features
1) Dual N-MOS High Side Switch
2) Current Limit Threshold 2.4A
3) Control Input Logic
Active-Low : BD2062FJ
Active-High : BD2066FJ
4) Soft-Start Circuit
5) Over-Current Detection
6) Thermal Shutdown
7) Under-Voltage Lockout
8) Open-Drain Error Flag Output
9) Reverse Current Protection When Switch Off
10) Flag Output Delay Filter Built In
11) Power Supply Voltage Range 2.7V~5.5V
12) TTL Enable Input
13) 0.8ms Typical Rise Time
14) 1μA Max Standby Current
●Applications
PC, PC peripheral USB hub in consumer appliances, Car accessory, and so forth
●Line Up Matrix
Parameter
BD2062FJ
BD2066FJ
Current limit threshold (A)
2.4
2.4
Control input logic
Low
High
Number of channels
2ch
2ch
SOP-J8
SOP-J8
Package
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1/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
VIN
-0.3 ~ 6.0
V
Enable input voltage
VEN
-0.3 ~ 6.0
V
/OC voltage
V/OC
-0.3 ~ 6.0
V
Supply voltage
/OC sink current
IS/OC
~5
mA
OUT voltage
VOUT
-0.3 ~ 6.0
V
Storage temperature
TSTG
-55 ~ 150
℃
Power dissipation
*1
*
*1
Pd
675
mW
Mounted on 70mm * 70mm * 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC
This product is not designed for protection against radioactive rays.
●Operating Conditions
Parameter
Operating voltage
Operating temperature
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Symbol
Ratings
Unit
Min.
Typ.
Max.
VIN
2.7
-
5.5
V
TOPR
-40
-
85
℃
2/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Electrical Characteristics
○BD2062FJ (Unless otherwise specified VIN = 5.0V, Ta = 25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Operating current
IDD
-
130
180
μA
V/EN = 0V , OUT=OPEN
Standby current
ISTB
-
0.01
1
μA
V/EN = 5V , OUT=OPEN
V/EN
2.0
-
-
V
High input
V/EN
-
-
0.8
V
Low input
I/EN
-1.0
0.01
1.0
μA
V/EN = 0V or V/EN = 5V
/OC output low voltage
V/OCL
-
-
0.5
V
I/OC = 1mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC delay time
T/OC
10
15
20
ms
On-resistance
RON
-
80
125
mΩ
IOUT = 500mA
Switch leak current
ILSW
-
-
1.0
μA
V/EN = 5V, VOUT = 0V
Reverse leak current
ILREV
-
1.0
μA
VOUT = 5.5V, VIN = 0V
Current limit threshold
ITH
1.5
2.4
3.0
A
Short circuit current
ISC
1.1
1.5
2.1
A
Output rise time
TON1
-
0.8
10
ms
RL = 10Ω
Output turn-on time
TON2
-
1.1
20
ms
RL = 10Ω
Output fall time
TOFF1
-
5
20
μs
RL = 10Ω
Output turn-off time
TOFF2
-
10
40
μs
RL = 10Ω
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
/EN input voltage
/EN input current
UVLO threshold
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-
3/16
VOUT = 0V
CL = 47μF (RMS)
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
(Unless otherwise specified VIN = 5.0V, Ta = 25 ℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
○BD2066FJ
Unit
Condition
Operating current
IDD
-
130
180
μA
VEN = 5V , OUT=OPEN
Standby current
ISTB
-
0.01
1
μA
VEN = 0V , OUT=OPEN
VEN
2.0
-
-
V
High input
VEN
-
-
0.8
V
Low input
IEN
-1.0
0.01
1.0
μA
VEN = 0V or VEN = 5V
/OC output low voltage
V/OCL
-
-
0.5
V
I/OC = 1mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC delay time
T/OC
10
15
20
ms
On-resistance
RON
-
80
125
mΩ
IOUT = 500mA
