TI1 DS3695AM Multipoint rs485/rs422 transceiver Datasheet

DS3695A, DS3695AT, DS3696A
www.ti.com
SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013
DS3695A/DS3695AT/DS3696A Multipoint RS485/RS422 Transceivers
Check for Samples: DS3695A, DS3695AT, DS3696A
FEATURES
DESCRIPTION
•
The DS3695A and DS3696A are high speed
differential TRI-STATE bus/line transceivers designed
to meet the requirements of EIA standard RS485 with
extended common mode range (+12V to −7V), for
multipoint data transmission. In addition they are
compatible with requirements of RS-422.
1
2
•
•
•
•
•
•
•
•
Meets EIA Standard RS485 for Multipoint Bus
Transmission and is Compatible with RS-422
10 Ns Driver Propagation Delays (Typical)
Single +5V Supply
−7V to +12V Bus Common Mode Range
Permits ±7V Ground Difference between
Devices on the Bus
Thermal Shutdown Protection
High Impedance to Bus with Driver in TRISTATE or with Power Off, over the Entire
Common Mode Range Allows the Unused
Devices on the Bus to be Powered Down
Combined Impedance of a Driver Output and
Receiver Input is less than One RS485 Unit
Load, Allowing up to 32 Transceivers on the
Bus
70 mV Typical Receiver Hysteresis
Available in SOIC Packaging
The driver and receiver outputs feature TRI-STATE
capability. The driver outputs remain in over the
entire common mode range of +12V to −7V. Bus
faults that cause excessive power dissipation within
the device trigger a thermal shutdown circuit, which
forces the driver outputs into the high impedance
state. The DS3696A provides an output pin (TS)
which reports the thermal shutdown of the device. TS
is an “open collector” pin with an internal 10 kΩ pullup resistor. This allows the TS outputs of several
devices to be wire OR-ed.
Both AC and DC specifications are guaranteed over
the 0°C to 70°C temperature and 4.75V to 5.25V
supply voltage range.
Connection and Logic Diagrams
Figure 1. Molded Package, Small Outline (D0008A)
Top View
Figure 2. Top View
(See Package Number D0008A)
TS was LF (Line Fault) on previous datasheets, TS goes low upon thermal shutdown.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1996–2013, Texas Instruments Incorporated
DS3695A, DS3695AT, DS3696A
SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Supply Voltage, VCC
7V
Control Input Voltages
7V
Driver Input Voltage
7V
Driver Output Voltages
+15V/−10V
Receiver Input Voltages
+15V/−10V
Receiver Output Voltage
5.5V
Continuous Power Dissipation @ 25°C
D0008A Package
630 mW
−65°C to +150°C
Storage Temp. Range
Lead Temp. (Soldering 4 seconds)
(1)
(3)
260°C
“Absolute maximum ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the
device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Derate linearly at 6.5 mW/°C to 337 mW at 70°C.
(2)
(3)
Recommended Operating Conditions
Supply Voltage, VCC
Bus Voltage
Min
Max
Units
4.75
5.25
V
−7
+12
V
Operating Free Air Temperature (TA)
Commercial (DS3695AM)
Industrial (DS3695ATM)
Commercial (DS3696AM)
Electrical Characteristics
0
+70
°C
−40
+85
°C
0
+70
°C
Typ
Max
Units
5
V
(1) (2)
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
Parameter
VOD1
VOD2
Test Conditions
Differential Driver Output Voltage (Unloaded)
Differential Driver Output Voltage (with Load)
Min
IO = 0
R = 50Ω; (RS-422)
(3)
2
R = 27Ω; (RS-485)
V
1.5
V
ΔVOD
Complementary Output States
Differential Output Voltage For
Change in Magnitude of Driver
VOC
Driver Common Mode Output Voltage
3.0
V
Δ|VOC|
Change in Magnitude of Driver
Common Mode Output Voltage
For Complementary Output States
0.2
V
VIH
Input High Voltage
VIL
Input Low Voltage
VCL
Input Clamp Voltage
IIN = −18 mA
−1.5
V
IIL
Input Low Current
VIL = 0.4V
−200
μA
IIH
Input High Current
VIH = 2.4V
20
μA
(1)
(2)
(3)
2
R = 27Ω
0.2
DI, DE, RE ,
RE/DE
2
V
V
0.8
V
All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
All typicals are given for VCC = 5V and TA = 25°C.
All limits for which this note is applied must be derated by 10% for DS3695AT. Other parameters remain the same for this extended
temperature range device (−40°C ≤ TA ≤ +85°C).
