AD ADXL335BCPZ Small, low power, accelerometer Datasheet

Small, Low Power, 3-Axis ±3 g
Accelerometer
ADXL335
FEATURES
GENERAL DESCRIPTION
3-axis sensing
Small, low profile package
4 mm × 4 mm × 1.45 mm LFCSP
Low power : 350 μA (typical)
Single-supply operation: 1.8 V to 3.6 V
10,000 g shock survival
Excellent temperature stability
BW adjustment with a single capacitor per axis
RoHS/WEEE lead-free compliant
The ADXL335 is a small, thin, low power, complete 3-axis accelerometer with signal conditioned voltage outputs. The product
measures acceleration with a minimum full-scale range of ±3 g.
It can measure the static acceleration of gravity in tilt-sensing
applications, as well as dynamic acceleration resulting from
motion, shock, or vibration.
The user selects the bandwidth of the accelerometer using the
CX, CY, and CZ capacitors at the XOUT, YOUT, and ZOUT pins.
Bandwidths can be selected to suit the application, with a
range of 0.5 Hz to 1600 Hz for the X and Y axes, and a range
of 0.5 Hz to 550 Hz for the Z axis.
APPLICATIONS
The ADXL335 is available in a small, low profile, 4 mm ×
4 mm × 1.45 mm, 16-lead, plastic lead frame chip scale package
(LFCSP_LQ).
Cost sensitive, low power, motion- and tilt-sensing
applications
Mobile devices
Gaming systems
Disk drive protection
Image stabilization
Sports and health devices
FUNCTIONAL BLOCK DIAGRAM
+3V
VS
ADXL335
OUTPUT AMP
~32kΩ
XOUT
CX
3-AXIS
SENSOR
CDC
AC AMP
DEMOD
OUTPUT AMP
~32kΩ
YOUT
CY
OUTPUT AMP
~32kΩ
ZOUT
CZ
ST
07808-001
COM
Figure 1.
Rev. B
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Fax: 781.461.3113 ©2009–2010 Analog Devices, Inc. All rights reserved.
ADXL335
TABLE OF CONTENTS
Features .............................................................................................. 1
Performance ................................................................................ 10
Applications ....................................................................................... 1
Applications Information .............................................................. 11
General Description ......................................................................... 1
Power Supply Decoupling ......................................................... 11
Functional Block Diagram .............................................................. 1
Setting the Bandwidth Using CX, CY, and CZ .......................... 11
Revision History ............................................................................... 2
Self-Test ....................................................................................... 11
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Design Trade-Offs for Selecting Filter Characteristics: The
Noise/BW Trade-Off .................................................................. 11
ESD Caution .................................................................................. 4
Use with Operating Voltages Other Than 3 V ........................... 12
Pin Configuration and Function Descriptions ............................. 5
Axes of Acceleration Sensitivity ............................................... 12
Typical Performance Characteristics ............................................. 6
Layout and Design Recommendations ................................... 13
Theory of Operation ...................................................................... 10
Outline Dimensions ....................................................................... 14
Mechanical Sensor...................................................................... 10
Ordering Guide .......................................................................... 14
REVISION HISTORY
1/10—Rev. A to Rev. B
Changes to Figure 21 ........................................................................ 9
7/09—Rev. 0 to Rev. A
Changes to Figure 22 ........................................................................ 9
Changes to Outline Dimensions................................................... 14
1/09—Revision 0: Initial Version
Rev. B | Page 2 of 16
ADXL335
SPECIFICATIONS
TA = 25°C, VS = 3 V, CX = CY = CZ = 0.1 μF, acceleration = 0 g, unless otherwise noted. All minimum and maximum specifications are
guaranteed. Typical specifications are not guaranteed.
Table 1.