Switch leak current
ILSW
-
-
1.0
μA
VEN = 0V, VOUT = 0V
Reverse leak current
ILREV
-
-
1.0
μA
VOUT = 5.5V, VIN = 0V
Current limit threshold
ITH
1.5
2.4
3.0
A
Short circuit current
ISC
1.1
1.5
2.1
A
Output rise time
TON1
-
0.8
10
ms
RL = 10Ω
Output turn-on time
TON2
-
1.1
20
ms
RL = 10Ω
Output fall time
TOFF1
-
5
20
μs
RL = 10Ω
Output turn-off time
TOFF2
-
10
40
μs
RL = 10Ω
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
EN input voltage
EN input current
UVLO threshold
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4/16
VOUT = 0V
CL = 47μF (RMS)
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Measurement Circuit
VIN
VIN
1µF
1µF
A
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
RL
RL
Operating current
VIN
VIN
IOUT
IOUT
GND
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
10k
1µF
GND
/OC1
IN
CL
EN, /EN input voltage, Output rise, fall time
Inrush current
VDD
1µF
●Timing Diagram
○BD2062FJ
10k
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
On-resistance, Over-current detection
Fig.1 Measurement circuit
IOUT
IOUT
/OC output low voltage
○BD2066FJ
TOFF1
TOFF1
TON1
TON1
90%
VOUT
90%
10%
10%
TON2
TOFF2
VEN
Fig.2 Timing diagram
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90%
10%
50%
50%
90%
VOUT
10%
TON2
V/EN
CL
50%
TOFF2
50%
Fig.3 Timing diagram
5/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Electrical Characteristic Curves (Reference Data)
180
140
120
100
80
60
40
20
VIN=5V
160
140
120
100
80
60
40
20
0
4
5
6
0.4
0.2
0
-50
1
0
50
2
100
Fig.5 Operating current
EN, /EN enable
2
EN INPUT VOLTAGE: VEN (V)
VIN=5V
0.8
0.6
0.4
0.2
2
Low to High
High to Low
1
0.5
2
100
3
/OC OUTPUT VOLTAGE: V/OC (mV)
TA=25℃
80
60
40
20
0
2
3
4
5
6
0
80
60
40
20
0
100
AMBIENT TEMPERATURE: TA (℃)
Fig.13 On-resistance
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50
100
AMBIENT TEMPERATURE: TA (℃)
100
120
VIN=5V
80
60
40
20
TA=25℃
100
80
60
40
20
0
0
-50
0
50
2
100
3
3
2.5
2
1.5
3
4
5
SUPPLY VOLTAGE: VIN (V)
Fig.14 Current limit threshold
6/16
5
6
Fig.12 On-resistance
TA=25℃
2
4
SUPPLY VOLTAGE: VIN (V)
Fig.11 /OC output low voltage
CURRENT LIMT THRESHOLD: ITH (A)
100
50
0.5
AMBIENT TEMPERATURE: TA (℃)
VIN=5V
0
High to Low
1
Fig.9 EN, /EN input voltage
6
Fig.10 /OC output low voltage
-50
Low to High
Fig.8 EN, /EN input voltage
SUPPLY VOLTAGE: VIN (V)
120
5
ON RESISTANCE: RON (mΩ)
Fig.7 Standby current
EN, /EN disable
6
1.5
SUPPLY VOLTAGE: VIN (V)
AMBIENT TEMPERATURE: TA (℃)
100
4
CURRENT LIMIT THRESHOLD: ITH (A)
50
5
VIN=5V
0
-50
0
0
4
Fig.6 Standby current
EN, /EN disable
TA=25℃
1.5
0
-50
3
SUPPLY VOLTAGE: VIN (V)
AMBIENT TEMPERATURE: TA (℃)
Fig.4 Operating current
EN, /EN enable
STANDBY CURRENT: IDD (uA)
0.6
EN INPUT VOLTAGE: VEN (V)
3
SUPPLY VOLTAGE: VIN (V)
/OC OUTPUT VOLTAGE: V/OC (mV)
0.8
0
2
ON RESISTANCE: RON (mΩ)
TA=25℃
STANDBY CURRENT: IDD (uA)
OPERATING CURRENT: IDD (uA)
OPERATING CURRENT: IDD (uA)
1
180
TA=25℃
160
6
3
VIN=5V
2.5
2
1.5
-50
0
50
100
AMBIENT TEMPERATURE: TA (℃)
Fig.15 Current limit threshold
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
2
0.8
0.6
0.4
0.2
0
2
3
4
5
1.5
1
0.5
-50
0.8
0.6
0.4
0.2
