ON CS51033GD8G Fast p−ch fet buck controller Datasheet

CS51033
Fast P−Ch FET Buck
Controller
The CS51033 is a switching controller for use in DC−DC
converters. It can be used in the buck topology with a minimum
number of external components. The CS51033 consists of a 1.0 A
power driver for controlling the gate of a discrete P−Channel
transistor, fixed frequency oscillator, short circuit protection timer,
programmable Soft−Start, precision reference, fast output voltage
monitoring comparator, and output stage driver logic with latch.
The high frequency oscillator allows the use of small inductors and
output capacitors, minimizing PC board area and systems cost. The
programmable Soft−Start reduces current surges at start up. The short
circuit protection timer significantly reduces the P−Ch FET duty cycle
to approximately 1/30 of its normal cycle during short circuit
conditions.
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1
SOIC−8
D SUFFIX
CASE 751
Features
•
•
•
•
•
•
•
•
1.0 A Totem Pole Output Driver
High Speed Oscillator (700 kHz max)
No Stability Compensation Required
Lossless Short Circuit Protection
2.0% Precision Reference
Programmable Soft−Start
Wide Ambient Temperature Range:
♦ Industrial Grade: −40°C to 85°C
♦ Commercial Grade: 0°C to 70°C
Pb−Free Packages are Available
MARKING DIAGRAM
8
51033
ALYWx
G
1
51033
A
L
Y
W
x
G
=
=
=
=
=
=
Device Code
Assembly Location
Wafer Lot
Year
Work Week
Continuation of Device Code
x = Y or G
= Pb−Free Package
PIN CONNECTIONS
VGATE
1
VC
PGND
CS
COSC
GND
VCC
VFB
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 10
1
Publication Order Number:
CS51033/D
CS51033
3.3VIN
CIN
100 mF
D2
1N4148
RC
10 W
D4
1N5818
C1
D3
1N4148
0.1 mF
RG
VC V
GATE
VCC
COSC
U1
CS51033
10 W
IRF7404
0.1 mF
VFB
4.7 mH
1.5VOUT
@ 3.0 Amp
100
C2
1.0 mF
C3
100 mF
COSC
150 pF
GND PGND CS
0.1 mF
CS
C0
100 mF
0.1 mF
100 mF
C4
0.1 mF
D1
1N5821
GND
GND
RA
1.5 k
RB
300
Note: Capacitors C2, C3, and C4, are low
ESR tantalum caps used for noise reduction.
Figure 1. Typical Application Diagram
MAXIMUM RATINGS
Rating
Value
Unit
Power Supply Voltage, VCC
5.0
V
Driver Supply Voltage, VC
20
V
Driver Output Voltage, VGATE
20
V
COSC, CS, VFB (Logic Pins)
5.0
V
Peak Output Current
1.0
A
Steady State Output Current
200
mA
Operating Junction Temperature, TJ
150
°C
−65 to 150
°C
2.0
kV
45
165
°C/W
°C/W
230 peak
°C
Storage Temperature Range, TS
ESD (Human Body Model)
Package Thermal Resistance,
Junction−to−Case, RqJC
Junction−to−Ambient, RqJA
Lead Temperature Soldering:
Reflow (SMD styles only) (Note 1)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. 60 sec. max above 183°C.
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CS51033
ELECTRICAL CHARACTERISTICS (Specifications apply for 3.135 ≤ VCC ≤ 3.465, 3.0 V ≤ VC ≤ 16 V;
Industrial Grade: −40°C < TA < 85°C; −40°C < TJ < 125°C: Commercial Grade: 0°C < TA < 70°C; 0°C < TJ < 125°C, unless otherwise specified.)
