TPS852 TOSHIBA Photo-IC Silicon Epitaxial Planar TPS852 Mobile Phones Notebook PCs, PDAs Video cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment The TPS852 is an ultra-compact surface-mount photo-IC for illuminance sensors which incorporates a photodiode and current amp circuit in a single chip. The sensitivity is superior to that of a phototransistor, and exhibits little variation. It has spectral sensitivity closer to luminous efficiency and excellent output linearity. With its ultra-compact surface-mount package, this photo-IC can be used as the power-saving control for domestic appliances or for backlighting for displays in cellular phones, this device enables low power consumption to be achieved. • • • • • • Ultra-compact and light surface-mount package: 1.6 × 1.6 × 0.55 mm Excellent output linearity of illuminance Little fluctuation in light current and high level of sensitivity TOSHIBA ― : IL = 40 μA (typ.) @EV = 100 lx using fluorescent light Weight: 0.003 g (typ.) : Light current variation width: ×1.67 (when light current classification is specified.) : Little temperature fluctuation Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources : IL (using incandescent light)/IL (using fluorescent light) = 1.2 (typ.) Low supply voltage, making device suitable for battery-powered equipment: VCC = 2.7 V to 5.5 V Lead(Pb)-Free Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Supply voltage VCC Output voltage VOUT −0.5 to 7 < = VCC V V Light current IL 5 mA Permissible power dissipation P 35 mW ΔP/°C −0.5 mW/°C Operating temperature range Topr −30 to 85 °C Storage temperature range Tstg −40 to 100 °C Soldering temperature range (Note 1) Tsol 260 °C Power dissipation derating (Ta > 25°C) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions. 1 2007-10-01 TPS852 Electrical and Optical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Supply voltage VCC Ta=25℃ Supply current ICC VCC = 3 V, EV = 1000 lx RL = 1 kΩ Light current (1) IL (1) Light current (2) IL (2) Light current (3) IL (3) Light current ratio IL (1) IL (3) Dark current ILEAK Saturation output voltage VO Peak sensitivity wavelength λp Switching time Rise time tr Fall time tf Delay time td Storage time ts (Note 2) VCC = 3 V, EV = 100 lx (Note 2), (Note 4) VCC = 3 V, EV = 10 lx (Note 3), (Note 4) VCC = 3 V, EV = 100 lx (Note 3), (Note 4) ⎯ VCC = 3.3 V, EV = 0 VCC = 3 V, RL = 150 kΩ, EV = 100 lx (Note 3) ⎯ VCC = 3 V, RL = 5 kΩ (Note 5) Min Typ. Max Unit 2.7 ⎯ 5.5 V ⎯ 480 950 μA ⎯ 48 91.8 μA 2.7 4.0 5.4 μA 27 40 54 μA ⎯ 1.2 1.7 ⎯ ⎯ 0.1 μA 2.2 2.35 ⎯ V ⎯ 600 ⎯ nm ⎯ 11 1000 ⎯ 400 2000 ⎯ 250 ⎯ ⎯ 35 ⎯ μs Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light). Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process. IL classification IL (3) → A: 30 μA to 50 μA Note 4: Light current measurement circuit Light source VCC IL TPS852 OUT A Note 5: Switching time measurement method Pulse drive IF VCC White LED TPS852 OUT 1.5 V 90% RL VOUT 10% GND 2 tf tr td ts 2007-10-01 TPS852 3 2 0.20 Package Dimensions 1 Unit: mm Tolerance: ± 0.1 ( ): Reference value 4 5 0.50 0.50 Size of light-receiving area: (0.51mm x 0.12mm) 6 0.20 0.20 1.60 1.20 : Light-receiving area 0.3Typ. 1.60 5° max0.2 5° 0.10 0.55 0.10 5° max0.2 (0.8) Pin connection 1. VCC 2. GND 3. GND 4. GND 5. GND 6. OUT Weight: 0.003 g (typ.) Block Diagram 1. VCC Current amp 6. OUT 2. GND 3. GND 4. GND 5. GND 3 2007-10-01 TPS852 Handling Precautions When Vcc is turned on it takes at least 200 ms for the internal circuit to stabilize. During this time the output signal is unstable. Please do not use the unstable signal as the output signal. Moisture-Proof Packing (1) (2) (3) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. Since the optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture and they should therefore be stored under the following conditions: Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max) Baking in taping with reel is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h. These devices are packed on tapes; hence, please avoid baking at high temperature. Recommended baking conditions: 60°C for 12 h or longer, Perform baking only once Mounting Precautions (1) (2) (3) Do not apply stress to the resin at high temperature. The resin part is easily scratched, so avoid friction with hard materials. When installing the assembly board in equipment, ensure that this product does not come into contact with other components. Mounting Methods