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Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
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SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013
Electrical Characteristics (1) (2) (continued)
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
Parameter
IIN
Test Conditions
Input Current
RI, RI, DO/RI,
DO/RI
VCC = 0V or 5.25V,
DE or RE /DE = 0V
VTH
Differential Input Threshold Voltage for Receiver
−7V ≤ VCM ≤ +12V
ΔVTH
Receiver Input Hysteresis
VCM = 0V
VOH
Receiver Output High Voltage
VOL
Output Low Voltage
Max
Units
VIN = 12V
+1.0
mA
VIN = −7V
−0.8
mA
IOH = −400 μA
IOL = 16 mA
TS
V
0.5
V
IOL = 8 mA
0.45
V
±20
μA
0.4V ≤ VO ≤ 2.4V, VCC = Max,
RIN
Receiver Input Resistance
−7V ≤ VCM ≤ +12V
ICC
Supply Current
No Load (3)
Output Current Receiver Short-Circuit
V
mV
2.4
(3)
Output Current at Receiver OFF-State (High
Impedance)
IOSR
+0.2
70
RO
Output Current Driver Short-Circuit
Typ
−0.2
IOZR
IOSD
Min
VO = −7V
12
kΩ
Driver Outputs
Enabled
42
60
mA
Driver Outputs
Disabled
27
40
mA
−250
mA
+250
mA
(3)
VO = +12V
(3)
−15
VO = 0V
−85
mA
Receiver Switching Characteristics
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
(4)
Min
Typ
Max
Units
tPLH
CL = 15 pF
15
28
42
ns
tPHL
S1 and S2
15
28
42
ns
|tPLH–tPHL|
Closed
0
3
tPLZ
CL = 15 pF, S2 Open
5
29
35
ns
tPHZ
CL = 15 pF, S1 Open
5
12
16
ns
tPZL
CL = 15 pF, S2 Open
7
15
28
ns
tPZH
CL = 15 pF, S1 Open
7
15
20
ns
Min
Typ
Max
Units
(4)
Test Conditions
ns
All typicals are given for VCC = 5V and TA = 25°C.
Driver Switching Characteristics
0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
(1)
Test Conditions
SINGLE ENDED CHARACTERISTICS (Figure 7, Figure 8, and Figure 10)
tPLH
RLDIFF = 60Ω
9
15
22
ns
tPHL
CL1 = CL2 = 100 pF
9
15
22
ns
0
2
8
ns
7
15
30
ns
tSKEW|tPLH–tPHL|
tPLZ
CL = 15 pF, S2 Open
tPHZ
CL = 15 pF, S1 Open
7
15
30
ns
tPZL
CL = 100 pF, S2 Open
30
35
50
ns
tPZH
CL = 100 pF, S1 Open
30
35
50
ns
6
10
18
ns
DIFFERENTIAL SWITCHING CHARACTERISTICS (Figure 10)
tr, tf
(1)
RLDIFF = 60Ω
CL1 = CL2 = 100 pF
All typicals are given for VCC = 5V and TA = 25°C.
Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
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DS3695A, DS3695AT, DS3696A
SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013
www.ti.com
AC TEST CIRCUITS AND SWITCHING WAVEFORMS
Figure 3. Receiver Propagation Delay Test Circuit
Differential input voltage may be realized by grounding RI and pulsing RI between +2.5V and −2.5V
Figure 4. Receiver Input-to-Output Propagation Delay Timing
Figure 5. Receiver Enable/Disable Propagation Delay Timing
Figure 6. Unless Otherwise Specified the Switches are Closed
4
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Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
www.ti.com
SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013
Figure 7. Driver Propagation Delay Test Circuits
tPLH and tPHL are measured to the respective 50% points. tSKEW is the difference between propagation delays of the
complementary outputs.
Figure 8. Driver Input-to-Output Propagation Delay Timing (Single-Ended)
Figure 9. Driver Enable/Disable Propagation Delay Timing
Figure 10. Driver Differential Transition Timing
Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
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5
DS3695A, DS3695AT, DS3696A
SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013
www.ti.com
Table 1. Function Tables DS3695A/DS3696A Transmitting (1)
Inputs
Line
Outputs
RE
DE
DI
Condition
DO
DO
TS * (DS3696A Only)
X
1
1
No Fault
0
1
H
X
1
0
No Fault
1
0
H
X
0
X
X
Z
Z
H
X
1
X
Fault
Z
Z
L
Table 2. Function Tables DS3695A/DS3696A Receiving (1)
Inputs
(1)
(1)
Outputs
RE
DE
RI–RI
RO
TS * (DS3696A Only)
0
0
≥+0.2V
1
H
0
0
≤−0.2V
0
H
0
0
Inputs Open**
1
H
1
0
X
Z
H
X — Don't care condition
Z — High impedance state
Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations
* TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor.
** This is a fail safe condition
X — Don't care condition
Z — High impedance state
Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations
* TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor.
** This is a fail safe condition
Typical Application
Repeater control logic not shown.
Figure 11.
6
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Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
DS3695A, DS3695AT, DS3696A
www.ti.com
SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 1996–2013, Texas Instruments Incorporated
Product Folder Links: DS3695A DS3695AT DS3696A
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7
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS3695AM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
DS36
95AM
DS3695AM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS36
95AM
DS3695AMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
DS36
95AM
DS3695AMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
DS36
95AM
DS3695ATM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
DS369
5ATM
DS3695ATM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS369
5ATM
DS3695ATMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
DS369
5ATM
DS3695ATMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS369
5ATM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
12-Jul-2014
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS3695AMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
DS3695AMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
DS3695ATMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
DS3695ATMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS3695AMX
SOIC
D
8
2500
367.0
367.0
35.0
DS3695AMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
DS3695ATMX
SOIC
D
8
2500
367.0
367.0
35.0
DS3695ATMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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