Parameter
SENSOR INPUT
Measurement Range
Nonlinearity
Package Alignment Error
Interaxis Alignment Error
Cross-Axis Sensitivity 1
SENSITIVITY (RATIOMETRIC) 2
Sensitivity at XOUT, YOUT, ZOUT
Sensitivity Change Due to Temperature 3
ZERO g BIAS LEVEL (RATIOMETRIC)
0 g Voltage at XOUT, YOUT
0 g Voltage at ZOUT
0 g Offset vs. Temperature
NOISE PERFORMANCE
Noise Density XOUT, YOUT
Noise Density ZOUT
FREQUENCY RESPONSE 4
Bandwidth XOUT, YOUT 5
Bandwidth ZOUT5
RFILT Tolerance
Sensor Resonant Frequency
SELF-TEST 6
Logic Input Low
Logic Input High
ST Actuation Current
Output Change at XOUT
Output Change at YOUT
Output Change at ZOUT
OUTPUT AMPLIFIER
Output Swing Low
Output Swing High
POWER SUPPLY
Operating Voltage Range
Supply Current
Turn-On Time 7
TEMPERATURE
Operating Temperature Range
Conditions
Each axis
Min
Typ
±3
±3.6
±0.3
±1
±0.1
±1
Each axis
VS = 3 V
VS = 3 V
270
300
±0.01
330
mV/g
%/°C
VS = 3 V
VS = 3 V
1.35
1.2
1.5
1.5
±1
1.65
1.8
V
V
mg/°C
% of full scale
No external filter
No external filter
Self-Test 0 to Self-Test 1
Self-Test 0 to Self-Test 1
Self-Test 0 to Self-Test 1
−150
+150
+150
No load
No load
Max
g
%
Degrees
Degrees
%
150
300
μg/√Hz rms
μg/√Hz rms
1600
550
32 ± 15%
5.5
Hz
Hz
kΩ
kHz
+0.6
+2.4
+60
−325
+325
+550
V
V
μA
mV
mV
mV
−600
+600
+1000
0.1
2.8
1.8
VS = 3 V
No external filter
1
V
V
3.6
V
μA
ms
+85
°C
350
1
−40
Unit
Defined as coupling between any two axes.
Sensitivity is essentially ratiometric to VS.
Defined as the output change from ambient-to-maximum temperature or ambient-to-minimum temperature.
4
Actual frequency response controlled by user-supplied external filter capacitors (CX, CY, CZ).
5
Bandwidth with external capacitors = 1/(2 × π × 32 kΩ × C). For CX, CY = 0.003 μF, bandwidth = 1.6 kHz. For CZ = 0.01 μF, bandwidth = 500 Hz. For CX, CY, CZ = 10 μF,
bandwidth = 0.5 Hz.
6
Self-test response changes cubically with VS.
7
Turn-on time is dependent on CX, CY, CZ and is approximately 160 × CX or CY or CZ + 1 ms, where CX, CY, CZ are in microfarads (μF).
2
3
Rev. B | Page 3 of 16
ADXL335
ABSOLUTE MAXIMUM RATINGS
Rating
10,000 g
10,000 g
−0.3 V to +3.6 V
(COM − 0.3 V) to (VS + 0.3 V)
Indefinite
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
−55°C to +125°C
−65°C to +150°C
ESD CAUTION
Table 2.
Parameter
Acceleration (Any Axis, Unpowered)
Acceleration (Any Axis, Powered)
VS
All Other Pins
Output Short-Circuit Duration
(Any Pin to Common)
Temperature Range (Powered)
Temperature Range (Storage)
Rev. B | Page 4 of 16
ADXL335
1
ST
2
VS
NC
16
NC
VS
NC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
15
14
13
ADXL335
TOP VIEW
(Not to Scale)
12
XOUT
11
NC
10
YOUT
+Y
+X
COM
5
9
6
7
8
ZOUT
4
COM
NC
+Z
3
COM
COM
NC
07808-003
NC = NO CONNECT
NOTES
1. EXPOSED PAD IS NOT INTERNALLY
CONNECTED BUT SHOULD BE SOLDERED
FOR MECHANICAL INTEGRITY.
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
EP
1
Mnemonic
NC
ST
COM
NC
COM
COM
COM
ZOUT
NC
YOUT
NC
XOUT
NC
VS
VS
NC
Exposed Pad
Description
No Connect. 1
Self-Test.
Common.
No Connect.1
Common.
Common.
Common.
Z Channel Output.
No Connect.1
Y Channel Output.
No Connect. 1
X Channel Output.
No Connect. 1
Supply Voltage (1.8 V to 3.6 V).
Supply Voltage (1.8 V to 3.6 V).
No Connect. 1
Not internally connected. Solder for mechanical integrity.
NC pins are not internally connected and can be tied to COM pins, unless otherwise noted.
Rev. B | Page 5 of 16
ADXL335
TYPICAL PERFORMANCE CHARACTERISTICS
N > 1000 for all typical performance plots, unless otherwise noted.
