3.2X1.6mm SMD CHIP LED LAMP APK3216MGCK MEGA GREEN Features Description !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. The Mega Green source color devices are made !LOW POWER CONSUMPTION. with DH InGaAlP on GaAs substrate Light Emitting !WIDE VIEWING ANGLE. Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE :2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO:DSAD1150 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e APK3216MGCK Iv (m c d ) @ 20m A L en s Ty p e MEGA GREEN ( InGaAlP ) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 36 80 90 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Mega Green λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 574 nm IF = 2 0 m A Mega Green 570 nm IF = 2 0 m A Spectral Line Half-width Mega Green 20 nm IF = 2 0 m A C Capacitance Mega Green 15 pF V F = 0 V; f = 1 M Hz VF Forward Voltage Mega Green 2.1 2.5 V IF = 2 0 m A IR Reverse Current Mega Green 10 uA VR = 5V Absolute Maximum Ratings at T)=25°°C Par am et er Meg a Gr een Un it s Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO:DSAD1150 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 Mega Green SPEC NO:DSAD1150 APPROVED:J.Lu APK3216MGCK REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APK3216MGCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO:DSAD1150 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 4 OF 4