TC74HC4094AP/AF/AFN TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74HC4094AP,TC74HC4094AF,TC74HC4094AFN 8-Bit Shift and Store Register (3-state) Note: The TC74HC4094A is a high speed CMOS 8-BIT SHIFT AND STROBE REGISTER fabricated with silicon gate C2MOS technology. It achieves the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. It consists of an 8-bit shift register and an 8-bit latch with 3-state output buffers. Data is shifted serially though the shift register on the positive going transition of the CK input. The output of the last stage (Qs) can be used to cascade several devices. Data on the Qs output is transferred to a second output (Q’s) on the following negative transition of the CK input. The data in each stage of the shift register is provided to a corresponding latch, on the negative going transition of the STROBE input. When STROBE is held high, data propagates through the latch to a 3-state output buffer. This buffer is enabled when OUTPUT ENABLE input is set high. All inputs are equipped with protection circuits against static discharge or transient excess voltage. Features xxxFN (JEDEC SOP) is not available in Japan. TC74HC4094AP TC74HC4094AF TC74HC4094AFN • High speed: fmax = 73 MHz (typ.) at VCC = 5 V • Low power dissipation: ICC = 4 μA (max) at Ta = 25°C • High noise immunity: VNIH = VNIL = 28% VCC (min) • Output drive capability: 10 LSTTL loads • • Symmetrical output impedance: |IOH| = IOL = 4 mA (min) ∼ tpHL Balanced propagation delays: tpLH − • Wide operating voltage range: VCC (opr) = 2 to 6 V • Pin and function compatible with 4094B Weight DIP16-P-300-2.54A SOP16-P-300-1.27A SOL16-P-150-1.27 Pin Assignment 1 : 1.00 g (typ.) : 0.18 g (typ.) : 0.13 g (typ.) 2007-10-01 TC74HC4094AP/AF/AFN IEC Logic Symbol Truth Table CK OE ST SI H H L H H H L L Para. Out Seri. Out Q1 Qn Qs Q’s L Qn − 1 Q7 NC H H Qn − 1 Q7 NC * NC NC Q7 NC * * Z Z Q7 NC H * * NC NC NC Qs L * * Z Z NC Qs X: Don’t care NC: No change Z : High impedance Timing Chart 2 2007-10-01 TC74HC4094AP/AF/AFN System Diagram Absolute Maximum Ratings (Note 1) Characteristics Symbol Rating Unit Supply voltage range VCC −0.5 to 7 V DC input voltage VIN −0.5 to VCC + 0.5 V DC output voltage VOUT −0.5 to VCC + 0.5 V Input diode current IIK ±20 mA Output diode current IOK ±20 mA DC output current IOUT ±25 mA DC VCC/ground current ICC ±50 mA Power dissipation PD 500 (DIP) (Note 2)/180 (SOP) mW Storage temperature Tstg −65 to 150 °C Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be applied until 300 mW. 3 2007-10-01 TC74HC4094AP/AF/AFN Operating Ranges (Note) Characteristics Symbol Rating Unit Supply voltage VCC 2 to 6 V Input voltage VIN 0 to VCC V VOUT 0 to VCC V −40 to 85 °C Output voltage Operating temperature Topr 0 to 1000 (VCC = 2.0 V) Input rise and fall time 0 to 500 (VCC = 4.5 V) tr, tf ns 0 to 400 (VCC = 6.0 V) Note: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Electrical Characteristics DC Characteristics Characteristics High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage Symbol VOH VOL Min Typ. Max Min Max 2.0 1.50 ⎯ ⎯ 1.50 ⎯ 4.5 3.15 ⎯ ⎯ 3.15 ⎯ 6.0 4.20 ⎯ ⎯ 4.20 ⎯ 2.0 ⎯ ⎯ 0.50 ⎯ 0.50 4.5 ⎯ ⎯ 1.35 ⎯ 1.35 6.0 ⎯ ⎯ 1.80 ⎯ 1.80 2.0 1.9 2.0 ⎯ 1.9 ⎯ 4.5 4.4 4.5 ⎯ 4.4 ⎯ 6.0 5.9 6.0 ⎯ 5.9 ⎯ IOH = −4 mA 4.5 4.18 4.31 ⎯ 4.13 ⎯ IOH = −5.2 mA 6.0 5.68 5.80 ⎯ 5.63 ⎯ 2.0 ⎯ 0.0 0.1 ⎯ 0.1 IOL = 20 μA 4.5 ⎯ 0.0 0.1 ⎯ 0.1 6.0 ⎯ 0.0 0.1 ⎯ 0.1 IOL = 4 mA 4.5 ⎯ 0.17 0.26 ⎯ 0.33 IOL = 5.2 mA 6.0 ⎯ 0.18 0.26 ⎯ 0.33 6.0 ⎯ ⎯ ±0.5 ⎯ ±5.0 μA ⎯ VIL VIN = VIH or VIL VIN = VIH or VIL Unit VCC (V) ⎯ VIH Ta = −40 to 85°C Ta = 25°C Test Condition IOH = −20 μA VIN = VIH or VIL V V V V 3-state output off-state current IOZ Input leakage current IIN VIN = VCC or GND 6.0 ⎯ ⎯ ±0.1 ⎯ ±1.0 μA Quiescent supply current ICC VIN = VCC or GND 6.0 ⎯ ⎯ 4.0 ⎯ 40.0 μA VOUT = VCC or GND 4 2007-10-01 TC74HC4094AP/AF/AFN Timing Requirements (input: tr = tf = 6 ns) Characteristics Symbol Minimum pulse width tW (H) (CK) tW (L) Minimum pulse width (STROBE) Minimum set-up time (SERIAL) Minimum set-up time (STROBE) Minimum hold time (SERIAL) Minimum hold time (STROBE) Clock frequency Ta = 25°C Test Condition Typ. Limit Limit 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 100 125 4.5 ⎯ 20 25 6.0 ⎯ 17 21 2.0 ⎯ 0 0 4.5 ⎯ 0 0 6.0 ⎯ 0 0 2.0 ⎯ 0 0 4.5 ⎯ 0 0 6.0 ⎯ 0 0 2.0 ⎯ 6 5 4.5 ⎯ 30 24 6.0 ⎯ 35 28 Test Condition Min Typ. Max Unit ⎯ ⎯ 4 8 ns ⎯ ⎯ 22 35 ns ⎯ ⎯ 16 25 ns ⎯ ⎯ 16 27 ns ⎯ 13 25 ns 33 73 ⎯ MHz ⎯ ⎯ ts ⎯ ts ⎯ th ⎯ th ⎯ f Unit VCC (V) ⎯ tW (H) Ta = −40 to 85°C ns ns ns ns ns ns MHz AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25°C, input: tr = tf = 6 ns) Characteristics Output transition time Symbol tTLH tTHL Propagation delay time tpLH (CK-Qn) tpHL Propagation delay time tpLH (CK-QS, Q’S) tpHL Propagation delay time tpLH (STROBE-Qn) tpHL 3-state output enable time Maximum clock frequency tpZL tpZH RL = 1 kΩ ⎯ fmax 5 2007-10-01 TC74HC4094AP/AF/AFN AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns) Output transition time Symbol tTLH tTHL Propagation delay time tpLH (CK-Qn) tpHL Propagation delay time tpLH (CK-QS, Q’S) tpHL Propagation delay time tpLH (STROBE-Qn) tpHL 3-state output enable time 3-state output disable time Maximum clock frequency Input capacitance Bus input capacitance Power dissipation capacitance Note: ⎯ tpZL tpZH tpLZ tpHZ ⎯ ⎯ ⎯ RL = 1 kΩ RL = 1 kΩ fmax ⎯ Ta = −40 to 85°C Ta = 25°C Test Condition Characteristics VCC (V) Min Typ. Max Min Max 2.0 ⎯ 30 75 ⎯ 95 4.5 ⎯ 8 15 ⎯ 19 6.0 ⎯ 7 13 ⎯ 16 2.0 ⎯ 92 200 ⎯ 250 4.5 ⎯ 26 40 ⎯ 50 6.0 ⎯ 20 34 ⎯ 43 2.0 ⎯ 65 150 ⎯ 190 4.5 ⎯ 19 30 ⎯ 38 6.0 ⎯ 15 26 ⎯ 32 2.0 ⎯ 75 160 ⎯ 200 4.5 ⎯ 20 32 ⎯ 40 6.0 ⎯ 16 27 ⎯ 34 2.0 ⎯ 58 150 ⎯ 190 4.5 ⎯ 16 30 ⎯ 38 6.0 ⎯ 13 26 ⎯ 32 2.0 ⎯ 35 150 ⎯ 190 4.5 ⎯ 16 30 ⎯ 38 6.0 ⎯ 13 26 ⎯ 32 2.0 6 16 ⎯ 5 ⎯ 4.5 30 66 ⎯ 24 ⎯ 6.0 35 80 ⎯ 28 ⎯ Unit ns ns ns ns ns ns MHz CIN ⎯ ⎯ 5 10 ⎯ 10 pF COUT ⎯ ⎯ 10 ⎯ ⎯ ⎯ pF ⎯ ⎯ 140 ⎯ ⎯ ⎯ pF CPD (Note) CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC 6 2007-10-01 TC74HC4094AP/AF/AFN Package Dimensions Weight: 1.00 g (typ.) 7 2007-10-01 TC74HC4094AP/AF/AFN Package Dimensions Weight: 0.18 g (typ.) 8 2007-10-01 TC74HC4094AP/AF/AFN Package Dimensions (Note) Note: This package is not available in Japan. Weight: 0.13 g (typ.) 9 2007-10-01 TC74HC4094AP/AF/AFN RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 10 2007-10-01