40
50
40
% OF POPULATION
% OF POPULATION
30
30
20
20
10
1.42
1.44
1.46
1.48
1.50
1.52
1.54
1.56
1.58
OUTPUT (V)
0
07808-005
–0.36
–0.34
–0.32
–0.30
–0.28
–0.26
Figure 6. X-Axis Self-Test Response at 25°C, VS = 3 V
50
50
40
40
% OF POPULATION
% OF POPULATION
–0.38
VOLTS (V)
Figure 3. X-Axis Zero g Bias at 25°C, VS = 3 V
30
20
10
30
20
10
1.42
1.44
1.46
1.48
1.50
1.52
1.54
1.56
1.58
OUTPUT (V)
0
07808-006
0
–0.40
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
VOLTS (V)
Figure 4. Y-Axis Zero g Bias at 25°C, VS = 3 V
07808-009
0
07808-008
10
Figure 7. Y-Axis Self-Test Response at 25°C, VS = 3 V
40
25
20
% OF POPULATION
15
10
20
10
0
1.42
1.44
1.46
1.48
1.50
1.52
1.54
1.56
OUTPUT (V)
1.58
0
0.48
0.50
0.52
0.54
0.56
0.58
0.60
VOLTS (V)
Figure 8. Z-Axis Self-Test Response at 25°C, VS = 3 V
Figure 5. Z-Axis Zero g Bias at 25°C, VS = 3 V
Rev. B | Page 6 of 16
0.62
07808-010
5
07808-007
% OF POPULATION
30
ADXL335
30
1.55
N=8
1.54
1.53
1.52
20
OUTPUT (V)
% OF POPULATION
25
15
10
1.51
1.50
1.49
1.48
1.47
5
1.0
1.5
2.0
2.5
3.0
TEMPERATURE COEFFICIENT (mg/°C)
1.45
–40 –30 –20 –10
0
10
20
30
40
50
60
70
80
90 100
07808-014
0.5
90 100
07808-015
0
07808-011
–3.0 –2.5 –2.0 –1.5 –1.0 –0.5
90 100
07808-016
1.46
0
TEMPERATURE (°C)
Figure 9. X-Axis Zero g Bias Temperature Coefficient, VS = 3 V
Figure 12. X-Axis Zero g Bias vs. Temperature—
Eight Parts Soldered to PCB
1.55
40
N=8
1.54
1.53
1.52
OUTPUT (V)
% OF POPULATION
30
20
1.51
1.50
1.49
1.48
10
1.47
1.46
–3.0 –2.5 –2.0 –1.5 –1.0 –0.5
0
0.5
1.0
1.5
2.0
2.5
3.0
TEMPERATURE COEFFICIENT (mg/°C)
1.45
–40 –30 –20 –10
07808-012
0
0
10
20
30
40
50
60
70
80
TEMPERATURE (°C)
Figure 10. Y-Axis Zero g Bias Temperature Coefficient, VS = 3 V
Figure 13. Y-Axis Zero g Bias vs. Temperature—
Eight Parts Soldered to PCB
20
1.50
N=8
1.48
1.46
OUTPUT (V)
1.44
10
1.42
1.40
1.38
1.36
5
1.34
1.32
0
–7 –6 –5 –4 –3 –2 –1
0
1
2
3
4
5
6
7
TEMPERATURE COEFFICIENT (mg/°C)
07808-013
% OF POPULATION
15
1.30
–40 –30 –20 –10
0
10
20
30
40
50
60
70
80
TEMPERATURE (°C)
Figure 14. Z-Axis Zero g Bias vs. Temperature—
Eight Parts Soldered to PCB
Figure 11. Z-Axis Zero g Bias Temperature Coefficient, VS = 3 V
Rev. B | Page 7 of 16
ADXL335
20
0.320
N=8
0.315
0.310
SENSITIVITY (V/g)
% OF POPULATION
15
10
5
0.305
0.300
0.295
0.290
SENSITIVITY (V/g)
0.280
–40 –30 –20 –10
07808-017
0
0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315
0
10
20
30
40
50
60
70
80
90 100
TEMPERATURE (°C)
Figure 15. X-Axis Sensitivity at 25°C, VS = 3 V
07808-020
0.285
Figure 18. X-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 3 V
0.320
25
N=8
0.315
20
SENSITIVITY (V/g)
% OF POPULATION
0.310
15
10
0.305
0.300
0.295
0.290
5
0
10
20
30
40
50
60
70
80
90 100
07808-021
SENSITIVITY (V/g)
0.280
–40 –30 –20 –10
07808-018
0
0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315
90 100
07808-022
0.285
TEMPERATURE (°C)
Figure 19. Y-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 3 V
Figure 16. Y-Axis Sensitivity at 25°C, VS = 3 V
25
0.320
N=8
0.315
20
SENSITIVITY (V/g)
15
10
0.305
0.300
0.295
0.290
5
0.285
0
0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315
SENSITIVITY (V/g)
07808-019
% OF POPULATION
0.310
0.280
–40 –30 –20 –10
0
10
20
30
40
50
60
70
80
TEMPERATURE (°C)
Figure 20. Z-Axis Sensitivity vs. Temperature—
Eight Parts Soldered to PCB, VS = 3 V
Figure 17. Z-Axis Sensitivity at 25°C, VS = 3 V
Rev. B | Page 8 of 16
ADXL335
350
CX = CY = CZ = 0.0047µF
300
CH4: ZOUT,
500mV/DIV
200
100
CH2: X OUT,
500mV/DIV
CH1: POWER,
1V/DIV
OUTPUTS ARE OFFSET FOR CLARITY
50
0
1.5
2.0
2.5
3.0
3.5
4.0
SUPPLY (V)
Figure 21. Typical Current Consumption vs. Supply Voltage
TIME (1ms/DIV)
Figure 22. Typical Turn-On Time, VS = 3 V
Rev. B | Page 9 of 16
07808-024
CH3: YOUT,
