AVAGO ASMT-QAB2-FDE0E Super 0.5 w power plcc-4 surface mount led indicator Datasheet

ASMT-QxB2-Fxxxx
Super 0.5 W Power PLCC-4 Surface Mount LED Indicator
Data Sheet
Description
Features
The Super 0.5 W Power PLCC-4 SMT LED is an extension
of Power PLCC-4 SMT LEDs. The package can be driven
at high current due to its superior package design. The
product is able to dissipate the heat more efficiently
compared to the Power PLCC-4 SMT LEDs. These LEDs
produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED.
• Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9 mm)
• High reliability LED package due to enhanced silicone
resin material
• Mid-power intensity brightness with optimum flux
performance using AllnGaP chip technologies
• Available in Red, Red Orange and Amber colors
• High optical efficiency
• Available in 8 mm carrier tape and 7 inch reel
• Low thermal resistance
• Super wide viewing angle at 120 degrees
• Longer life time with minimum degradation due to
enhanced Silicone resin material
• JEDEC MSL 2a
The Super 0.5 W Power PLCC-4 SMT LEDs are designed
for higher reliability, better performance, and operate
under a wide range of environmental conditions. The
performance characteristics of these new mid-power
LEDs make them uniquely suitable for use in harsh
conditions such as in automotive applications, and in
electronics signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin (except for red),
to provide close uniformity. These LEDs are compatible
with the IR solder reflow process. Due to the high
reliability feature of these products, they also can be
mounted using through-the-wave soldering process.
Super 0.5 W Power PLCC-4 SMT LED is available in red, red
orange and amber colors.
Applications
1. Exterior automotive
• Turn signals
• Side repeaters
• CHSML
• Rear combination lamp
• Side markers
• Truck clearance lamp
2. Electronic signs and signals
• Channel lettering
• Contour lighting
• Indoor variable message sign
3. Office automation, home appliances, industrial
equipment
• Front panel backlighting
• Push button backlighting
• Display backlighting
CAUTION: ASMT-QxB2-Fxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Drawing
1.9 ± 0.2
2.8 ± 0.2
0.8 ± 0.1
2.2 ± 0.2
C
0.15 (TYP.)
∅ 2.40
C
1.15 ± 0.05
3.6 ± 0.2
3.2 ± 0.2
0.41 (TYP.)
0.56 (TYP.)
0.8 ± 0.3
A
A
ANODE
MARKING
NOTES: 1.
2.
3.
4.
0.5 ± 0.1
2.30 ± 0.05
0.7 ± 0.1
ALL DIMENSIONS IN MILLIMETERS.
LEAD POLARITY AS SHOWN IN FIGURE 12.
TERMINAL FINISH: Ag PLATING.
ENCAPSULATION MATERIAL: SILICONE RESIN.
Figure 1. Package drawing
Table 1. Device Selection Guide
Luminous Flux, FV[1] (lm)
Color
Part Number
Min. Flux
(lm)
Typ. Flux
(lm)
Max. Flux
(lm)
Test Current
(mA)
Amber
ASMT-QAB2-FDE0E
9.0
11.4
15.0
150
Dice Technology
AlInGaP
Red Orange
ASMT-QHB2-FEF0E
11.5
14.0
19.5
150
AlInGaP
Red
ASMT-QRB2-FCD0E
7.0
9.8
11.5
150
AlInGaP
Notes:
1. FV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%.
Part Numbering System
A S M T – Q X1 B 2 – F X2 X3 X4 X5
Packaging Option
Color Bin Selection
Max. Flux Bin
Min. Flux Bin
LED Chip Color
Table 2. Absolute Maximum Ratings (TA = 25°C)
Parameters
ASMT-QxB2-Fxxxx
DC Forward Current[1]
150 mA
Peak Forward Current[2]
200 mA
Power Dissipation
470 mW
Reverse Voltage
5V
Junction Temperature
125°C
Operating Temperature
-40°C to +110°C
Storage Temperature
-40°C to +110°C
Notes:
1. Derate l inearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz.
Table 3. Optical Characteristics (TA = 25°C)
Dominant Viewing
Luminous
Luminous
Wavelength Angle 2q1/2[2] Efficacy hV[3] Efficiency
lD[1] (nm) (Degrees)
(lm/W)
he(lm/W)
Dice
Technology Typ.
