TI AM26LV32EIDR Low-voltage high-speed quadruple differential line receiver with â±15-kv iec esd protection Datasheet

AM26LV32E
www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE RECEIVER
WITH ±15-kV IEC ESD PROTECTION
FEATURES
1
•
•
•
•
•
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4B
4A
4Y
G
3Y
3A
3B
RGY PACKAGE
(TOP VIEW)
1A
1Y
G
2Y
2A
2B
VCC
•
1B
1A
1Y
G
2Y
2A
2B
GND
1
16
2
15 4B
3
4
14 4A
5
6
12 G
13 4Y
11 3Y
10 3A
7
8
9
3B
•
•
•
D, NS, OR PW PACKAGE
(TOP VIEW)
1B
•
•
Meets or Exceeds Standard TIA/EIA-422-B and
ITU Recommendation V.11
Operates From a Single 3.3-V Power Supply
ESD Protection for RS422 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
Switching Rates up to 32 MHz
Low Power Dissipation: 27 mW Typ
Open-Circuit, Short-Circuit, and Terminated
Fail-Safe
±7-V Common-Mode Input Voltage Range With
±200-mV Sensitivity
Accepts 5-V Logic Inputs With 3.3-V Supply
(Enable Inputs)
Input Hysteresis: 35 mV Typ
Pin-to-Pin Compatible With AM26C32,
AM26LS32
Ioff Supports Partial-Power-Down Mode
Operation
Package Options: SOP, SOIC, TSSOP, QFN
GND
•
DESCRIPTION/ORDERING INFORMATION
The AM26LV32E consists of quadruple differential line receivers with 3-state outputs. These differential receivers
have ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact
Discharge) protection for RS422 bus pins.
This device is designed to meet TIA/EIA-422-B and ITU recommendation V.11 drivers with reduced supply
voltage. The device is optimized for balanced bus transmission at switching rates up to 32 MHz. The 3-state
outputs permit connection directly to a bus-organized system.
The AM26LV32E has an internal fail-safe circuitry that prevents the device from putting an unknown voltage
signal at the receiver outputs. In the open fail-safe, shorted fail-safe, and terminated fail-safe, a high state is
produced at the respective output.
This device is supported for partial-power-down applications using Ioff. Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
The AM26LV32EI is characterized for operation from –40°C to 85°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
AM26LV32E
SLLS849A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SOIC – D
Tape and reel
AM26LV32EIDR
AM26LV32EI
SOP – NS
Tape and reel
AM26LV32EINSR
26LV32EI
TSSOP – PW
Tape and reel
AM26LV32EIPWR
SB32
QFN – RGY
Tape and reel
AM26LV32EIRGYR
SB32
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLE (1)
(each receiver)
ENABLES
DIFFERENTIAL
INPUT
VID ≥ 0.2 V
G
H
X
H
X
L
H
H
X
?
X
L
?
H
X
L
X
L
L
Open, shorted, or
terminated
H
X
H
X
L
H
X
L
H
Z
–0.2 V < VID < 0.2 V
VID ≤ –0.2 V
(1)
OUTPUT
G
H = high level, L = low level, X = irrelevant,
Z = high impedance (off), ? = indeterminate
LOGIC DIAGRAM (POSITIVE LOGIC)
G 4
12
G
1A 2
1B 1
2A 6
2B 7
3A 10
3B 9
4A 14
4B 15
2
3 1Y
5 2Y
11 3Y
13 4Y
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV32E
AM26LV32E
www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008
SCHEMATIC
EQUIVALENT OF EACH INPUT (A, B)
EQUIVALENT OF EACH
ENABLE INPUT (G, G)
TYPICAL OF EACH RECEIVER OUTPUT
VCC
VCC
VCC
2.4 kΩ
5 kΩ
7 kΩ
Enable
G, G
1.5 kΩ
A, B
200 kΩ
Output
1.5 kΩ
VCC(A)
or
GND(B)
2.4 kΩ
GND
GND
GND
All resistor values are nominal.
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
–0.5
6
UNIT
V
A or B inputs
–14
14
V
Enable Inputs
–0.5
6
V
–14
14
V
VCC
Supply voltage range (3)
VI
Input voltage range
VID
Differential input voltage (4)
VO
Output voltage range
IIK
Input clamp current range
VI < 0
–20
mA
IOK
Output clamp current range
VO < 0
–20
mA
lO
Maximum output current
±20
mA
TJ
Operating virtual junction temperature
150
°C
–0.5
6
D package
73
NS package
64
PW package
108
V
θJA
Package thermal impedance (5) (6)
TA
Operating free-air temperature range
–40
85
°C
Tstg
Storage temperature range
–65
150
°C
RGY package
(1)
(2)
(3)
(4)
(5)
(6)
°C/W
39
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
This device is designed to meet TIA/EIA-422-B and ITU.
All voltage values except differential input voltage are with respect to the network GND.
