TPS856 TOSHIBA Photo-IC Silicon Epitaxial Planar TPS856 Mobile Phones Notebook PCs, PDAs Video cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment The TPS856 is an ultra-compact surface-mount photo-IC for illuminance sensors which incorporates a photodiode and current amp circuit in a single chip. The sensitivity is superior to that of a phototransistor, and exhibits little variation. It has spectral sensitivity closer to luminous efficiency and excellent output linearity. TOSHIBA ― With its ultra-compact surface-mount package, this photo-IC can be Weight: 0.003 g (typ.) used as the power-saving control for domestic appliances or for backlighting for displays in cellular phones, this device enables low power consumption to be achieved. This device includes stand-by function which can reduce the power consumption. • • • • Ultra-compact and light surface-mount package: 1.6 × 1.6 × 0.55 mm Excellent output linearity of illuminance Little fluctuation in light current and high level of sensitivity : IL = 57 μA (typ.) @EV = 100 lx using fluorescent light : Light current variation width: × 1.67 ( When light current classification is specified.) : Little temperature fluctuation Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources : IL (using incandescent light)/IL (using fluorescent light) = 1.0 (typ.) Low supply voltage, making device suitable for battery-powered equipment: VCC = 1.8 V to 5.5 V • Lead(Pb)-Free • Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit VCC V V V Stand-by voltage Vstb −0.5 to 6 < = VCC Output voltage VOUT < = Vstb Supply voltage Light current IL 5 mA Permissible power dissipation P 30 mW ΔP/°C −0.4 mW/°C Operating temperature range Topr −30 to 85 °C Storage temperature range Tstg −40 to 100 °C Soldering temperature range (Note 1) Tsol 260 °C Power dissipation derating (Ta > 25°C) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions. 1 2007-10-01 TPS856 Operating Ranges Characteristics Symbol Min Typ. Max Unit VCC 1.8 ⎯ 5.5 V Stand-by on voltage Vstbon 1.8 ⎯ VCC V Stand-by off voltage Vstboff 0 ⎯ 0.3 V Supply voltage Electrical and Optical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit VCC ⎯ 1.8 ⎯ 5.5 V Supply current (1) ICC(1) VCC = 3 V, Vstb = 3 V,EV = 1000 lx (Note 2) (Note 5) RL = 1 kΩ ⎯ 3.0 ⎯ μA Supply current (2) ICC(2) VCC = 3 V, Vstb = 0.3 V,EV = 1000 lx (Note 2) (Note 5) RL = 1 kΩ ⎯ 3.0 ⎯ μA Light current (1) IL (1) ⎯ 57 ⎯ μA Light current (2) IL (2) 4.0 5.7 8.0 μA Light current (3) IL (3) 40 57 80 μA Light current (4) IL (4) ⎯ 0.02 0.1 μA ⎯ 1.0 ⎯ ⎯ VCC = 3 V, Vstb = 3 V,EV = 0 ⎯ ⎯ 0.1 μA Supply voltage Light current ratio IL (1) IL (3) Dark current ILEAK VCC = 3 V, Vstb = 3 V,EV = 100 lx (Note 2), (Note 4) VCC = 3 V, Vstb = 3 V,EV = 10 lx (Note 3), (Note 4) VCC = 3 V, Vstb = 3 V,EV = 100 lx (Note 3), (Note 4) VCC = 3 V, Vstb = 0.3 V,EV = 100 lx (Note 3), (Note 4) ⎯ Saturation output voltage VO VCC = 3 V, Vstb = 3 V,RL = 150 kΩ, EV = 100 lx (Note 3) ⎯ 0.70 0.85 V Waiting time twait VCC = 3 V, Vstb = 3 V,RL = 150 kΩ, EV = 5 lx (Note 3) ⎯ ⎯ 20 ms ⎯ 70 ⎯ ⎯ 40 ⎯ ⎯ 100 ⎯ ⎯ 5 ⎯ Switching time Rise time tr Fall time tf Delay time td Storage time ts VCC = 3 V, Vstb = 3 V,RL = 5 kΩ (Note 7) μs Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light). Note 3: F10 of fluorescence light is used as light source. (color temperature = 5000K) However, white LED is substituted in a mass-production process. IL(3) classification A rank: 44.1 μA to 73.7 μA Note 4: Light current measurement circuit Light source VCC IL TPS856 A Vstb OUT 2 2007-10-01 TPS856 Note 5: Supply current measurement circuit ICC A Light source VCC RL TPS856 Vstb OUT Note 6: Waiting time measurement method Vstb VCC Light source