BCD AP2201K2.6TRE1 150ma rf uldo regulator Datasheet

Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
General Description
Features
The AP2201 is a 150mA output current fixed voltage
regulator designed to provide very low noise (45µVrms
at 80Hz-100KHz), ultra low dropout voltage (typically
165mV at 150mA), very low quiescent current (1µA
maximum) and excellent power supply ripple rejection
(PSRR 75dB at 100Hz) in battery powered applications, such as handsets and PDAs and in noise sensitive
applications, such as RF electronics.
·
·
·
Up to 150mA Regulator Output
Low Quiescent Current
Low Dropout Voltage: VD=165mV at 150mA
·
·
·
High Precision Output Voltage: ±1%
Output Noise: 45µVrms at 80Hz-100KHz
Good Ripple Rejection Ability: 75dB at 100Hz
and IOUT=100µA
·
·
·
·
·
·
·
Tight Load and Line Regulation
Low Temperature Coefficient
Over Current Protection
Thermal Protection
Reverse-battery Protection
Zero Off-mode Current
Logic-controlled Enable
The AP2201 also features individual logic compatible
enable/shutdown control inputs, a low power shutdown
mode for extended battery life, over current protection,
over temperature protection, as well as reversed-battery protection.
The output capacitor of 1.0µF minimum and 2.2µF
minimum near its pin are recommended when CBYP is
not used and when CBYP is 470pF respectively. The
output capacitor should have 5Ω or less ESR, tantalum
or aluminium electrolytic capacitors are adequate.
Bypass capacitor is connected to the internal voltage
reference to quiet noise. Its recommended value is
from 470pF to 1nF. If output noise is not a major concern and rapid turn-on is necessary, omit CBYP and
leave BYP open.
Applications
·
·
·
·
·
·
·
The AP2201 has 2.6V, 2.8V and 3.0V versions now.
Cellular Phones
Cordless Phones
Digital Still Cameras
Wireless Communicators
PDAs / Palmtops
PC Mother Board
Consumer Electronics
The AP2201 is available in space saving 5-pin SOT23-5 package.
VIN=3.8V
VIN
AP2201-2.8
VIN
VOUT
VOUT=2.8V
EN
CIN
1.0µF
GND
+
BYP
CBYP
VOUT
COUT
2.2µF
tantalum
470pF
SOT-23-5
Figure 2. Package Type of AP2201
Figure 1. Typical Application of AP2201
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Pin Configuration
K Package
(SOT-23-5)
EN
1
GND
2
BYP
3
5
VIN
4
VOUT
Figure 3. Pin Configuration of AP2201 (Top View)
Pin Description
Pin Number
Pin Name
Function
1
EN
2
GND
Ground.
3
BYP
Bypass capacitor for low noise operation.
4
VOUT
Regulated output voltage.
5
VIN
Logic high enable input.
Input voltage.
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Functional Block Diagram
VIN
BYP
5
4
VOUT
3
+
EN
Bandgap
Ref.
1
Current Limit
Thermal Shutdown
2
GND
Figure 4. Functional Block Diagram of AP2201
Ordering Information
AP2201
E1: Lead Free
Blank: Tin Lead
Circuit Type
TR: Tape and Reel
Package
2.6: Fixed Output 2.6V
2.8: Fixed Output 2.8V
3.0: Fixed Output 3.0V
K: SOT-23-5
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Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Ordering Information (Continued)
Package
SOT-23-5
Part Number
Temperature
Range
-40 to 125oC
Marking ID
Packing Type
Tin Lead
Lead Free
Tin Lead
Lead Free
AP2201K-2.6TR
AP2201K-2.6TRE1
K1E
E1E
Tape & Reel
AP2201K-2.8TR
AP2201K-2.8TRE1
K1G
E1G
Tape & Reel
AP2201K-3.0TR
AP2201K-3.0TRE1
K1I
E1I
Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Value
Unit
Supply Input Voltage
VIN
15
V
Enable Input Voltage
VEN
15
V
PD
Internally Limited
W
TLEAD
260
oC
TSTG
-65 to 150
oC
200
V
Power Dissipation
Lead Temperature (Soldering, 5sec)
Storage Temperature
ESD (Machine Model)
θJA
Thermal Resistance
(Note 2)
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Note 2: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a
function of the maximum junction temperature, TJ(max), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(max)=(TJ(max) TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will
go into thermal shutdown.