Characteristic
Oscillator
Test Conditions
Min
Typ
Max
Unit
160
200
240
kHz
VFB = 1.2 V
Frequency
COSC = 470 pF
Charge Current
1.4 V < VCOSC < 2.0 V
−
110
−
mA
Discharge Current
2.7 V > VCOSC > 2.0 V
−
660
−
mA
Maximum Duty Cycle
1 − (tOFF/tON)
80.0
83.3
−
%
Short Circuit Timer
VFB = 1.0 V; CS = 0.1 mF; VCOSC = 2.0 V
Charge Current
1.0 V < VCS < 2.0 V
175
264
325
mA
Fast Discharge Current
2.55 V > VCS > 2.4 V
40
66
80
mA
Slow Discharge Current
2.4 V > VCS > 1.5 V
4.0
6.0
10
mA
0.70
0.85
1.40
ms
Start Fault Inhibit Time
−
Valid Fault Time
2.6 V > VCS > 2.4 V
0.2
0.3
0.45
ms
GATE Inhibit Time
2.4 V > VCS > 1.5 V
9.0
15
23
ms
−
2.5
3.1
4.6
%
−
−
2.5
−
V
Duty Cycle
CS Comparator
VFB = 1.0 V
Fault Enable CS Voltage
Max CS Voltage
VFB = 1.5 V
−
2.6
−
V
Fault Detect Voltage
VCS when GATE goes high
−
2.4
−
V
Fault Inhibit Voltage
Minimum VCS
−
1.5
−
V
Hold Off Release Voltage
VFB = 0 V
0.4
0.7
1.0
V
Regulator Threshold Voltage Clamp
VCS = 1.5 V
0.725
0.866
1.035
V
VFB Comparators
VCOSC = VCS = 2.0 V
Regulator Threshold Voltage
TJ = 25°C (Note 2)
TJ = −40 to 125°C
1.225
1.210
1.250
1.250
1.275
1.290
V
V
Fault Threshold Voltage
TJ = 25°C (Note 2)
TJ = −40 to 125°C
1.12
1.10
1.15
1.15
1.17
1.19
V
V
Threshold Line Regulation
3.135 V ≤ VCC ≤ 3.465
−
6.0
15
mV
Input Bias Current
VFB = 0 V
−
1.0
4.0
mA
Voltage Tracking
(Regulator Threshold − Fault Threshold Voltage)
70
100
120
mV
−
4.0
20
mV
Input Hysteresis Voltage
Power Stage
−
VC = 10 V; VFB = 1.2 V
GATE DC Low Saturation Voltage
VCOSC = 1.0 V; 200 mA Sink
−
1.2
1.5
V
GATE DC High Saturation Voltage
VCOSC = 2.7 V; 200 mA Source; VC = VGATE
−
1.5
2.1
V
Rise Time
CGATE = 1.0 nF; 1.5 V < VGATE < 9.0 V
−
25
60
ns
Fall Time
CGATE = 1.0 nF; 9.0 V > VGATE > 1.5 V
−
25
60
ns
ICC
3.135 V < VCC < 3.465 V, Gate switching
−
3.5
6.0
mA
IC
3.0 V < VC < 16 V, Gate non−switching
−
2.7
4.0
mA
Current Drain
2. Guaranteed by design, not 100% tested in production.
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CS51033
PACKAGE PIN DESCRIPTION
Pin Number
Pin Symbol
Function
1
VGATE
Driver pin to gate of external P−Ch FET.
2
PGND
Output power stage ground connection.
3
COSC
Oscillator frequency programming capacitor.
4
GND
Logic ground.
5
VFB
Feedback voltage input.
6
VCC
Logic supply voltage.
7
CS
Soft−Start and fault timing capacitor.
8
VC
Driver supply voltage.