Differential input voltage is measured at the noninverting input with respect to the corresponding inverting input.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV32E
3
AM26LV32E
SLLS849A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
3.3
UNIT
VCC
Supply voltage
3
3.6
V
VIH
Enable high-level input voltage
2
5.5
V
VIL
Enable low-level input voltage
0
0.8
V
VIC
Common-mode input voltage
–7
7
mA
VID
Differential input voltage
–7
7
mA
IOH
High-level output current
–5
mA
IOL
Low-level output current
5
mA
TA
Operating free-air temperature
85
°C
–40
ELECTRICAL CHARACTERISTICS
over recommended ranges of common-mode input, supply voltage, and operating free-air temperature (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
MIN
VIT+
Positive-going input threshold voltage,
differential input
VIT–
Negative-going input threshold voltage,
differential input
Vhys
Input hysteresis (VIT+ – VIT–)
VIK
Input clamp voltage, G and G
VOH
High-level output voltage
VOL
Low-level output voltage
IOZ
High-impedance state output current
VO = VCC or GND
Ioff
Output current with power off
VCC = 0 V, VO = 0 or 5.5 V
II
Line input current
Other input at 0 V
II
Enable input current, G and G
VI = VCC or GND
ri
Input resistance
VIC = –7 V to 7 V, Other input at 0 V
ICC
Supply current (total package)
G, G = VCC or GND, No load, Line inputs open
Cpd
Power dissipation capacitance (2)
One channel
4
MAX
0.2
–0.2
35
VID = –200 mV, IOL = 5 mA
V
0.17
VID = –200 mV, IOL = 100 µA
0.5
0.1
±50
µA
µA
1.5
VI = –10 V
–2.5
±1
17
8
150
V
±100
VI = 10 V
4
V
3.2
VCC –
0.1
VID = 200 mV, IOH = –100 µA
V
mV
–1.5
2.4
UNIT
V
II = –18 mA
VID = 200 mV, IOH = –5 mA
(1)
(2)
TYP (1)
mA
µA
kΩ
17
mA
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Cpd determines the no-load dynamic current consumption: IS = Cpd × VCC × f + ICC
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV32E
AM26LV32E
www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
8
16
26
ns
8
16
26
ns
UNIT
tPLH
Propagation delay time, low- to high-level output
tPHL
Propagation delay time, high- to low-level output
tt
Transition time
See Figure 1
5
tPZH
Output-enable time to high level
See Figure 2
17
40
ns
tPZL
Output-enable time to low level
See Figure 3
10
40
ns
tPHZ
Output-disable time from high level
See Figure 2
20
40
ns
tPLZ
Output-disable time from low level
See Figure 3
16
40
ns
tsk(p)
Pulse skew
See Figure 1 (2)
4
6
ns
tsk(o)
Pulse skew
See Figure 1
(3)
4
6
ns
tsk(pp)
Pulse skew (device to device)
See Figure 1 (4)
6
9
f(max)
Maximum operating frequency
See Figure 1
(1)
(2)
(3)
(4)
See Figure 1
ns
32
ns
MHz
All typical values are at VCC = 3.3 V, TA = 25°C.
tsk(p) is |tpLH – tpHL| of each channel of same device.
tsk(o) is the maximum difference in propagation delay times between any two channels of same device switching in the same direction.
tsk(pp) is the maximum difference in propagation delay times between any two channels of any two devices switching in the same
direction.
ESD PROTECTION
PARAMETER
Receiver input
TEST CONDITIONS
TYP
HBM
±15
IEC61000-4-2, Air-Gap Discharge
±15
IEC61000-4-2, Contact Discharge
±8
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV32E
UNIT
kV
5
AM26LV32E
SLLS849A – APRIL 2008 – REVISED MAY 2008............................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
A
Generator
(see Note B)
Y
VO
B
50 Ω
CL = 15 pF
(see Note A)
50 Ω
A
2V
B
1V
Input
tPLH
VCC
Output
G
G
(see Note C)
tPHL
90%
50%
10%
90%
VOH
50%
10% V
OL
tr
tf
A.
CL includes probe and jig capacitance.
B.
The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%,
tr = tf ≤ 2ns.
C.
To test the active-low enable G, ground G and apply an inverted waveform G.
Figure 1. Test Circuit and Voltage Waveforms, tPLH and tPHL
VID = 1 V
A
Y
VO
B
CL = 15 pF
(see Note A)
RL = 2 kΩ
G
Generator
(see Note B)
50 Ω
G
VCC
(see Note C)
VCC
Input
50%
50%
0V
tPZH
Output
tPHZ
VOH
VOH - 0.3 V
Voff ≈ 0
A.
CL includes probe and jig capacitance.
B.
The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%,
tr = tf ≤ 2ns.
C.
To test the active-low enable G, ground G and apply an inverted waveform G.
Figure 2. Test Circuit and Voltage Waveforms, tPZH and tPHZ
6
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV32E
AM26LV32E
www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
RL = 2 kΩ
A
VID = 1 V
Y
VO
B
CL = 15 pF
(see Note A)
G
Generator
(see Note B)
50 Ω
G
VCC
(see Note C)
VCC
Input
50%
50%
0V
tPZL
tPLZ
Voff ≈ V CC
Output
VOL + 0.3 V
VOL
A.
CL includes probe and jig capacitance.
B.
The input pulse is supplied by a generator having the following characteristics: PRR = 10 MHz, duty cycle = 50%,
tr = tf ≤ 2ns.
C.
To test the active-low enable G, ground G and apply an inverted waveform G.
Figure 3. Test Circuit and Voltage Waveforms, tPZL and tPLZ
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): AM26LV32E
7
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
AM26LV32EIDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26LV32EIDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26LV32EINSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26LV32EINSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26LV32EIPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26LV32EIPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AM26LV32EIRGYR
ACTIVE
VQFN
RGY
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
AM26LV32EIRGYRG4
ACTIVE
VQFN
RGY
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF AM26LV32E :
• Enhanced Product: AM26LV32E-EP
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
AM26LV32EIDR
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
AM26LV32EINSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
AM26LV32EIPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
AM26LV32EIRGYR
VQFN
RGY
16
3000
330.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AM26LV32EIDR
SOIC
D
16
2500
346.0
346.0
33.0
AM26LV32EINSR
SO
NS
16
2000
346.0
346.0
33.0
AM26LV32EIPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
AM26LV32EIRGYR
VQFN
RGY
16
3000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
Similar pages