TI CY74FCT162500CTPVC 18-bit registered transceiver Datasheet

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
18-Bit Registered Transceivers
SCCS056A - August 1994 - Revised October 2001
Features
•
•
•
•
•
•
•
•
CY74FCT16500T
CY74FCT162500T
Functional Description
FCT-C speed at 4.6 ns
Ioff supports partial-power- mode operation
Edge-rate control circuitry for significantly improved
noise characteristics
Typical output skew < 250 ps
ESD > 2000V
TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
Industrial temperature range of −40˚C to +85˚C
VCC = 5V ± 10%
These 18-bit universal bus transceivers can be operated in
transparent, latched, or clock modes by combining D-type
latches and D-type flip-flops. Data flow in each direction is
controlled by output-enable (OEAB and OEBA), latch enable
(LEAB and LEBA), and clock inputs (CLKAB and CLKBA)
inputs. For A-to-B data flow, the device operates in transparent
mode when LEAB is HIGH. When LEAB is LOW, the A data is
latched if CLKAB is held at a HIGH or LOW logic level. If LEAB
is LOW, the A bus data is stored in the latch/flip-flop on the
HIGH-to-LOW transition of CLKAB. OEAB performs the output
enable function on the B port. Data flow from B-to-A is similar
to that of A-to-B and is controlled by OEBA, LEBA, and
CLKBA.
CY74FCT16500T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
CY74FCT162500T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
The CY74FCT16500T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162500T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162500T is ideal for driving transmission lines.
SSOP/TSSOP
Top View
Logic Block Diagram
OEAB
LEAB
1
56
2
55
GND
CLKAB
A1
3
54
B1
GND
4
53
GND
A2
5
52
B2
A3
6
51
B3
VCC
7
50
VCC
A4
49
B4
OEBA
8
A5
9
48
B5
CLKAB
A6
10
47
B6
GND
11
46
GND
A7
12
13
45
B7
44
B8
A9
A 10
14
43
B9
15
42
B10
A 11
16
41
B11
A 12
17
40
B12
GND
18
39
38
GND
B13
OEAB
CLKBA
LEBA
LEAB
C
A8
C
B1
A1
D
D
C
C
A 13
19
D
D
A 14
20
37
B14
A 15
21
36
B15
VCC
22
35
VCC
A 16
A 17
23
34
B16
24
25
33
B17
32
GND
26
31
B18
27
30
CLKBA
28
29
GND
TO 17 OTHER CHANNELS
FCT16500-1
GND
A 18
OEBA
LEBA
FCT16500-2
Copyright
© 2001, Texas Instruments Incorporated
CY74FCT16500T
CY74FCT162500T
Maximum Ratings[5, 6]
Pin Summary
Name
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Description
OEAB
A-to-B Output Enable Input
OEBA
B-to-A Output Enable Input (Active LOW)
LEAB
A-to-B Latch Enable Input
Ambient Temperature with
Power Applied................................... Com’l −55°C to +125°C
LEBA
B-to-A Latch Enable Input
DC Input Voltage .................................................−0.5V to +7.0V
CLKAB
A-to-B Clock Input (Active LOW)
DC Output Voltage ..............................................−0.5V to +7.0V
CLKBA
B-to-A Clock Input (Active LOW)
A
A-to-B Data Inputs or B-to-A Three-State Outputs
DC Output Current
(Maximum Sink Current/Pin) ...........................−60 to +120 mA
B
B-to-A Data Inputs or A-to-B Three-State Outputs
Storage Temperature ....................... Com’l −55°C to +125°C
Power Dissipation .......................................................... 1.0W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
[1, 2]
Function Table
Inputs
Operating Range
Outputs
OEAB
LEAB
CLKAB
A
B
L
X
X
X
Z
H
H
X
L
L
H
H
X
H
H
H
L
L
L
H
L
H
H
H
L
H
X
B[3]
H
L
L
X
B[4]
Range
Industrial
Ambient
Temperature
VCC
−40°C to +85°C
5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter
Description
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Test Conditions
Min.