VC
VCC
RG
IC
Oscillator
VGATE
Flip−Flop
+ Comparator
A1
−
COSC
7IC
G1
R
VGATE
Q
F2
Q
2.5 V
−
−
+
−
+
1.5 V
PGND
S
G2
VFB
Comparator
A6
+
0.7 V
−
+
+
VCC
−
+
Hold Off
Comp
VFB
1.25 V
−
VCC
−
+
G4
1.15 V
CS Charge
Sense
Comparator
−
+
Fault
Comp
G3
A4
+
−
IT
CS
Comparator
+
A2
−
R
G5
2.4 V
2.3 V
Q
F1
2.5 V
−
+
1.5 V
−
+
IT
5
−
+
IT
55
−
+
CS
−
A3
+
Slow Discharge
Comparator
S
Q
Slow Discharge
Flip−Flop
GND
Figure 2. Block Diagram
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CS51033
CIRCUIT DESCRIPTION
THEORY OF OPERATION
control loop and the output voltage to slowly increase. Once
the CS pin charges above the Holdoff Comparator trip point
of 0.7 V, the low feedback to the VFB Comparator sets the
GATE flip−flop during COSC’s charge cycle. Once the
GATE flip−flop is set, VGATE goes low and turns on the
P−Ch FET. When VCS exceeds 2.4 V, the CS charge sense
comparator (A4) sets the VFB comparator reference to 1.25
V completing the startup cycle.
Control Scheme
The CS51033 monitors the output voltage to determine
when to turn on the P−Ch FET. If VFB falls below the internal
reference voltage of 1.25 V during the oscillator’s charge
cycle, the P−Ch FET is turned on and remains on for the
duration of the charge time. The P−Ch FET gets turned off
and remains off during the oscillator’s discharge cycle time
with the maximum duty cycle to 80%. It requires 7.0 mV
typical, and 20 mV maximum ripple on the VFB pin to
operate. This method of control does not require any loop
stability compensation.
Lossless Short Circuit Protection
The CS51033 has “lossless” short circuit protection since
there is no current sense resistor required. When the voltage
at the CS pin (the fault timing capacitor voltage ) reaches
2.5 V, the fault timing circuitry is enabled. During normal
operation the CS voltage is 2.6 V. During a short circuit or
a transient condition, the output voltage moves lower and the
voltage at VFB drops. If VFB drops below 1.15 V, the output
of the fault comparator goes high and the CS51033 goes into
a fast discharge mode. The fault timing capacitor, CS,
discharges to 2.4 V. If the VFB voltage is still below 1.15 V
when the CS pin reaches 2.4 V, a valid fault condition has
been detected. The slow discharge comparator output goes
high and enables gate G5 which sets the slow discharge
flip−flop. The VGATE flip−flop resets and the output switch
is turned off. The fault timing capacitor is slowly discharged
to 1.5 V. The CS51033 then enters a normal startup routine.
If the fault is still present when the fault timing capacitor
voltage reaches 2.5 V, the fast and slow discharge cycles
repeat as shown in Figure 3.
If the VFB voltage is above 1.15 V when CS reaches 2.4 V
a fault condition is not detected, normal operation resumes
and CS charges back to 2.6 V. This reduces the chance of
erroneously detecting a load transient as a fault condition.
Startup
The CS51033 has an externally programmable Soft−Start
feature that allows the output voltage to come up slowly,
preventing voltage overshoot on the output.
At startup, the voltage on all pins is zero. As VCC rises, the
VC voltage along with the internal resistor RG keeps the
P−Ch FET off. As VCC and VC continue to rise, the oscillator
capacitor (COSC ) and the Soft−Start/Fault Timing capacitor
(CS) charges via internal current sources. COSC gets charged
by the current source IC and CS gets charged by the IT source
combination described by:
ICS + IT *
IT
I
ǒ55
) TǓ
5
The internal Holdoff Comparator ensures that the external
P−Ch FET is off until VCS > 0.7 V, preventing the GATE
flip−flop (F2) from being set. This allows the oscillator to
reach its operating frequency before enabling the drive
output. Soft−Start is obtained by clamping the VFB
comparator’s (A6) reference input to approximately 1/2 of
the voltage at the CS pin during startup, permitting the
2.6 V
VCS
S2
2.4 V
S2
S1
S3
S3
S1
2.5 V
S2
S1
S3
S3
1.5 V
0V
0V
TSTART
START
td1
NORMAL OPERATION
tFAULT
tRESTART
td2
tFAULT
FAULT
VGATE
1.25 V
1.15 V
VFB
Figure 3. Voltage on Start Capacitor (VGS), the Gate (VGATE), and in the Feedback Loop (VFB),
During Startup, Normal and Fault Conditions
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CS51033
Buck Regulator Operation
and R2 and the reference voltage VREF, the power transistor
Q1 switches on and current flows through the inductor to the
output. The inductor current rises at a rate determined by
(VIN − VOUT)/Load. The duty cycle (or “on” time) for the
CS51033 is limited to 80%. If output voltage remains higher
than nominal during the entire COSC change time, the Q1
does not turn on, skipping the pulse.
