This product complies with the RoHS Directive (EU 2002/95/EC). DMA20601 Silicon PNP epitaxial planar type For general amplification Features Package Basic Part Number Code Mini6-G4-B Pin Name 1: Emitter (Tr1) 2: Emitter (Tr2) 3: Base (Tr2) Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Dual DSA2001 (Individual) Packaging 4: Collector (Tr2) 5: Base (Tr1) 6: Collector (Tr1) Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) Marking Symbol: B2 Absolute Maximum Ratings Ta = 25°C Internal Connection Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO –60 V Collector-emitter voltage (Base open) VCEO –50 V Emitter-base voltage (Collector open) VEBO –7 V Collector current IC –100 mA Peak collector current ICP –200 mA Total power dissipation PT 300 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C (C1) 6 (B1) 5 (C2) 4 Tr2 Tr1 1 (E1) 2 (E2) 3 (B2) Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = –10 µA, IE = 0 –60 V Collector-emitter voltage (Base open) VCEO IC = –2 mA, IB = 0 –50 V Emitter-base voltage (Collector open) VEBO IE = –10 µA, IC = 0 –7 V Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE = 0 – 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = –10 V, IB = 0 –100 µA Forward current transfer ratio hFE VCE = –10 V, IC = –2 mA 210 460 hFE (Small/Large) VCE = –10 V, IC = –2 mA 0.50 hFE ratio * Collector-emitter saturation voltage Transition frequency Collector output capacitance (Common base, input open circuited) VCE(sat) fT Cob 0.99 IC = –100 mA, IB = –10 mA – 0.2 VCE = –10 V, IC = –2 mA 150 MHz 2 pF VCB = –10 V, IE = 0, f = 1 MHz – 0.5 V Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Ratio between 2 elements Publication date: February 2010 ZJJ00535BED 1 This product complies with the RoHS Directive (EU 2002/95/EC). DMA20601 DMA20601_PT-Ta DMA20601_IC-VCE PT Ta IC VCE 400 600 IB = −600 µA 300 200 100 40 80 120 160 −400 µA −60 −40 −200 µA −20 −100 µA 0 200 −300 µA Ambient temperature Ta (°C) 0 −2 −4 Collector current IC (mA) Collector-emitter saturation voltage VCE(sat) (V) 120 IC / IB = 10 −1 Ta = 85°C −30°C 100 0 − 0.1 Ta = 85°C 80 −10 −100 −10 −100 IE = 0 f =1 MHz Ta = 25°C 3.0 −30°C 60 2.0 40 1.0 0 0 0.2 0.4 0.6 0.8 1.0 Base-emitter voltage VBE (V) fT IC VCE = −10 V Ta = 25°C 150 100 50 10 −1 Collector current IC (mA) 4.0 25°C 250 1 −30°C Cob VCB VCE = 10 V DMA20601_fT-IC 0 0.1 200 DMA20601_Cob-VCB 20 Collector current IC (mA) 200 25°C −12 25°C −1 300 IC VBE 100 − 0.01 − 0.1 Transition frequency fT (MHz) −10 Ta = 85°C DMA20601_IC-VBE VCE(sat) IC − 0.1 −8 400 Collector-emitter voltage VCE (V) DMA20601_VCEsat-IC −10 −6 500 Collector output capacitance (Common base, input open circuited) Cob (pF) 0 −500 µA −80 VCE = −10 V Forward current transfer ratio hFE Collector current IC (mA) Total power dissipation PT (mW) Ta = 25°C 100 Collector current IC (mA) 2 hFE IC −120 −100 0 DMA20601_hFE-IC ZJJ00535BED 1.2 0 1 10 100 Collector-base voltage VCB (V) This product complies with the RoHS Directive (EU 2002/95/EC). DMA20601 Mini6-G4-B Unit: mm +0.20 2.90 −0.05 +0.10 0.50 −0.05 +0.05 0.13 −0.02 +0.10 0.30 −0.05 1 2 3 (0.95) (0.95) 1.9 ±0.1 0.4 ±0.2 (0.65) 6° 1.50 −0.05 +0.2 4 2.8 −0.3 5 +0.25 6 +0.3 1.1 −0.1 0 to 0.1 1.1 −0.1 +0.2 8° ZJJ00535BED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805