Recommended Operating Conditions
Parameter
Symbol
Min
Max
Unit
Supply Input Voltage
VIN
2.5
13.2
V
Enable Input Voltage
VEN
0
13.2
V
TJ
-40
125
oC
Operating Junction Temperature
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Electrical Characteristics
VIN=VOUT +1V, IOUT = 100µA, CL = 2.2µF, VEN≥ 2.0V, TJ = 25oC, Bold typeface applies over -40oC<TJ<125oC, unless otherwise specified.
Parameter
Symbol
Output Voltage Accuracy
∆VO/VO
Output Voltage
Temperature Coefficient
Line Regulation
Load Regulation (Note 4)
∆VO /∆T
VRLINE
VRLOAD
Conditions
Min
Variation from specified
VOUT
(Note 3)
Typ
Max
-1
1
-2
2
1
AP2201-2.8V
VIN= VOUT +1V to 13.2V
1
AP2201-3.0V
VIN= VOUT +1V to 13.2V
1
AP2201-2.6V
IOUT= 0.1mA to 150mA
1
AP2201-2.8V
IOUT= 0.1mA to 150mA
1
AP2201-3.0V
IOUT= 0.1mA to 150mA
1
3
13
4
mV
14
4
14
8
16
9
mV
18
9
18
15
IOUT=100µA
%
µV/oC
120
AP2201-2.6V
VIN= VOUT +1V to 13.2V
Unit
50
70
110
IOUT=50mA
Dropout Voltage (Note 5)
150
230
VIN-VO
IOUT=100mA
140
250
165
275
mV
300
IOUT=150mA
350
Quiescent Current
IQ
VEN ≤ 0.4V (shutdown)
0.01
VEN ≤ 0.18V (shutdown)
1
µA
5
VEN ≥ 2.0V, IOUT=0µA
180
VEN ≥ 2.0V, IOUT=100µA
182
245
265
Ground Pin Current (Note 6)
250
270
IGND
VEN ≥ 2.0V, IOUT=50mA
350
µA
600
800
VEN ≥ 2.0V, IOUT=100mA
600
1000
1500
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Electrical Characteristics (Continued)
VIN=VOUT +1V, IOUT = 100µA, CL = 2.2µF, VEN≥ 2.0V, TJ = 25oC, Bold typeface applies over -40oC<TJ<125oC, unless otherwise specified.
Parameter
Symbol
Ground Pin Current (Note 6)
IGND
Conditions
Min
VEN ≥ 2.0V, IOUT=150mA
Typ
Max
Unit
1300
1900
µA
2500
Ripple Rejection
PSRR
frequency=100Hz, IOUT=100µA
75
Current Limit
ILIMIT
VOUT = 0V
320
260
Output Noise
(Regulator B only)
eno
IOUT=50mA, CL=2.2µF,
470 pF from BYP to GND
Enable Input
Voltage
Logic-Low
VIL
Regulator shutdown
Enable Input
Voltage
Logic-High
Enable Input
Current
Logic-Low
Enable Input
Current
Logic-High
dB
550
mA
nV / Hz
0.4
V
0.18
VIH
IIL
IIH
Regulator enabled
VIL≤ 0.4V
2.0
V
0.01
VIL≤ 0.18V
VIL≥ 2.0V
VIL≥ 2.0V
-1
µA
-2
5
20
µA
25
Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature
range.
Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal
value measured at 1V differential.
Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the
supply is the sum of the load current plus the ground pin current.