A block diagram of a typical buck regulator is shown in
Figure 4. If we assume that the output transistor is initially
off, and the system is in discontinuous operation, the
inductor current IL is zero and the output voltage is at its
nominal value. The current drawn by the load is supplied by
the output capacitor CO. When the voltage across CO drops
below the threshold established by the feedback resistors R1
L
Q1
VIN
R1
CIN
CO
D1
RLOAD
R2
Control
Feedback
Figure 4. Buck Regulator Block Diagram
Charge Pump Circuit
FET turns on, it’s drain voltage will be approximately equal
to VIN. Since the voltage across C1 can not change
instantaneously, D2 is reverse biased and the anode voltage
rises to approximately 2.0 × 3.3 V − VD2. C1 transfers some
of its stored charge C2 via D3. After several cycles there is
sufficient gate drive voltage.
(Refer to the CS51033 Application Diagram on page 2).
An external charge pump circuit is necessary when the VC
input voltage is below 5.0 V to ensure that there is suffifient
gate drive voltage for the external FET. When VIN is applied,
capacitors C1 and C2 will be charged to a diodes drop below
VIN via diodes D2 and D4, respectively. When the P−Ch
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CS51033
APPLICATIONS INFORMATION
DESIGNING A POWER SUPPLY WITH THE CS51033
and the regulator will remain in a continuous conduction
mode for lower values of load current. A smaller inductor
will result in larger ripple current. The core must not saturate
with the maximum expected current, here given by:
Specifications
•
•
•
•
•
VIN = 3.3 V ±10% (i.e. 3.63 V max., 2.97 V min.)
VOUT = 1.5 V ±2.0%
IOUT = 0.3 A to 3.0 A
Output ripple voltage < 33 mV.
FSW = 200 kHz
I
) DI
IMAX + OUT
+ 3.0 A ) 0.6 Ań2.0 + 3.3 A
2.0
4) Output Capacitor
The output capacitor limits the output ripple voltage. The
CS51033 needs a maximum of 15 mV of output ripple for
the feedback comparator to change state. If we assume that
all the inductor ripple current flows through the output
capacitor and that it is an ideal capacitor (i.e. zero ESR), the
minimum capacitance needed to limit the output ripple to
50 mV peak−to−peak is given by:
1) Duty Cycle Estimates
Since the maximum duty cycle D, of the CS51033 is
limited to 80% min., it is best to estimate the duty cycle for
the various input conditions to see that the design will work
over the complete operating range.
The duty cycle for a buck regulator operating in a
continuous conduction mode is given by:
D+
CO +
VOUT ) VD
VIN * VSAT
+
where:
VSAT = RDS(ON) × IOUT Max.
In this case we can assume that VD = 0.6 V and VSAT =
0.6 V so the equation reduces to:
FSW = 200 kHz. The switching frequency is determined
by COSC, whose value is determined by:
ǒ1 * ǒ
Ǔ * ǒ30FSW103Ǔ
FSW
3 106
Ǔ
2
^ 470 pF
0.53 + 2.65 ms
TON(MIN) + 5.0 ms
0.35 + 1.75 ms
ǒ
Pick the inductor value to maintain continuous mode
operation down to 0.3 Amps.
The ripple current DI = 2 × IOUT(MIN) = 2 × 0.3 A = 0.6 A.