0.2
3
2
1
4
5
4
5
0.2
-50
4
3
2
1
0
50
TA=25℃
8
6
4
2
100
2
2
100
20
TA=25℃
15
10
5
AMBIENT TEMPERATURE: TA (℃)
Fig.25 Output turn-off time
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2
3
4
5
SUPPLY VOLTAGE: VIN (V)
Fig.26 /OC delay time
7/16
4
5
6
Fig.24 Output turn-off time
0
0
3
SUPPLY VOLTAGE: VIN (V)
/OC DELAY TIME: T/OC (ms)
/OC DELAY TIME: T/OC (ms)
4
100
0
20
6
50
10
VIN=5V
Fig.23 Output fall time
8
0
AMBIENT TEMPERATURE: TA (℃)
AMBIENT TEMPERATURE: TA (℃)
VIN=5V
50
0.4
5
Fig.22 Output fall time
0
0.6
Fig.21 Output turn-on time
SUPPLY VOLTAGE: VIN (V)
-50
VIN=5V
Fig.20 Output turn-on time
-50
6
6
0.8
6
0
0
5
0
3
TURN OFF TIME: TOFF2 (us)
FALL TIME: TOFF1 (us)
FALL TIME: TOFF1 (us)
1
SUPPLY VOLTAGE: VIN (V)
4
4
Fig.18 Output rise time
0.4
2
TA=25℃
3
3
SUPPLY VOLTAGE: VIN (V)
0.6
100
Fig.19 Output rise time
2
0.2
2
0
5
0.4
100
TA=25℃
AMBIENT TEMPERATURE: TA(℃)
TURN OFF TIME: TOFF2 (us)
50
0.8
0
10
0
TURN ON TIME: TON2 (ms)
TURN ON TIME: TON2 (ms)
RISE TIME: TON1(ms)
1
50
0.6
Fig.17 Short circuit current
VIN=5V
0
0.8
AMBIENT TEMPERATURE: TA (℃)
Fig.16 Short circuit current
-50
TA=25℃
0
0
6
SUPPLY VOLTAGE: VIN (V)
1
1
VIN=5V
RISE TIME: TON1 (ms)
TA=25℃
SHORT CIRCUIT CURRENT:ISC (A)
OUTPUT RISE TIME: TON1 (ms)
1
6
VIN=5V
15
10
5
0
-50
0
50
100
AMBIENT TEMPERATURE: TA ( ℃)
Fig.27 /OC delay time
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
0.2
UVLO HYSTERESIS: VHYS(V)
UVLO THRESHOLD: VUVLO (V)
2.5
2.4
VUVLOH
2.3
2.2
VUVLOL
2.1
2
-50
0
50
100
0.15
0.1
0.05
0
-50
AMBIENT TEMPERATURE: TA(℃)
Fig.28 UVLO threshold voltage
0
50
100
AMBIENT TEMPERATURE: TA(℃)
Fig.29 UVLO hysteresis voltage
●Waveform Data(BD2062FJ)
/EN
1V/div
/EN
1V/div
/EN
1V/div
VOUT
1V/div
VOUT
1V/div
VOUT
1V/div
V/OC
1V/div
IIN
0.5A/div
VIN=5V
CL=100uF
RL=5Ω
V/OC
1V/div
VIN=5V
CL=100uF
RL=5Ω
IIN
0.5A/div
TIME 200us/div
TIME 1ms/div
Fig.30 Output rise characteristics
Fig.31 Output fall characteristics
V/OC1
1V/div
IOUT1
1.0A/div
CL=220uF
V/OC
1V/div
CL=220uF
IIN
0.5A/div
CL=47uF
TIME 200us/div
Fig.32 Inrush current
CL=47uF, 100uF, 147uF, 220uF
V/OC1
1V/div
VIN=5V
CL=220uF
C=10uF
RL=5Ω
VOUT2
1V/div
Fig.33 Inrush current
VIN=5V
CL=47uF
IOUT1
0.5A/div
TIME 200us/div
TIME 5ms/div
Fig.34 Over-current response
ramped load
VIN=5V
CL=47uF
RL=1Ω
VOUT1
1V/div
/EN
1V/div
V/OC1
1V/div
VOUT
1V/div
VOUT1
1V/div
VOC
1V/div
V/OC1
1V/div
IOUT1
0.5A/div
IOUT1
0.5A/div
VOUT2
1V/div
CL=47uF
VOUT1
1V/div
VOUT1
1V/div
VOUT2
1V/div
VIN=5V
RL=5Ω
VIN=5V
CL=47uF
IOUT1
1.0A/div
TIME 2ms/div
Fig.35 Over-current response
1Ωload connected at enable
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TIME 2ms/div
Fig.36 Over-current response
enable to short circuit
8/16
V/OC2
1V/div
VIN=5V
CL=47uF
TIME 100ms/div
Fig.37 Thermal shutdown
response
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Block Diagram
TSD1
/EN1
EN1
/OC1
Gate
Logic1
Delay
Charge
Pump1
OCD1
IN
OUT1
UVLO
GND 1
OUT2
/EN2
EN2
IN 2
Charge
Pump2
OCD2
7 OUT1
Top View
/EN1 3
(EN1)
/EN2 4
(EN2)
/OC2
Gate
Logic2
8 /OC1
Delay
GND
6 OUT2
5 /OC2
TSD2
Fig.38 Block diagram
Fig.39 Pin configuration
●Pin Description
○BD2062FJ
Pin No.