Reflow soldering • Package surface temperature: 260°C (max) • Please perform reflow soldering using the following reference temperature profile. Perform reflow soldering no more than twice. Temperature (°C) → (1) 260°C max 230°C 190°C 180°C Preheating part 60 s to 120 s 30 s to 50 s Heating part Time (s) → • Please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile. • Second reflow soldering In case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. Storage conditions before second reflow soldering: 30°C, 70% RH or lower • Do not perform flow soldering. • Make any necessary soldering correction manually. (do not do this more than once for any given pin.) Temperature: no more than 350°C (25 W for soldering iron) Time: within 5 s 4 2007-10-01 TPS852 (2) Recommended soldering pattern Unit: mm 0.45 0.3 1.35 1.0 (3) 0.5 0.5 Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50°C × 30 s or 30°C × 3 mins Ultrasonic cleaning: 300 W or less Packing Specification (1) (2) Packing quantity Reel (minimum packing quantity) 3,000 devices Carton 5 reels (15,000 devices) Packing format An aluminum envelope containing silica gel and reels is deaerated and sealed. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. • Carton specification Label Carton dimensions (W) 81 mm × (L) 280 mm × (H) 280 mm 5 2007-10-01 TPS852 Tape Packing Specifications Reel dimensions Reel material: Plastic Unit: mm 11.4 9.0 φ180 5.0 φ60 (1) Enlarged view of reel center 5.0 φ21 ± 0.8 2 ± 0.5 120° φ13 ± 0.2 6 2007-10-01 TPS852 (2) Tape dimensions Tape material: Plastic (anti-electrostatic) Unit: mm +0.1 φ1.5 −0 2.0±0.05 B' 1.75±0.1 4.0±0.1 0.25 ± 0.05 φ1.1±0.1 B 4.0±0.1 1.7 ± 0.1 max 6° max 6° 1.8 ± 0.1 max 6° A' B 0.85 ± 0.1 (2.75) A 8.0±0.2 3.5±0.1 B' max 6° A A' Product direction 7 2007-10-01 TPS852 Reel Label The label markings may include product number, tape type and quantity. Sensor hole P/N TYPE ADDC TPS852 Q’TY 3,000 pcs. NOTE Position of label Leader and Trailer Sections of Tape Note 1 : The leader portion shell consist of cover tape minimum length of 300 mm and a piece of carrier tape with empty portion of 100 mm minimum. Note 2 : The trailer portion shall consist of empty carrier of more than 10 cavities. 8 2007-10-01 TPS852 P – Ta ILEAK – Ta (typ.) 1 40 VCC = 3 V 30 (μA) 25 Dark current ILEAK Power dissipation P (mW) 35 20 15 10 0.1 0.01 0.001 5 0 0 20 40 60 80 0.0001 20 100 40 Ambient temperature Ta (°C) IL – EV (typ.) 10000 80 Relative IL – Ta 1.40 100 (typ.) VCC = 3 V EV = 100 lx using fluorescent light 1.20 Relative light current 1000 Light current IL (μA) 60 Ambient temperature Ta (°C) 100 1.00 0.80 10 0.60 −40 1 10 100 1000 10000 Luminance EV (lx) 20 40 60 80 VO – EV 10 Relative IL – VCC 100 (typ.) (typ.) 1 Output voltage VO (V) 1.6 0 Ambient temperature Ta (°C) Ta = 25°C VCC = 3 V A light source Fluorescent light 0.1 1 −20 Relative light current 1.2 0.8 0.1 Ta = 25°C VCC = 3 V 0.01 Fluorescent light RL=5.1kΩ Fluorescent light RL= 30 kΩ Fluorescent light RL=100 kΩ A light source RL = 5.1 kΩ A light source RL = 30 kΩ A light source RL = 100 kΩ 0.4 Ta = 25°C 0 2 3 4 Supply voltage 5 VCC 6 7 0.001 (V) 1 10 100 1000 10000 Luminance EV (lx) 9 2007-10-01 TPS852 ICC – EV (typ.) Relative consumption current (μA) 100 Consumption current ICC Relative ICC – Ta 1.40 1000 10 0.1 1 10 100 1000 1.00 0.80 0.60 −40 Ta = 25°C VCC = 3 V using A light source RL = 5.1 kΩ RL = 50 kΩ RL = 100 kΩ 1 1.20 (typ.) VCC = 3 V EV = 100 lx Using A light source RL = 1 kΩ −20 0 20 40 60 80 100 Ambient temperature Ta (°C) 10000 Luminance EV (lx) Switching Characteristics (non-saturating operation) 10000 Switching Characteristics (saturating operation) (typ.) Ta = 25°C VCC = 3 V VOUT = 1.5 V Using white LED Ta = 25°C VCC = 3 V VOUT > =2V Using white LED 1000 1000 Switching time (μs) Switching time (μs) (typ.) 10000 100 tf 100 tf td 10 10 td ts ts tr 1 0.1 tr 1 Load resistance RL 10 1 0.1 100 (kΩ) 1 Load resistance RL 10 10 100 (kΩ) 2007-10-01 TPS852 Switching Time Measurement Circuit and Waveforms Pulse drive IF VCC td White LED TPS852 ts 1.5 V OUT 90% RL VOUT GND Spectral Response 10% tr tf Radiation Pattern (typ.) 100 Ta = 25°C Luminosity angle 30° 80 20° 10° 0° 10° (typ.) Ta = 25°C 20° 30° Relative sensitivity 40° 40° 50° 60 50° 60° 60° 70° 40 80° 90° 20 0 200 70° 400 600 800 1000 80° 0 0.2 0.4 0.6 0.8 90° 1.0 1200 Wavelength λ (nm) 11 2007-10-01 TPS852 RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 12 2007-10-01