TPS856 0V RL Vstb Vstb VOUT 10% VOUT twait Note 7: Switching time measurement method IF VCC Pulse drive White LED TPS856 IF RL Vstb Vstb VOUT 90% 10% VOUT tf td 3 tr ts 2007-10-01 TPS856 1 Unit: mm Tolerance: ± 0.1 ( ): Reference value 4 5 0.50 0.50 6 0.20 0.20 1.60 2 1.20 3 0.20 Package Dimensions 0.3Typ. 1.60 5° max0.2 5° 0.10 0.55 0.10 5° max0.2 (0.8) Pin connection 1. VCC 2. GND 3. GND 4. GND 5. GND 6. OUT (Vstb) Weight: 0.003 g (typ.) Block Diagram PD with filter Equivalent circuit in output part Vcc VCC PD OUT ← OUT GND GND 4 2007-10-01 TPS856 Handling Precautions Insert a bypass condenser of up to 0.1μF between VCC and GND near the device to stabilize the power supply line. Please put the bypass capacitor of 0.1uF between OUT and GND near the device if you use it as a current output (There is no load resistance). When VCC is turned on it takes at least 20 ms for the internal circuit to stabilize. During this time the output signal is unstable. Please do not use the unstable signal as the output signal. Moisture-Proof Packing (1) (2) (3) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. Since the optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture and they should therefore be stored under the following conditions: Temperature: 5°C to 30°C, Relative humidity: 70% (max), Time: 168 h (max) Baking in taping with reel is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h. These devices are packed on tapes; hence, please avoid baking at high temperature. Recommended baking conditions: 60°C for 12 h or longer, Perform baking only once Mounting Precautions TPS856 uses a clear resin, and delicate handling is necessary for it. The characteristic change or the product might be damaged by the handling method of mounting. Please note the following and handle the product. (1) Do not apply stress to the resin at high temperature. Time until the product returns at the normal temperature after mounting of the reflow is different according to the mounting substrate and the environment. Please do not give the stress with heat remained in the product. (2) The resin part is easily scratched, so avoid friction with hard materials. (3) When installing the assembly board in equipment, ensure that this product does not come into contact with other components. (4) Please confirm the heat contraction of the substrate of the reflow mounting doesn't influence the product. The load is given to the product by mounting that the heat contraction is large on the substrate and the installation position of the substrate. Please note that the characteristic changes or the product might be damaged. Mounting Methods Example of reflow soldering 10s max (*) Temperature (°C) → (1) 260°C max (*) 4°C/s max (*) 230°C 190°C 180°C 4°C/s max (*) Preheating part 60∼120 s Time (s) 30 s to 50 s Heating part → (*)The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than MAX values) as an evaluation. Please perform reflow soldering under the above conditions. Perform reflow soldering no more than twice. • Please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile. 5 2007-10-01 TPS856 • Second reflow soldering In case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. Storage conditions before second reflow soldering: 30°C, 70% RH or lower • Do not perform flow soldering. • Make any necessary soldering correction manually. (Do not do this more than once for any given pin.) Temperature: no more than 350°C (25 W for soldering iron) Time: within 5 s (2) Recommended soldering pattern Unit: mm 0.45 0.3 1.35 1.0 (3) 0.5 0.5 Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50°C × 30 s or 30°C × 3 min Ultrasonic cleaning: 300 W or less Packing Specification (1) (2) Packing quantity Reel (minimum packing quantity) 3,000 devices Carton 5 reels (15,000 devices) Packing format Silica gel and reel are packed into sealed aluminum envelope. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. • Carton specification Label Carton dimensions (W) 81 mm × (L) 280 mm × (H) 280 mm 6 2007-10-01 TPS856 Tape Packing Specifications Reel dimensions Reel material: Plastic Unit: mm 11.4±1.0 9.0±0.3 +0 φ180 -1.0 5.0 +1.0 φ60 -0 (1) Enlarged view of reel center 5.0 φ21 ± 0.8 2 ± 0.5 120° φ13 ± 0.2 7 2007-10-01 TPS856 (2) Tape dimensions Tape material: Plastic (anti-electrostatic) Unit: mm +0.1 φ1.5 −0 2.0±0.05 B' 1.75±0.1 4.0±0.1 0.25 ± 0.05 φ1.1±0.1 B 4.0±0.1 1.7 ± 0.1 max 6° max 6° 1.8 ± 0.1 max 6° A' B 0.85 ± 0.1 (2.75) A 8.0±0.2 3.5±0.1 B' max 6° A A' Product direction 8 2007-10-01 TPS856 Reel Label The label markings may include product number, quantity and seal date. P/N TYPE ADDC Sensor hole TPS856 Q’TY 3,000 pcs. NOTE Position of label Leader and Trailer Sections of Tape Note 1 : The leader portion shell consist of cover tape minimum length of 300 mm and a piece of carrier tape with empty portion of 100 mm minimum. Note 2 : The trailer portion shall consist of empty carrier of more than 10 cavities. 9 2007-10-01 TPS856 P – Ta ILEAK – Ta (typ.) 1 40 (μA) 25 0.01 20 15 10 20 40 60 80 Ta 0.0001 20 100 40 60 80 Ambient temperature (°C) IL – EV (typ.) Ta 100 (°C) IL – EV 10000 10000 1000 1000 (typ.) (nA) (μA) IL 100 Light current IL 0.001 5 Ambient temperature Light current 0.1 ILEAK 30 0 0 10 Ta = 25°C VCC = 3 V Vstb = 3 V A light source Fluorescent light 1 0.1 1 10 100 Luminance 1000 100 10 0.1 1 10000 (typ.) 1.1 Relative light current 1.1 1.0 0.9 3 Supply voltage 4 VCC 100 1000 10000 EV (lx) Relative IL – Vstb 1.2 2 10 Luminance 1.2 0.8 1 Ta = 25°C VCC = 3 V Vstb = 0.3 V A light source Fluorescent light 1 EV (lx) Relative IL – VCC Relative light current Vstb = 3 V Dark current Power dissipation P (mW) VCC = 3 V 35 (typ.) 1.0 0.9 Ta = 25°C Ta = 25°C VCC = Vstb VCC = 5.5V 5 0.8 1 6 (V) 2 3 Standby Voltage 10 4 5 6 Vstb (V) 2007-10-01 TPS856 10 ICC (μA) 10 0.1 Ta = 25°C VCC = 3 V Vstb = 3 V A light source Fluorescent light 0.01 0.001 1 10 100 Luminance 1000 0.1 Ta = 25°C VCC = 3 V Vstb = 0.3 V A light source Fluorescent light 0.01 0.001 1 10000 10 100 Luminance EV (lx) Spectral Response (typ.) 1 1 Consumption current Consumption current ICC – EV (typ.) 100 ICC (μA) ICC – EV 100 1000 10000 EV (lx) (typ.) 100 Ta = 25°C Radiation pattern Relative sensitivity 80 Luminosity angle 30° 60 20° 10° 0° 20° 30° 40° 40° 50° 40 50° 60° 60° 70° 20 70° 80° 80° 90° 0 200 400 600 800 Wavelength 1000 0.80 20 0.8 90° 1.0 (typ.) Ta = 25°C VCC = 3 V Vstb = 3 V 1.00 0 0.6 4.0 Vcc = 3 V Vstb =3 V Using fluorescent light 100 lx −20 0.4 VO – Ev (typ.) 1.20 0.60 −40 0.2 (nm) Output voltage Vo(V) 1.40 0 1200 Relative IL – Ta Relative light current 10° (typ.) Ta = 25°C 40 Ambient temperature 60 Ta 80 2.0 1.0 0 0 100 Fluorescent light RL=1 kΩ Fluorescent light RL=5.1 kΩ Fluorescent light RL=30 kΩ A light source RL = 1 kΩ A light source RL = 5.1 kΩ A light source RL = 30 kΩ 3.0 1000 2000 3000 Luminance (°C) 11 4000 5000 6000 7000 Ev (lx) 2007-10-01 TPS856 Switching Characteristics (Non-saturating operation) 10000 10000 Ta = 25°C VCC = Vstb = 3 V Ta = 25°C VCC = Vstb = 3 V VOUT = 1.5 V Using white LED VOUT .< 1.0 V Using white LED 1000 (typ.) 1000 Switching time (μs) (μs) Switching time Switching Characteristics (Saturating operation) (typ.) 100 10 100 10 td tr td tf tf 1 1 tr ts ts 1 0.1 1 Load resistance 10 RL 1 0.1 100 (kΩ) 1 Load resistance 12 10 RL 100 (kΩ) 2007-10-01 TPS856 RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 13 2007-10-01