LMIN +
DI
(33
10*3 V)
^ 11.4 mF
Ǔ
ǒ
Ǔ
The input bias current to the comparator is 4.0 mA. The
resistor divider current should be considerably higher than
this to ensure that there is sufficient bias current. If we
choose the divider current to be at least 250 times the bias
current this gives a divider current of 1.0 mA and simplifies
the calculations.
3) Inductor Selection
TOFF(MAX)
0.6 A
103 Hz)
VOUT + 1.25 V R1 ) R2 + 1.25 V R1 ) 1.0
R2
R2
TOFF(MAX) + 5.0 ms * 0.7 ms + 4.3 ms
VOUT ) VD
(200
5) VFB Divider
T + 1.0 + 5.0 ms
FSW
TON(MAX) + 5.0 ms
8.0
The output capacitor should be chosen so that its ESR is
at least half of the calculated value and the capacitance is at
least ten times the calculated value. It is often advisable to
use several capacitors in parallel to reduce ESR.
Low impedance aluminum electrolytic, tantalum or
organic semiconductor capacitors are a good choice for an
output capacitor. Low impedance aluminum are the
cheapest but are not available in surface mount at present.
Solid tantalum chip capacitors are available from a number
of suppliers and offer the best choice for surface mount
applications. The capacitor working voltage should be
greater than the output voltage in all cases.
2) Switching Frequency and On and Off Time
Calculations
FSW
DV
*3
ESR + DV + 50 10
+ 55 mW
DI
0.6 A
From this, the maximum duty cycle DMAX is 53%, this
occurs when VIN is at it’s minimum while the minimum duty
cycle DMIN is 0.35%.
95
DI
FSW
The minimum ESR needed to limit the output voltage
ripple to 50 mV peak−to−peak is:
V
D + OUT
VIN
COSC +
8.0
1.5 V + R1 ) R2 + 1.5 kW
1.0 mA
Let R2 = 1.0 k
Rearranging the divider equation gives:
2.1 V 4.3 ms
+
^ 15 mH
0.6 A
OUT * 1.0Ǔ + 1.0 kWǒ1.5 VǓ + 200 W
ǒV1.25
1.25
R1 + R2
The CS51033 will operate with almost any value of
inductor. With larger inductors the ripple current is reduced
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CS51033
6) Divider Bypass Capacitor CRR
The fast discharge time occurs when a fault is first
detected. The CS capacitor is discharged from 2.5 V to 2.4 V.
Since the feedback resistors divide the output voltage by
a factor of 4.0, i.e. 5.0 V/1.25 V= 4.0, it follows that the
output ripple is also divided by four. This would require that
the output ripple be at least 60 mV (4.0 × 15 mV) to trip the
feedback comparator. We use a capacitor CRR to act as an
AC short so that the output ripple is not attenuated by the
divider network. The ripple voltage frequency is equal to the
switching frequency so we choose CRR so that:
where IFASTDISCHARGE is 66 mA typical.
TFASTDISCHARGE + CS
TCHARGE +
is negligible at the switching frequency.
In this case FSW is 200 kHz if we allow XC = 3.0 W then:
TCHARGE + CS
TFAULT + CS
CS performs several important functions. First it provides
a dead time for load transients so that the IC does not enter
a fault mode every time the load changes abruptly. Secondly
it disables the fault circuitry during startup, it also provides
Soft−Start by clamping the reference voltage during startup
to rise slowly and finally it controls the hiccup short circuit
protection circuitry. This function reduces the P−Ch FET’s
duty cycle to 2.0% of the CS period.
The most important consideration in calculating CS is that
it’s voltage does not reach 2.5 V (the voltage at which the
fault detect circuitry is enabled) before VFB reaches 1.15 V
otherwise the power supply will never start.
If the VFB pin reaches 1.15 V, the fault timing comparator
will discharge CS and the supply will not start. For the VFB
voltage to reach 1.15 V the output voltage must be at least
4 × 1.15 = 4.6 V.
