DATA SHEET Part No. AN26112A Package Code No. ULGA006-F-1517 Publication date: November 2010 Ver. AEB 1 AN26112A Contents Overview …………………………………………………….……………………………………………………… 3 Features ………………………………………………….………………………………………………………… 3 Applications ………………………………………………….……………………………………………………… 3 Package ………………………………………………….…………………………………………………………. 3 Type ……………………………………………………….…………………………………………………………. 3 Application Circuit Example (Block Diagram) ………….………………………………………………………… 4 Pin Descriptions ………………………………………….………………………………………………………… 5 Absolute Maximum Ratings ……………………………….……………………………………………………… 6 Operating Supply Voltage Range …………………….…………………………………………………………… 6 Allowable Voltage Range …………………………………………………………………………………………… 7 Electrical Characteristics …………….…………………………………………………………………………… 8 Control Pin Mode Table ………………………….………………………………………………………………… 10 Truth Table ……………………………………………….…………………………………………………………. 10 Technical Data ………………………………………….…………………………………………………………… 11 y I/O block circuit diagrams and pin function descriptions …………………………………………………… 11 y PD ⎯ Ta diagram …………………………………………………………………………………………………. 12 Usage Notes ………………………………………….……………………………………………………………. 13 Ver. AEB 2 AN26112A AN26112A VHF/UHF amplifier IC with Path Through mode for TV Applications Overview y AN26112A is a VHF/UHF amplifier IC (40 MHz to 900 MHz) y Realizing high performance by using 0.30 μm Bi-CMOS process (fT = 20 GHz, fmax = 20 GHz). y Achieving miniaturization by using small size package. Features y With Path Through mode y Operation voltage y Current consumption yGain yNoise figure yDistortion (IIP3) +3.30 V typ. 68 mA typ. High Gain Path Through High Gain High Gain 12.5 dB typ. –2.0 dB typ. 3.0 dB typ. 12.0 dBm typ. fRX = 450 MHz, Z0 = 50 Ω fRX = 450 MHz, Z0 = 50 Ω fRX = 450 MHz, Z0 = 50 Ω fRX = 450 MHz, Z0 = 50 Ω y Small package (6 pin Plastic Package with heat sink). Applications y VHF /UHF Applications Package y 6 pin Fine Pitch Land Grid Array Package (LGA Type) Size : 1.52 mm × 1.72 mm × 0.40 mm Type y Bi–CMOS IC Ver. AEB 3 AN26112A Application Circuit Example (Block Diagram) Port2 (AMPOUT) Port3 (PTOUT) VDD C2 C3 C4 L1 VDD AMP_OUT 6 PT_OUT 5 4 Logic 1 RF_IN C1 2 3 VSS CNT CNT Port1 (RFIN) Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on the design of mass production set. y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. Ver. AEB 4 AN26112A Pin Descriptions Pin No. Pin name Type 1 RF_IN Input 2 VSS Ground 3 CNT Input 4 PT_OUT 5 VDD 6 AMP_OUT Output Power supply Output Description RF input VSS High Gain / Path Through mode control AMP RF output VDD Path Through output Ver. AEB 5 AN26112A Absolute Maximum Ratings Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values. A No. Parameter Symbol Rating Unit Notes 1 Supply voltage VDD 3.6 V *1 2 Supply current IDD 95 mA — 3 Power dissipation PD 83 mW *2 4 Operating ambient temperature Topr –20 to +80 °C *3 5 Storage temperature Tstg –40 to +150 °C *3 Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at Ta = 80°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to • PD-Ta diagram in the Technical Data standard and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. Operating Supply Voltage Range Parameter Supply voltage range Symbol Range Unit Notes VDD 3.13 to 3.47 V *1 Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Ver. AEB 6 AN26112A Allowable Voltage Range Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. y Do not apply voltage to N.C. pins. y Voltage values are with respect to the GND. y Applying external voltage to any pin not mentioned below leads to the malfunction and the damage of the device. y Below ratings are specified for prevention of malfunction and stress, not for guaranteed operation. Pin No. Pin name Rating Unit Notes — V *1 1 RF_IN 3 CNT –0.3 to (VDD + 0.3) V *3 4 PT_OUT –0.3 to (VDD + 0.3) V *2,3 6 AMP_OUT –0.3 to (VDD + 0.3) V *2,3 Notes) *1 : RF signal input pin (Maximum input power is TBD). Do not apply DC current. *2 : RF signal output pin. *3 : VDD + 0.3 V must not be exceeded 3.6 V. Ver. AEB 7 AN26112A Electrical Characteristics at VDD = 3.30 V Note) B No. Ta = 25°C±2°C unless otherwise specified. Parameter Symbol Conditions Limits Min Typ Max Unit Notes DC Electrical Characteristics DC-1 Supply current HG IDDH VDD current at High-gain mode No input signal — 68 85 mA — DC-2 Supply current PT IDDP VDD current at Path Through mode No input signal — 0.2 60 μA — DC-3 SW voltage (High-gain mode) VIH VIH = VDD × 0.85 2.81 3.30 — V — DC-4 SW voltage (Path Through mode) VIL VIH = VDD × 0.10 — 0.0 0.33 V — DC-5 SW current (High) IIH Current at CNT pin VIH = VDD — 3.3 10 μA — Ver. AEB 8 AN26112A Electrical Characteristics (continued) at VDD = 3.30 V Note) Ta = 25°C±2°C, fRX = 450 MHz, PRX = –15 dBm, Z0 = 50 Ω, CW unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Notes AC Electrical Characteristics A-1 Power Gain High Gain GHS Power Gain at High Gain mode f = fRX 10.5 12.5 14.5 dB — A-2 Power Gain Path Through GPS Power Gain at Path Through mode f = fRX –3.0 –2.0 –0.8 dB — A-3 IIP3 ±10 MHz offset High Gain IIP3 at High Gain mode f1 = 450 MHz f2 = 460 MHz Input 2 signals (f1, f2) 9.0 12.0 — dBm — IIP3HS Ver. AEB 9 AN26112A Control Pin Mode Table Note) Control voltage range : See B No. DC-3 / B No. DC-4 at page 8 Pin No. 3 Description High-gain/Path Through switching (Gain control) Pin voltage Low High Path Through High-gain Remarks — Truth Table Note) Control voltage range : See B No. DC-3 / B No. DC-4 at page 8 CNT LNA Mode High High-gain High-gain Low Path Through Path Through Ver. AEB 10 AN26112A Technical Data y I/O block circuit diagrams and pin function descriptions Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Voltage Internal Circuit Descriptions VDD 1 0.75 V RF input 1 VSS 2 0.0 V — GND 3 3 — High Gain / Path Through mode control GND VDD 4 0.0 V Path Through output 4 VSS 5 5 3.3 V Power supply VSS 6 6 — AMP output VSS Ver. AEB 11 AN26112A Technical Data y PD ⎯ Ta diagram Ver. AEB 12 AN26112A Usage Notes y Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [TV]. Consult our sales staff in advance for information on the following applications: x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. x Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book for any special application. 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safety including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. Ver. AEB 13 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202