500mV/DIV
150
07808-023
CURRENT (µA)
250
ADXL335
THEORY OF OPERATION
The ADXL335 is a complete 3-axis acceleration measurement
system. The ADXL335 has a measurement range of ±3 g minimum. It contains a polysilicon surface-micromachined sensor
and signal conditioning circuitry to implement an open-loop
acceleration measurement architecture. The output signals are
analog voltages that are proportional to acceleration. The
accelerometer can measure the static acceleration of gravity
in tilt-sensing applications as well as dynamic acceleration
resulting from motion, shock, or vibration.
The sensor is a polysilicon surface-micromachined structure
built on top of a silicon wafer. Polysilicon springs suspend the
structure over the surface of the wafer and provide a resistance
against acceleration forces. Deflection of the structure is measured using a differential capacitor that consists of independent
fixed plates and plates attached to the moving mass. The fixed
plates are driven by 180° out-of-phase square waves. Acceleration
deflects the moving mass and unbalances the differential capacitor
resulting in a sensor output whose amplitude is proportional to
acceleration. Phase-sensitive demodulation techniques are then
used to determine the magnitude and direction of the
acceleration.
The demodulator output is amplified and brought off-chip
through a 32 kΩ resistor. The user then sets the signal
bandwidth of the device by adding a capacitor. This filtering
improves measurement resolution and helps prevent aliasing.
MECHANICAL SENSOR
The ADXL335 uses a single structure for sensing the X, Y, and
Z axes. As a result, the three axes’ sense directions are highly
orthogonal and have little cross-axis sensitivity. Mechanical
misalignment of the sensor die to the package is the chief
source of cross-axis sensitivity. Mechanical misalignment
can, of course, be calibrated out at the system level.
PERFORMANCE
Rather than using additional temperature compensation circuitry, innovative design techniques ensure that high performance
is built in to the ADXL335. As a result, there is no quantization
error or nonmonotonic behavior, and temperature hysteresis
is very low (typically less than 3 mg over the −25°C to +70°C
temperature range).
Rev. B | Page 10 of 16
ADXL335
APPLICATIONS INFORMATION
POWER SUPPLY DECOUPLING
For most applications, a single 0.1 μF capacitor, CDC, placed
close to the ADXL335 supply pins adequately decouples the
accelerometer from noise on the power supply. However, in
applications where noise is present at the 50 kHz internal clock
frequency (or any harmonic thereof), additional care in power
supply bypassing is required because this noise can cause errors
in acceleration measurement.
If additional decoupling is needed, a 100 Ω (or smaller) resistor
or ferrite bead can be inserted in the supply line. Additionally, a
larger bulk bypass capacitor (1 μF or greater) can be added in
parallel to CDC. Ensure that the connection from the ADXL335
ground to the power supply ground is low impedance because
noise transmitted through ground has a similar effect to noise
transmitted through VS.
SETTING THE BANDWIDTH USING CX, CY, AND CZ
The ADXL335 has provisions for band limiting the XOUT, YOUT,
and ZOUT pins. Capacitors must be added at these pins to implement low-pass filtering for antialiasing and noise reduction. The
equation for the 3 dB bandwidth is
F−3 dB = 1/(2π(32 kΩ) × C(X, Y, Z))
or more simply
F–3 dB = 5 μF/C(X, Y, Z)
The tolerance of the internal resistor (RFILT) typically varies as
much as ±15% of its nominal value (32 kΩ), and the bandwidth
varies accordingly. A minimum capacitance of 0.0047 μF for CX,
CY, and CZ is recommended in all cases.