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Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Typical Performance Characteristics
350
2.900
2.875
Dropout Voltage (mV)
2.850
Output Voltage (V)
IOUT=50mA
300
AZ2201-2.8V
2.825
2.800
2.775
2.750
250
IOUT=100mA
IOUT=150mA
CIN=1.0µF, CL=2.2µF, CBYP=1nF
200
150
100
50
2.725
2.700
-60
-40
-20
0
20
40
60
80
100
120
0
-60
140
-40
-20
o
20
40
60
80
100
120
140
Junction Temperature ( C)
Figure 5. Output Voltage vs. Junction Temperature
Figure 6. Dropout Voltage vs. Junction Temperature
5000
6
5
4000
AP2201-2.8V
IOUT=50mA
IOUT=100mA
Ground Pin Current (µA)
4
Ground Pin Current (mA)
0
o
Junction Temperature ( C)
3
2
1
0
-1
-2
3000
2000
IOUT=150mA
VIN=3.8V,VEN=2.0V,CIN=1.0µF,
CL=2.2µF,CBYP=1nF
1000
0
-1000
-3
-2000
-60
-4
0
10
20
30
40
50
60
70
80
90 100 110 120 130 140 150
-40
-20
0
20
40
60
80
100
120
140
o
Junction Temperature ( C)
Output Current (mA)
Figure 7. Ground Pin Current vs. Output Current
Figure 8. Ground Pin Current vs. Junction Temperature
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Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Typical Performance Characteristics (Continued)
2.0
20
1.8
16
VEN=3.0V
1.7
14
VEN=4.0V
1.6
CIN=1.0µF,CL=2.2µF,CBYP=1nF
1.5
VIN=3.8V,IOUT=5mA
Enable Voltage (V)
1.9
VEN=2.0V
18
Enable Current (µA)
AP2201-2.8V
VEN=on
VEN=1.8V
AP2201-2.8V
VIN=3.8V, CIN=1.0µF, CL=2.2µF,
12
IOUT=100µA, CBYP=1nF
10
8
6
VEN=off
1.4
1.3
1.2
1.1
1.0
0.9
4
0.8
2
0
-60
0.7
-40
-20
0
20
40
60
80
100
120
0.6
-60
140
-40
-20
0
20
40
60
80
100
120
140
o
o
Junction Temperature ( C)
Junction Temperature ( C)
Figure 9. Enable Current vs. Junction Temperature
Figure 10. Enable Voltage vs. Junction Temperature
200
Output Current
150
100
Output Voltage
Noise (µVrms)
AP2201-2.8V
50
0
10
100
1000
10000
Time (µs)
Bypass Capacitor (pF)
Figure 11. Noise vs. Bypass Capacitor
Figure 12. Load Transient
(Conditions: VIN=3.8V, CBYP=680pF, VEN=2V,
IOUT=5mA to 50mA, CL=2.2µF)
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Typical Performance Characteristics (Continued)
AP2201-2.8V
Output Voltage
Output Voltage
Input Voltage
Enable Voltage
AP2201-2.8V
Time (µs)
Time (µs)
Figure 13. Line Transient
(Conditions: VIN=3.8V to 4.8V, VEN=2V, IOUT=100µA
CBYP=680pF, CL=10µF)
Figure 14. VEN(on) vs. VO
(Conditions: VEN=0V to 2V, VIN=3.8V, IOUT=30mA,
CBYP=open, CL=2.2µF)
0
-10
AP2201-2.8V
-20
PSRR (dB)
-30
-40
-50
-60
-70
-80
-90
-100
100
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 15. PSRR vs. Frequency
( Conditions: CIN =1.0µF, CL = 2.2µF, CBYP= open,
VIN=3.8V, IOUT=10mA, VEN=2V)
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Application Information
The output capacitor should have an ESR of about
5Ω or less. In most cases, tantalum or aluminium
electrolytic capacitors are adequate.
External Capacitors
The AP2201 requires external capacitors for regulator stability. These capacitors must be correctly
selected for good performance.
Noise Bypass Capacitor
Bypass capacitor is connected to the internal voltage
reference. A 680pF capacitor connected from BYP to
GND make this reference quiet, resulting in a
significant reduction in output noise. When using
CBYP, output capacitors of 2.2µF or greater are
required for better stability.
Input Capacitor
If there is more than 10 inches of wire between the
input and the AC filter or if a battery is used as the
input, at least a 1µF capacitor should be placed from
IN to GND.
Output Capacitor
It is required to prevent oscillation. 1.0µF minimum
is recommended when CBYP is not used. 2.2µF minimum is recommended when CBYP is 470pF. The output capacitor may be increased without limit for large
values to improve transient response.
The start-up speed of the AP2201 is inversely
proportional to the value of reference bypass
capacitor. In some cases if output noise is not a major
concern and rapid turn-on is necessary, omit CBYP
and leave BYP open.
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2201
Mechanical Dimensions
SOT-23-5
Unit: mm(inch)
0.300(0.012)
0.600(0.024)
1.500(0.059)
1.700(0.067)
0.100(0.004)
0.200(0.008)
2.950(0.116)
2.650(0.104)
2.820(0.111)
3.020(0.119)
0.200(0.008)
0.700(0.028)
REF
0.300(0.012)
0.400(0.016)
0°
8°
1.800(0.071)
2.000(0.079)
1.250(0.049)
1.050(0.041)
0.950(0.037)
TYP
0.000(0.000)
0.100(0.004)
1.050(0.041)
1.150(0.045)
BCD Semiconductor Manufacturing Limited
Jun. 2005 Rev. 1. 0
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IMPORTANT NOTICE
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for
use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any
liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others.
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