Color
Part Number
Amber
ASMT-QAB2-Fxxxx AlInGaP
Luminous
Intensity
/Total Flux[4,5]
IV (mcd) / ΦV
Fn (lm)
Typ.
Typ.
Typ.
Typ.
594.5
120
450
28
0.30
Red Orange ASMT-QHB2-Fxxxx AlInGaP
617.0
120
210
35
0.30
Red
624.0
120
170
21
0.30
ASMT-QRB2-Fxxxx AlInGaP
Notes:
1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device.
2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = IV/hV, where IV is the luminous intensity in candelas and hV is
the luminous efficacy in lumens/watt.
4. Fn is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
5. Flux tested at mono pulse conditions.
Table 4. Electrical Characteristics (TA = 25°C)
Forward Voltage VF
(Volts) @ IF = 150 mA
Reverse Voltage
VR @ 100 µA
Part Number
Typ.
Max.
Min.
ASMT-QAB2-Fxxxx
2.70
3.25
5
60
ASMT-QHB2-Fxxxx
2.70
3.25
5
60
ASMT-QRB2-Fxxxx
3.10
3.55
5
60
Thermal Resistance
RqJ-P (°C/W)
1.0
AlInGaP RED-ORANGE
0.9
AlInGaP AMBER
RELATIVE INTENSITY
0.8
AlInGaP RED
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
380
430
480
530
580
630
680
730
780
WAVELENGTH – nm
Figure 2. Relative intensity vs. wavelength
200
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 150 mA)
FORWARD CURRENT – mA
1.2
AlInGaP AMBER
180
160
140
120
100
80
60
AlInGaP RED
40
AlInGaP
RED-ORANGE
20
0
0
1
2
3
1.0
AMBER
0.8
0.6
RED/RED-ORANGE
0.4
0.2
0
4
0
50
FORWARD VOLTAGE – V
160
MAXIMUM FORWARD CURRENT – mA
2.0
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 25 °C)
200
Figure 4. Relative intensity vs. forward current
2.2
AMBER
1.8
RED-ORANGE
1.6
1.4
1.2
1.0
0.8
RED
0.6
0.4
0.2
-25
0
25
50
75
100
JUNCTION TEMPERATURE – °C
Figure 5. Relative intensity vs. temperature
150
DC FORWARD CURRENT – mA
Figure 3. Forward current vs. forward voltage
0
-50
100
125
RθJA =
80°C/W
140
RθJA = 100°C/W
120
RθJA = 110°C/W
100
RθJA = 130°C/W
80
60
40
20
0
0
20
40
60
80
100
120
AMBIENT TEMPERATURE – °C
Figure 6a. Maximum forward current vs. ambient temperature. Derated
based on TJMAX = 125°C, RqJ-A = 130°C/W, 110°C/W, 100°C/W and 80°C/W.
630
160
AlInGaP RED
RθJP = 60°C/W
120
CURRENT – mA
DOMINANT WAVELENGTH – nm
140
100
80
60
40
20
0
0
20
40
60
80
100
620
AlInGaP RED-ORANGE
610
600
AlInGaP AMBER
590
580
120
0
Figure 6b. Maximum forward current vs. solder point temperature.
Derated based on TJMAX = 125°C, RJP = 60°C/W.
100
150
200
Figure 7. Dominant wavelength vs. forward current – AlInGaP devices
0.15
1.0
0.9
0.10
NORMALIZED INTENSITY
FORWARD VOLTAGE SHIFT (V)
50
FORWARD CURRENT – mA
TEMPERATURE – °C
0.05
0
-0.05
-0.10
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
-0.15
-50
-25
0
25
50
75
0
-90
100
TJ – JUNCTION TEMPERATURE – °C
Figure 8. Forward voltage shift vs. temperature
-60
-30
0
30
60
ANGULAR DISPLACEMENT – DEGREES
Figure 9. Radiation pattern
10 - 30 SEC.
D
TEMPERATURE
255 - 260 °C
217 °C
200 °C
3 °C/SEC. MAX.
-6 °C/SEC. MAX.
150 °C
3 °C/SEC. MAX.