DESIGN TRADE-OFFS FOR SELECTING FILTER
CHARACTERISTICS: THE NOISE/BW TRADE-OFF
The selected accelerometer bandwidth ultimately determines
the measurement resolution (smallest detectable acceleration).
Filtering can be used to lower the noise floor to improve the
resolution of the accelerometer. Resolution is dependent on
the analog filter bandwidth at XOUT, YOUT, and ZOUT.
The output of the ADXL335 has a typical bandwidth of greater
than 500 Hz. The user must filter the signal at this point to
limit aliasing errors. The analog bandwidth must be no more
than half the analog-to-digital sampling frequency to minimize
aliasing. The analog bandwidth can be further decreased to
reduce noise and improve resolution.
The ADXL335 noise has the characteristics of white Gaussian
noise, which contributes equally at all frequencies and is
described in terms of μg/√Hz (the noise is proportional to the
square root of the accelerometer bandwidth). The user should
limit bandwidth to the lowest frequency needed by the application to maximize the resolution and dynamic range of the
accelerometer.
With the single-pole, roll-off characteristic, the typical noise of
the ADXL335 is determined by
rms Noise = Noise Density × ( BW × 1.6 )
It is often useful to know the peak value of the noise. Peak-topeak noise can only be estimated by statistical methods. Table 5
is useful for estimating the probabilities of exceeding various
peak values, given the rms value.
Table 4. Filter Capacitor Selection, CX, CY, and CZ
Bandwidth (Hz)
1
10
50
100
200
500
Never expose the ST pin to voltages greater than VS + 0.3 V.
If this cannot be guaranteed due to the system design (for
instance, if there are multiple supply voltages), then a low
VF clamping diode between ST and VS is recommended.
Capacitor (μF)
4.7
0.47
0.10
0.05
0.027
0.01
Table 5. Estimation of Peak-to-Peak Noise
SELF-TEST
The ST pin controls the self-test feature. When this pin is set to
VS, an electrostatic force is exerted on the accelerometer beam.
The resulting movement of the beam allows the user to test if
the accelerometer is functional. The typical change in output
is −1.08 g (corresponding to −325 mV) in the X-axis, +1.08 g
(or +325 mV) on the Y-axis, and +1.83 g (or +550 mV) on the
Z-axis. This ST pin can be left open-circuit or connected to
common (COM) in normal use.
Peak-to-Peak Value
2 × rms
4 × rms
6 × rms
8 × rms
Rev. B | Page 11 of 16
% of Time That Noise Exceeds
Nominal Peak-to-Peak Value
32
4.6
0.27
0.006
ADXL335
USE WITH OPERATING VOLTAGES OTHER THAN 3 V
The ADXL335 is tested and specified at VS = 3 V; however, it
can be powered with VS as low as 1.8 V or as high as 3.6 V. Note
that some performance parameters change as the supply voltage
is varied.
The ADXL335 output is ratiometric, therefore, the output
sensitivity (or scale factor) varies proportionally to the
supply voltage. At VS = 3.6 V, the output sensitivity is typically 360 mV/g. At VS = 2 V, the output sensitivity is typically
195 mV/g.
Self-test response in g is roughly proportional to the square of
the supply voltage. However, when ratiometricity of sensitivity
is factored in with supply voltage, the self-test response in volts
is roughly proportional to the cube of the supply voltage. For
example, at VS = 3.6 V, the self-test response for the ADXL335
is approximately −560 mV for the X-axis, +560 mV for the
Y-axis, and +950 mV for the Z-axis.
At VS = 2 V, the self-test response is approximately −96 mV for
the X-axis, +96 mV for the Y-axis, and −163 mV for the Z-axis.
The supply current decreases as the supply voltage decreases.
Typical current consumption at VS = 3.6 V is 375 μA, and typical current consumption at VS = 2 V is 200 μA.
The zero g bias output is also ratiometric, thus the zero g
output is nominally equal to VS/2 at all supply voltages.
AXES OF ACCELERATION SENSITIVITY
The output noise is not ratiometric but is absolute in volts;
therefore, the noise density decreases as the supply voltage
increases. This is because the scale factor (mV/g) increases
while the noise voltage remains constant. At VS = 3.6 V,
the X-axis and Y-axis noise density is typically 120 μg/√Hz,
whereas at VS = 2 V, the X-axis and Y-axis noise density is
typically 270 μg/√Hz.