Symbol
I/O
1
GND
-
Ground.
2
IN
-
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
3, 4
/EN
I
Enable input.
Switch on at Low level.
High level input > 2.0V, Low level input < 0.8V.
5, 8
/OC
O
Error flag output.
Low at over-current, thermal shutdown.
Open drain output.
6, 7
OUT
O
Switch output.
Symbol
I/O
1
GND
-
Ground.
2
IN
-
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
3, 4
EN
I
Enable input.
Switch on at High level.
High level input > 2.0V, Low level input < 0.8V
5, 8
/OC
O
Error flag output.
Low at over-current, thermal shutdown.
Open drain output.
6, 7
OUT
O
Switch output.
○BD2066FJ
Pin No.
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Pin function
Pin function
9/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●I/O Circuit
Symbol
EN1(/EN1)
EN2(/EN2)
Pin No
Equivalent circuit
/EN1(EN1)
/EN2(EN2)
3, 4
/OC1
/OC2
/OC1
/OC2
OUT1
OUT2
5, 8
6, 7
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OUT1
OUT2
10/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Functional Description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 100mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an over-current occurs, only the switch of an over-current state become off and error flag is output.
Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag
output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is
removed or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down
circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
3. Over-current detection (OCD)
The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in short-circuit status
When the switch is turned on while the output is in short-circuit status or so, the switch gets in current limit status
soon.
3-2. When the output short-circuits while the switch is on
When the output short-circuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ).
Under-voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
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11/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
V/EN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Fig.40 Over-current detection, thermal shutdown timing
(BD2062FJ)
VEN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Fig.41 Over-current detection, thermal shutdown timing
(BD2066FJ)
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12/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Typical Application Circuit
5V(Typ.)
10k~100k
10k~100k
VBUS
IN
OUT
ON/OFF
GND
Ferrite
Beads
/OC1
CL
D+
OC
CIN
DOC
Regulator
GND
ON/OFF
Data
IN
/EN1
(EN1)
/EN2
(EN2)
OUT1
OUT2
Data
/OC2
CL
BD2062FJ/66FJ
USB Controller
Data
Fig.42 Typical application circuit
●Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and
GND terminal of IC. 1uF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
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13/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Power Dissipation Character
(SOP-J8)
600
POWER DISSIPATION: Pd[mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Fig.43 Power dissipation curve (Pd-Ta Curve)
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
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2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
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15/16
2011.05 - Rev.B
Technical Note
BD2062FJ,BD2066FJ
●Ordering part number
B
D
2
Part No.
0
6
2
F
Part No.
2062
2066
J
-
Package
FJ: SOP-J8
E
2
Packaging and forming specification
E2: Embossed tape and reel
SOP-J8
<Tape and Reel information>
4.9±0.2
(MAX 5.25 include BURR)
+6°
4° −4°
6
5
0.45MIN
7
3.9±0.2
6.0±0.3
8
1
2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.545
0.2±0.1
0.175
1.375±0.1
S
1.27
0.42±0.1
0.1 S
1pin
Reel
(Unit : mm)
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16/16
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.05 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
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More detail product informations and catalogs are available, please contact us.
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A
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