60 - 120 SEC.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Note: Diameter "D" should be smaller than 2.2mm
Figure 11. Recommended Pb-free reflow soldering profile
Figure10. Recommended pick and place nozzle size
Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060
Surface Mounting SMT LED Indicator Components.
90
2.4
0.6
0.9 X 6
1.3 x 6
C
C
C
0.4
C
1.4
A
A
A
4.6
A
A
A
0.3
ANODE
MARKING
SOLDER MASK
A
ANODE
C
CATHODE
ANODE
MARKING
MINIMUM 55 mm2 OF ANODE PAD
FOR IMPROVED HEAT DISSIPATION
Figure 12. Recommended soldering pad pattern
TRAILER
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
COMPONENT
LEADER
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 13. Tape leader and trailer dimensions
∅1.5
+ 0.1
–0
4 ± 0.1
2 ± 0.05
3.6 ± 0.1
1.75 ± 0.1
B
A
A
5.5 ± 0.05
12
C
C
A
A
+ 0.3
– 0.1
3.8 ± 0.1
8 ± 0.1
∅1
+ 0.1
–0
B
0.229 ± 0.01
VIEW B-B
3.45 ± 0.1
VIEW A-A
ALL DIMENSIONS IN mm.
Figure 14. Tape dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 15. Reeling orientation
Device Color (X1)
Color Bin Select (X4)
A
Amber
Individual reel will contain parts from one full bin only.
H
Red Orange
X4
R
Red
0
Full Distribution
A
1 and 2 only
B
2 and 3 only
C
3 and 4 only
Individual reel will contain parts from one bin only.
D
4 and 5 only
X2
Min Flux Bin
E
5 and 6 only
Max Flux Bin
G
1, 2 and 3 only
H
2, 3 and 4 only
J
3, 4 and 5 only
K
4, 5 and 6 only
M
1, 2, 3 and 4 only
N
2, 3, 4 and 5 only
P
3, 4, 5 and 6 only
R
1, 2, 3, 4 and 5 only
S
2, 3, 4, 5 and 6 only
Z
Special Color Bin
Flux Bin Select (X2X3)
X3
Flux Bin Limits
Bin ID
Min. (lm)
Max. (lm)
A
4.30
5.50
B
5.50
7.00
C
7.00
9.00
D
9.00
11.50
E
11.50
15.00
F
15.00
19.50
G
19.50
25.50
H
25.50
33.00
I
33.00
43.00
J
43.00
56.00
K
56.00
73.00
Tolerance of each bin limit = ±12%.
Color Bin Limits
Amber/Yellow
Min. (nm)
Max. (nm)
2
583.0
586.0
3
586.0
589.0
4
589.0
592.0
5
592.0
595.0
6
595.0
598.0
Red Orange
Min. (nm)
Max. (nm)
1
611.0
616.0
2
616.0
620.0
3
620.0
625.0
Red
Min. (nm)
Max. (nm)
Full Distribution
620.0
635.0
Tolerance of each bin limit = ±1 nm.
VF Binning
Moisture Sensitivity
Bin
Min.
Max.
2D
2.35
2.50
2E
2.50
2.65
2F
2.65
2.80
2G
2.80
2.95
2H
2.95
3.10
2J
3.10
3.25
2K
3.25
3.40
2L
3.40
3.55
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precaution when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
Tolerance of each bin = ±0.1 V.
Packaging Option (X5 )
Option
Test Current
Package Type
Reel Size
E
150 mA
Top Mount
7 Inch
Handling Precaution
The encapsulation of the product is made of silicone
for better reliability of the product. As silicone is a soft
material, please do not press on the silicone or poke a
sharp object onto the silicone. This might damage the
product and cause premature failure. During assembly
or handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for
detailed information.
For product information and a complete list of distributors, please go to our website:
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
- The LEDs must be kept at <30°C/60%RH at all times
and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours.
C. Control for unfinished reel
- For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB needs
to be stored in sealed MBB with desiccant or desiccator at <5% RH to ensure no LEDs have exceeded
their floor life of 672 hours.
E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink.
- The LEDs are exposed to condition of >30°C/60%
RH at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60 ± 5°C for 20 hours.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0232EN - July 3, 2007
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