If we choose an arbitrary startup time of 200 ms, we
calculate the value of CS from:
(3787 ) 1515 ) 1.5
TFAULT + CS
TFAULT + 0.1
105)
10*6
1.55
105 + 0.0155
A larger value of CS will increase the fault time out time
but will also increase the Soft−Start time.
8) Input Capacitor
The input capacitor reduces the peak currents drawn from
the input supply and reduces the noise and ripple voltage on
the VCC and VC pins. This capacitor must also ensure that
the VCC remains above the UVLO voltage in the event of an
output short circuit. CIN should be a low ESR capacitor of
at least 100 mF. A ceramic surface mount capacitor should
also be connected between VCC and ground to prevent
spikes.
9) MOSFET Selection
The CS51033 drives a P−Channel MOSFET. The VGATE
pin swings from GND to VC. The type of P−Ch FET used
depends on the operating conditions but for input voltages
below 7.0 V a logic level FET should be used.
Choose a P−Ch FET with a continuous drain current (ID)
rating greater than the maximum output current. RDS(ON)
should be less than
200 ms 264 mA
+ 0.02 mF
2.5 V
Use 0.1 mF.
The fault time out time is the sum of the slow discharge
time the fast discharge time and the recharge time and is
obviously dominated by the slow discharge time.
The first parameter is the slow discharge time, it is the time
for the CS capacitor to discharge from 2.4 V to 1.5 V and is
given by:
RDS t+
I
0.6 V
167 mW
OUT(MAX)
The Gate−to−Source voltage VGS and the
Drain−to−Source Breakdown Voltage should be chosen
based on the input supply voltage.
The power dissipation due to the conduction losses is
given by:
(2.4 V * 1.5 V)
IDISCHARGE
where IDISCHARGE is 6.0 mA typical.
PD + IOUT2
1.5 V
(1.55
105)
For this circuit
T + CS 2.5 V
ICHARGE
TSLOWDISCHARGE + CS
3787
The fault time out time is given by:
7) Soft−Start and Fault Timing Capacitor CS
CS
(2.5 V * 1.5 V)
ICHARGE
CS
where ICHARGE is 264 mA typical.
C + 1.0 ^ 0.265 mF
2pf3
TSLOWDISCHARGE +
1515
The recharge time is the time for CS to charge from 1.5 V
to 2.5 V.
XC + 1.0
2pfC
CS(MIN) +
CS (2.5 V * 2.4 V)
IFASTDISCHARGE
TFASTDISCHARGE +
105
RDS(ON)
D
The power dissipation due to the switching losses is given
by:
PD + 0.5
VIN
IOUT
(TRr ) TF)
where TR = Rise Time and TF = Fall Time.
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FSW
CS51033
10) Diode Selection
maximum output current. The breakdown voltage should be
at least 20 V for this 12 V application.
The diode power dissipation is given by:
The flyback or catch diode should be a Schottky diode
because of it’s fast switching ability and low forward voltage
drop. The current rating must be at least equal to the
PD + IOUT
VD
(1.0 * DMIN)
ORDERING INFORMATION
Device
Operating
Temperature Range
CS51033YD8
CS51033YD8G
CS51033YDR8
−40°C < TA < 85°C
CS51033YDR8G
CS51033GD8
CS51033GD8G
CS51033GDR8
0°C < TA < 70°C
CS51033GDR8G
Package
Shipping †
SOIC−8
98 Units / Rail
SOIC−8
(Pb−Free)
98 Units / Rail
SOIC−8
2500 Tape & Reel
SOIC−8
(Pb−Free)
2500 Tape & Reel
SOIC−8
98 Units / Rail
SOIC−8
(Pb−Free)
98 Units / Rail
SOIC−8
2500 Tape & Reel
SOIC−8
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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CS51033
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AG
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−X−
A
8
5
0.25 (0.010)
S
B
1
M
Y
M
4
K
−Y−
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
M
D
0.25 (0.010)
M
Z Y
S
X
J
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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