Typ.[7]
Max.
2.0
V
0.8
Hysteresis[8]
VH
Input
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=−18 mA
IIH
Input HIGH Current
IIL
Input LOW Current
IOZH
Unit
100
mV
−1.2
V
VCC=Max., VI=VCC
±1
µA
VCC=Max., VI=GND.
±1
µA
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=2.7V
±1
µA
IOZL
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
IOS
Short Circuit Current[9]
VCC=Max., VOUT=GND
−80
−200
mA
IO
Output Drive Current[9]
VCC=Max., VOUT=2.5V
−50
−180
mA
Power-Off Disable
VCC=0V, VOUT≤4.5V[10]
±1
µA
IOFF
−0.7
V
−140
Notes:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance.
= HIGH-to-LOW Transition.
2. A-to-B data flow is shown, B-to-A data flow is similar but uses OEBA, LEBA, and CLKBA.
3. Output level before the indicated steady-state input conditions were established.
4. Output level before the indicated steady-state input conditions were established, provided that CLKAB was LOW before LEAB went LOW.
5. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.
6. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
7. Typical values are at VCC= 5.0V, TA= +25˚C ambient.
8. This parameter is specified but not tested.
9. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
10. Tested at +25˚C.
2
CY74FCT16500T
CY74FCT162500T
Output Drive Characteristics for CY74FCT16500T
Parameter
VOH
VOL
Min.
Typ.[7]
VCC=Min., IOH=−3 mA
2.5
3.5
VCC=Min., IOH=−15 mA
2.4
3.5
VCC=Min., IOH=−32 mA
2.0
3.0
Description
Output HIGH Voltage
Output LOW Voltage
Test Conditions
VCC=Min., IOL=64 mA
Max.
Unit
V
0.2
0.55
V
Typ.[7]
Max.
Unit
Output Drive Characteristics for CY74FCT162500T
Parameter
Description
[9]
Test Conditions
Min.
IODL
Output LOW Current
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
60
115
150
mA
IODH
Output HIGH Current[9]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
−60
−115
−150
mA
VOH
Output HIGH Voltage
VCC=Min., IOH=−24 mA
2.4
3.3
VOL
Output LOW Voltage
VCC=Min., IOL=24 mA
V
0.3
0.55
V
Typ.[7]
Capacitance[8] (TA = +25˚C, f = 1.0 MHz)
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
VIN = 0V
4.5
6.0
pF
COUT
Output Capacitance
VOUT = 0V
5.5
8.0
pF
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[7]
Max.
Unit
5
500
µA
0.5
1.5
mA
ICC
Quiescent Power Supply Current VCC=Max.
VIN≤0.2V,
VIN≥VCC−0.2V
∆ICC
Quiescent Power Supply Current
(TTL inputs HIGH)
VCC=Max.
VIN=3.4V[11]
ICCD
Dynamic Power Supply
Current[12]
VCC=Max., One Input Toggling, VIN=VCC or
50%DutyCycle,OutputsOpen, VIN=GND
OEAB=OEBA=VCC or GND
75
120
µA/MHz
IC
Total Power Supply Current[13]
VCC=Max., f0=10 MHz
(CLKAB), f1=5 MHz, 50% Duty
Cycle, Outputs Open,
One Bit Toggling,
OEAB=OEBA=VCC
LEAB=GND
VIN=VCC or
VIN=GND
0.8
1.7
mA
VIN=3.4V or
VIN=GND
1.3
3.2
mA
VIN=VCC or
VIN=GND
3.8
6.5[14]
mA
VIN=3.4V or
VIN=GND
8.5
20.8[14]
mA
VCC=Max., f0=10 MHz,
f1=2.5 MHz, 50% Duty
Cycle, Outputs Open,
Eighteen Bits Toggling,
OEAB=OEBA=VCC
LEAB=GND
Notes:
11. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
12. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
13. IC
= IQUIESCENT + IINPUTS + IDYNAMIC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
DH
= Number of TTL inputs at DH
NT
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
= Number of inputs changing at f1
N1
All currents are in milliamps and all frequencies are in megahertz.
14. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
3
CY74FCT16500T
CY74FCT162500T
Switching Characteristics Over the Operating Range[15]
CY74FCT16500CT/
CY74FCT162500AT CY74FCT162500CT
Parameter
Description
Min.
Max.
Min.
Max.
Unit
150
Fig.
No.[16]
fMAX
CLKAB or CLKBA frequency
150
MHz
tPLH
tPHL
Propagation Delay
A to B or B to A
1.5
5.1
1.5
4.6
ns
1, 3
tPLH
tPHL
Propagation Delay
LEBA to A, LEAB to B
1.5
5.6
1.5
5.3
ns
1, 5
tPLH
tPHL
Propagation Delay
CLKBA to A, CLKAB to B
1.5
5.6
1.5
5.3
ns
1, 5
tPZH
tPZL
Output Enable Time
OEBA to A, OEAB to B
1.5
6.0
1.5
5.4
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
OEBA to A, OEAB to B
1.5
5.6
1.5
5.2
ns
1, 7, 8
tSU
Set-Up Time, HIGH or LOW
A to CLKAB, B to CLKBA
3.0
3.0
ns
9
tH
Hold Time, HIGH or LOW
A to CLKAB, B to CLKBA
0
0
ns
9
tSU
Set-Up Time, HIGH or LOW
A to LEAB, B to LEBA
Clock HIGH
3.0
3.0
ns
4
Clock LOW
1.5
1.5
ns
4
tH
Hold Time, HIGH or LOW
A to LEAB, B to LEBA
1.5
1.5
ns
4
tW
LEAB or LEBA Pulse Width HIGH
3.0
2.5
ns
5
tW
CLKAB or CLKBA Pulse Width HIGH or LOW
3.0
ns
5
tSK(O)
Output Skew[17]
3.0
0.5
0.5
ns
Ordering Information CY74FCT16500T
Speed
(ns)
4.6
Ordering Code
Package
Name
Package Type
CY74FCT16500CTPACT
Z56
56-Lead (240-Mil) TSSOP
CY74FCT16500CTPVC/PVCT
O56
56-Lead (300-Mil) SSOP
Operating
Range
Industrial
Ordering Information CY74FCT162500T
Speed
(ns)
4.6
5.1
Ordering Code
Package
Name
Package Type
CY74FCT162500CTPVC
O56
56-Lead (300-Mil) SSOP
74FCT162500CTPVCT
O56
56-Lead (300-Mil) SSOP
CT74FCT162500ATPVC
O56
56-Lead (300-Mil) SSOP
74FCT162500ATPVCT
O56
56-Lead (300-Mil) SSOP
Notes:
15. Minimum limits are specified but not tested on Propagation Delays.
16. See “Parameter Measurement Information” in the General Information section.
17. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
4
Operating
Range
Industrial
Industrial
CY74FCT16500T
CY74FCT162500T
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
5
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74FCT162500ATPVCG4
ACTIVE
SSOP
DL
56
74FCT162500ATPVCT
ACTIVE
SSOP
DL
56
74FCT162500CTPVCG4
ACTIVE
SSOP
DL
56
74FCT162500CTPVCT
ACTIVE
SSOP
DL
74FCT16500CTPACTE4
ACTIVE
TSSOP
74FCT16500CTPACTG4
ACTIVE
74FCT16500CTPVCG4
20
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16500CTPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162500ATPVC
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162500CTPVC
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16500CTPACT
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16500CTPVC
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16500CTPVCT
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162500ATPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162500CTPVCTG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
20
20
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74FCT162500ATPVCT
Package Package Pins
Type Drawing
SSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
74FCT162500CTPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
CY74FCT16500CTPACT
TSSOP
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
CY74FCT16500CTPVCT
SSOP
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74FCT162500ATPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
74FCT162500CTPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
CY74FCT16500CTPACT
TSSOP
DGG
56
2000
346.0
346.0
41.0
CY74FCT16500CTPVCT
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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