AZ
AX
07808-025
AY
Figure 23. Axes of Acceleration Sensitivity; Corresponding Output Voltage
Increases When Accelerated Along the Sensitive Axis.
XOUT = –1g
YOUT = 0g
ZOUT = 0g
TOP
GRAVITY
TOP
TOP
XOUT = 0g
YOUT = –1g
ZOUT = 0g
TOP
XOUT = 1g
YOUT = 0g
ZOUT = 0g
XOUT = 0g
YOUT = 0g
ZOUT = 1g
Figure 24. Output Response vs. Orientation to Gravity
Rev. B | Page 12 of 16
XOUT = 0g
YOUT = 0g
ZOUT = –1g
07808-026
XOUT = 0g
YOUT = 1g
ZOUT = 0g
ADXL335
LAYOUT AND DESIGN RECOMMENDATIONS
The recommended soldering profile is shown in Figure 25 followed by a description of the profile features in Table 6. The recommended
PCB layout or solder land drawing is shown in Figure 26.
CRITICAL ZONE
TL TO TP
tP
TP
tL
TSMAX
TSMIN
tS
RAMP-DOWN
PREHEAT
07808-002
TEMPERATURE
RAMP-UP
TL
t25°C TO PEAK
TIME
Figure 25. Recommended Soldering Profile
Table 6. Recommended Soldering Profile
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time (TSMIN to TSMAX)(tS)
TSMAX to TL
Ramp-Up Rate
Time Maintained Above Liquidous (TL)
Liquidous Temperature (TL)
Time (tL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C to Peak Temperature
0.50
MAX
Sn63/Pb37
3°C/sec max
Pb-Free
3°C/sec max
100°C
150°C
60 sec to 120 sec
150°C
200°C
60 sec to 180 sec
3°C/sec max
3°C/sec max
183°C
60 sec to 150 sec
240°C + 0°C/−5°C
10 sec to 30 sec
6°C/sec max
6 minutes max
217°C
60 sec to 150 sec
260°C + 0°C/−5°C
20 sec to 40 sec
6°C/sec max
8 minutes max
4
0.65
0.325
0.35
MAX
0.65
4
1.95
0.325
1.95
DIMENSIONS SHOWN IN MILLIMETERS
Figure 26. Recommended PCB Layout
Rev. B | Page 13 of 16
07808-004
EXPOSED PAD IS NOT
INTERNALLY CONNECTED
BUT SHOULD BE SOLDERED
FOR MECHANICAL INTEGRITY.
ADXL335
OUTLINE DIMENSIONS
0.35
0.30
0.25
0.65
BSC
12
1.50
1.45
1.40
0.55
0.50
0.45
8
1
2.55
2.40 SQ
2.25
5
4
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.15 REF
SEATING
PLANE
16
13
EXPOSED
PAD
9
TOP VIEW
PIN 1
INDICATOR
0.15 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
051909-A
PIN 1
INDICATOR
4.15
4.00 SQ
3.85
Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP_LQ]
4 mm × 4 mm Body, 1.45 mm Thick Quad
(CP-16-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADXL335BCPZ
ADXL335BCPZ–RL
ADXL335BCPZ–RL7
EVAL-ADXL335Z
1
Measurement Range
±3 g
±3 g
±3 g
Specified Voltage
3V
3V
3V
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Z = RoHS Compliant Part.
Rev. B | Page 14 of 16
Package Description
16-Lead LFCSP_LQ
16-Lead LFCSP_LQ
16-Lead LFCSP_LQ
Evaluation Board
Package Option
CP-16-14
CP-16-14
CP-16-14
ADXL335
NOTES
Rev. B | Page 15 of 16
ADXL335
NOTES
Analog Devices offers specific products designated for automotive applications; please consult your local Analog Devices sales representative for details. Standard products sold by
Analog Devices are not designed, intended, or approved for use in life support, implantable medical devices, transportation, nuclear, safety, or other equipment where malfunction of
the product can reasonably be expected to result in personal injury, death, severe property damage, or severe environmental harm. Buyer uses or sells standard products for use in the
above critical applications at Buyer's own risk and Buyer agrees to defend, indemnify, and hold harmless Analog Devices from any and all damages, claims, suits, or expenses resulting
from such unintended use.
©2009–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07808-0-1/10(B)
Rev. B | Page 16 of 16
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